Alps Alpine?s Digital Air- and Water-Pressure Sensor is Waterproof

By Rich Nass

Contributing Editor

Embedded Computing Design

September 06, 2019

News

Alps Alpine?s Digital Air- and Water-Pressure Sensor is Waterproof

Alps Alpine started mass-producing the HSPPAD143A Waterproof Digital Pressure Sensor, targeting applications in wearable devices and IoT equipment.

Alps Alpine started mass-producing the HSPPAD143A Waterproof Digital Pressure Sensor, targeting applications in wearable devices and IoT equipment. According to the latest data from the Worldwide Quarterly Wearable Device Tracker released by IT research firm IDC Japan, the wearable devices market is expected to grow more than 10 percent on average each year between 2019 and 2022.

The HSPPAD143A has a pressure measurement range from 300hPa to 2100hPa, and has a water-resistant design to work in both low-pressure environments at altitudes up to 9,000 meters and high-pressure conditions down to 10 meters underwater, allowing measurement in both open air and water with a single sensor. The HSPPAD143A also houses a dedicated, fully customized application-specific integrated circuit (ASIC) to realize a current consumption of 1.8μA in low-power mode.

The sensor has built-in FIFO* memory, and it can be used in combination with a ready-made O-ring to simplify end-product design. As a result, the sensor can be used for a wide variety of purposes not restricted to wearable products or applications like pressure measurement in gas meters.

Learn more www.alpsalpine.com.

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

Podcast/Interview Coverage

Sonatus The Garage Podcast

onalytica Interview

Dev Talk with Rich and Vin

Embedded Executive Podcast

Semiconscious Webcast

IEEE Awards Frede Blaabjerg Talks EVS

Atmosic: Embedded Executive: Energy Harvesting Podcast

 

Article Coverage

Embedded AI Isn’t Enterprise AI, and That’s a Good Thing

Tear Down: Google Pixel Watch 4

Protect Your Home from Thieves and Floods

Advantech Teams With AMD To Maximize Performance at the Edge

Tear Down: Noise Luna Ring

 

View additional information

Muck Rack

More from Rich