OSD3358-512M-ISM, provides a tiny 21mm x 21mm 256 ball BGA System-in-Package with full industrial temperature range

Austin, TX (July 17, 2018) - Octavo Systems LLC (Octavo), the expert in System-In-Package (SiP) for mass-market applications, today announced availability of the smallest system ready for Industrial applications with a temperature rating of -40°C to 85°C case.

The OSD3358-512M-ISM, provides OEM and system developers with the tiny 21mm x 21mm 256 ball BGA package of the OSD335x-SM with the added benefit of full industrial temperature range. The OSD335x-SM Industrial integrates the powerful 1GHz ARM® Cortex®-A8 Sitara™ processor from Texas Instruments, DDR3 memory, 2 power supplies, EEPROM and over 100 passives into a single, robust package. This integration removes the need for complicated DDR Routing and power sequencing, speeding up the design cycle. Applications ranging from Industrial Control and Building Automation to Industrial Internet of Things (IIoT) Sensor Systems will be able to take advantage of the tight integration, simplified design steps and reduced manufacturing costs that commercial customers of the OSD335x-SM utilize today.

The Industrial rated version of the OSD335x-SM is footprint and software compatible with the established Commercial version. This means all existing reference designs and development tools already support the new OSD335x-SM Industrial device. This allows a design using the commercial version to be easily upgraded to an industrial rating with a simple BoM change.

Utilizing a SiP makes it easier to design small form factor applications in the IoT world with no routing for DDR memory and power management needed. The BGA design can reduce PCB layers, lowering cost and speeding time to market. Implementation is 60% smaller than using discrete components. Development boards with the OSD335x-SM System-in-Package are in stock today for as low as $25.

Octavo Systems System-in-Package devices are in stock today through distribution partners, Mouser and Digi-Key. To find out more about the OSD335x-SM visit:

octavosystems.com/octavo_products/osd335x-sm/

For more information, please contact Octavo Systems at [email protected]

Company Background

• Octavo Systems builds highly integrated systems building blocks utilizing System-in-Package (SiP) technology. Octavo strives to make electronics easier and more accessible by abstracting away the tedious complexities that go along with designing an electronic system. Octavo’s products integrate popular standardized systems, which can be utilized in a wide variety of applications, into easy to use packages.

• Four senior semiconductor technology leaders, all of whom had been associated with Texas Instruments, founded Octavo Systems in 2013.