New Lattice CertusPro-NX FPGAs Offer the Size, Power, and Speed Needed for Edge Applications

By Rich Nass

Contributing Editor

Embedded Computing Design

June 28, 2021

Story

Lower power and higher bandwidth are the key characteristics needed for Edge-based processing. And those are the principles that Lattice’s CertusPro-NX general-purpose FPGA family are built upon. These devices increase the logic density over what was previously offered to up to 100k logic cells.

As the fourth device family based on the company’s Nexus platform, CertusPro-NX adds small form factor (81 mm2) and support for LPDDR4 external memory to its impressive list of features. Most of the competitive devices can offer some, but not all, of these features.

Target applications include data co-processing in intelligent systems, high-bandwidth signal bridging in 5G communications infrastructure, and sensor interface bridging in ADAS systems. More broadly, the applications covered include automotive, industrial, and communications.

The FPGAs’ power efficiency stems from the use of a low power FD-SOI manufacturing process combined with some innovations made in the FPGA fabric architecture. With support for up to eight programmable SERDES lanes capable of speeds up to 10.3 Gbits/s, CertusPro-NX FPGAs deliver the system bandwidth to enable popular communication and display interfaces like 10 Gigabit Ethernet, PCI Express, SLVS-EC, CoaXPress, and DisplayPort.

CertusPro-NX, which is currently sampling, is compatible with the latest version of the Lattice Radiant design software.
 

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

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