Lenovo Reveals New ThinkEdge Portfolio of Embedded Computers

By Tiera Oliver

Associate Editor

Embedded Computing Design

March 04, 2021


Lenovo Reveals New ThinkEdge Portfolio of Embedded Computers

Lenovo announced its all new portfolio of embedded computers for the edge during the Embedded World 2021 DIGITAL virtual exhibition.

Building from the existing edge portfolio from Lenovo, the ThinkEdge devices – the new ThinkEdge SE30 and ThinkEdge SE50 – are designed to meet the needs of enterprise data processing, security, and scalability at the edge. 

The new ThinkEdge SE30 is a small and rugged compute device for edge workloads. It includes the latest 11th Gen Intel® Core i5 vPro processors for industrial computing. Per the company, the processor improves compute power, accelerates AI workloads, and is built for the challenges of edge implementations in enterprise with extended temperature support from -20 to +60 Celsius.

The ThinkEdge SE30 will start with 4G support globally and have 5G availability with key carrier support in the second half of this year. 

Embedded applications for the ThinkEdge SE30 include kiosks and ATMs for smart retail, automated production lines in manufacturing, and medical device monitoring in healthcare, among others. 

Key Features / Specs: 

  • 1th Gen Intel® Core™ i5 vPro® processors for industrial computing 
  • Up to 16GB memory and 1TB storage 
  • Fan-less, operational temperature range of -20 to 60 Celsius 
  • Both 4G 1 and 5G 1 modules 

ThinkEdge SE30

The new ThinkEdge SE50 is designed for versatile applications that require high analytics and data processing at the edge. The embedded edge compute device includes an Intel Core i5 or i7 vPro processor for industrial computing and up to 32GB of memory. 

End users can deploy the ThinkEdge SE50 to aggregate and analyze real-time data from distributed IoT devices. This smart edge device can filter and forward IoT data across the WAN to the cloud or data center. Customers have the option to enhance their edge AI strategy with cutting edge silicon and optimized software leveraging the OpenVINO toolkit. 

Key Features / Specs: 

  • 11th Generation Intel® Core™ i7 or i5 vPro® processors for industrial computing 
  • 32GB memory and up to 2TB storage
  • Fan-less, operational temperature range of 0 to 50 degree Celsius, and IP50 rating 
  • 2-liter design with full industrial I/O 

ThinkEdge SE50 

The Lenovo ThinkEdge SE30 and SE50 will be available in select markets worldwide starting mid-2021.

For more information, visit: https://www.lenovo.com

Tiera Oliver, Associate Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

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