Infineon Expands Supplier Base for Silicon Carbide Wafers, Supply Agreement Signed with US-Based II-VI Incorporated

By Tiera Oliver

Associate Editor

Embedded Computing Design

August 26, 2022


Infineon Expands Supplier Base for Silicon Carbide Wafers, Supply Agreement Signed with US-Based II-VI Incorporated

Infineon Technologies AG and II-VI Incorporated have signed a multi-year supply agreement for silicon carbide (SiC) wafers. The German-based semiconductor manufacturer is securing further access to this strategic semiconductor material to meet the increase in customer demand in this area.

The agreement also supports Infineon's multi-sourcing strategy and increases its supply chain resilience. The first deliveries have already taken place.

SiC is a compound of silicon and carbon that enables efficient and robust power semiconductors with a cost-benefit at the system level. The CoolSiC™ brand from Infineon part of the industry's portfolio for industrial power semiconductor applications. In addition to photovoltaic converters and industrial power supplies, the advantages of SiC are also evident in the field of e-mobility. SiC power semiconductors are used in the main inverters for e-vehicle drive trains, in onboard battery charging units, and in charging infrastructures. The material meets quality standards for industrial and automotive applications. As strategic partners, II-VI and Infineon are also collaborating in the transition to 200mm SiC diameter wafers.

“SiC compound semiconductors set new standards in power density and efficiency. We are leveraging them to deliver on our strategy of decarbonization and digitalization,” said Angelique van der Burg, Chief Procurement Officer at Infineon. “Infineon is increasing investments in its SiC manufacturing capacity to meet the rapidly growing demand from our customers. We are pleased to add II-VI to our strategic supplier base and grow our business together.”

Infineon expects its SiC semiconductor sales to grow by more than 60 percent on average per year, reaching approximately $1 billion by mid-decade. For the second half of the decade, Infineon expects on-going growth momentum, for which it invests in its recently announced additional manufacturing block in Kulim, Malaysia.

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Tiera Oliver, Associate Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

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