OmniVision Launches Automotive SoC for Entry-Level Rearview Cameras

By Tiera Oliver

Assistant Managing Editor

Embedded Computing Design

May 05, 2020

News

In combination with Onscreen Display Overlays, Curve Distortion Correction, 120dB HDR and Low Noise, Single-Chip Image Sensor and Signal Processor Enables Image Quality and Small Modules.

OmniVision Technologies, Inc. announced the OX01E10 SoC designed to provide automotive designers with imaging performance for entry-level rearview cameras (RVC). The OX01E10’s image sensor is built on the PureCel Plus pixel architecture.

This SoC provides 1.3 megapixel (MP) resolution and a 1340x1020 array size at 30 fps. It also enables output flexibility with both 2-lane MIPI and 10-bit DVP interfaces. In a single, 1/4” optical format package, the OX01E10 integrates a 3 micron image sensor and an advanced image signal processor (ISP). According to the company, the SoC enables designers to achieve a small form factor with low-light performance, ultra-low power, and reduced cost while improving reliability by using only one printed circuit board (PCB). 

The OX01E10 provides two onscreen display overlay layers for driver guidelines, as well as distortion correction to straighten any curved edges from lenses with a wide viewing angle.

According to the company, the OX01E10 features power consumption that is over 35% lower than competitors’ and reduces temperature. This imaging device is for entry-level RVC and does not require a metal heat sink, allowing for the use of plastic camera module bodies. With its compact package size, it also enables smaller cameras that can fit in much tighter spaces.

OmniVision’s dual conversion gain (DCG) technology is employed in this SoC to achieve a dynamic range (HDR) of 120dB with only two captures. Its integrated ISP further enables ideal image quality with a number of advanced features, such as lens chromatic aberration correction and advanced noise reduction and local tone mapping

The OX01E10 SoC is AEC-Q100 Grade 2 certified and samples are available now.

For more information, visit: https://www.ovt.com/

Tiera Oliver is the assistant managing editor at Embedded Computing Design. She is responsible for web content editing, product news, and story development. She also manages, edits, and develops content for ECD podcasts, including Embedded Insiders.

She utilizes her expertise in journalism and content management to oversee editorial content, coordinate with editors, and ensure high-quality output across web, print, and multimedia platforms. She manages diverse projects, assists in the production of digital magazines, and hosts company podcasts by conducting in-depth interviews with industry leaders to deliver engaging and insightful discussions.

Tiera attended Northern Arizona University, where she received her bachelor's in journalism and political science. She was also a news reporter for the student-led newspaper, The Lumberjack. 

More from Tiera