WIN Enterprises Announces 2U HPC with Intel Skylake-SP/Cascade Lake-SP processor, DDR4, 8 PCIe X8 slot and Redundant PSU

Tiera Oliver

January 30, 2020

Nordic Ambient Temperature-Qualified Bluetooth 5.1 SoC

Tiera Oliver

January 30, 2020

Flex Power Modules and Digi-Key Sign Global Partnership

Flex Power

Digi-Key

January 29, 2020

Mini ITX Board for Intel? Core processors of the 9th and 8th generation

ICP Germany

January 28, 2020

MASTECS Project: Enabling the use of Multicore Processors in Automotive Domains

MASTECS

Barcelona Supercomputing Center

January 28, 2020

How Wireless Tech is Changing Predictive Maintenance

Alf Helge

January 28, 2020

TYAN Launches AMD EPYC? 7002 Series Processor-Based HPC and Storage Server Platforms at SC19

Tyan

AMD

January 28, 2020

Nordic Semiconductor samples nRF21540 RF Front End Module

Tiera Oliver

January 28, 2020

Miele to use Security Chips from G+D Mobile Security

Perry Cohen

January 27, 2020

STMicroelectronics, Fieldscale Bring Touch Controls to STM32-Based Devices

Rich Nass

January 27, 2020

Advanced Embedded Systems Drive Next-Generation Automotive Applications

Alix Paultre

January 27, 2020

Dev Kit Weekly: Renesas EK-RA6M3G Graphics Evaluation Kit

Brandon Lewis

January 24, 2020

Allied Vision Introduces Alvium USB3 Vision Camera with NIR Sensitivity

Tiera Oliver

January 23, 2020

Environmental Asset Tracker Combines Cellular IoT and Bluetooth with a Five-Year Battery Life

Tiera Oliver

January 23, 2020

Nordic Semiconductor Launches new Bluetooth LE Audio Evaluation Platform

Tiera Oliver

January 23, 2020

Google, Murata Integrate Coral Edge TPU in Tiny AI Module

Brandon Lewis

January 23, 2020

Open Standards for Accelerating Embedded Vision and Inferencing: An Industry Overview

Neil Trevett

January 23, 2020

ACEINNA Launches OpenRTK330L, GNSS/INS Localization Solution with Open Navigation Platform Support

Tiera Oliver

January 23, 2020

Allied Vision Alvium Camera Series and Goldeye SWIR

Tiera Oliver

January 23, 2020

Greene Tweed's Arlon 3000 XT Polymer Enables High-temperature Performance in Electronics

Alix Paultre

January 22, 2020

Bressner to Present Hardware for Trend Topics at Embedded World 2020

Bressner

January 21, 2020

BRESSNER Technology at embedded world 2020 in Nuremberg. Booth number: 1-341.

Winmate Unveils 7" Rugged Arm-Based Tablet M700DQ8 with Qualcomm Snapdragon? Processor

Winmate Inc.

January 21, 2020

Ideal for field data capture in nearly any industry and application.

Challenges in the development of an industrial PC based on COM

January 21, 2020

VadaTech Announces 1,344Gb/s Fiber FMC+ Module

VadaTech, Inc.

January 21, 2020

VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the FMC259.