Environmental Asset Tracker Combines Cellular IoT and Bluetooth with a Five-Year Battery Life

Tiera Oliver

January 23, 2020

Nordic Semiconductor Launches new Bluetooth LE Audio Evaluation Platform

Tiera Oliver

January 23, 2020

Google, Murata Integrate Coral Edge TPU in Tiny AI Module

Brandon Lewis

January 23, 2020

Open Standards for Accelerating Embedded Vision and Inferencing: An Industry Overview

Neil Trevett

January 23, 2020

ACEINNA Launches OpenRTK330L, GNSS/INS Localization Solution with Open Navigation Platform Support

Tiera Oliver

January 23, 2020

Allied Vision Alvium Camera Series and Goldeye SWIR

Tiera Oliver

January 23, 2020

Greene Tweed's Arlon 3000 XT Polymer Enables High-temperature Performance in Electronics

Alix Paultre

January 22, 2020

Bressner to Present Hardware for Trend Topics at Embedded World 2020

Bressner

January 21, 2020

BRESSNER Technology at embedded world 2020 in Nuremberg. Booth number: 1-341.

Winmate Unveils 7" Rugged Arm-Based Tablet M700DQ8 with Qualcomm Snapdragon? Processor

Winmate Inc.

January 21, 2020

Ideal for field data capture in nearly any industry and application.

Challenges in the development of an industrial PC based on COM

January 21, 2020

VadaTech Announces 1,344Gb/s Fiber FMC+ Module

VadaTech, Inc.

January 21, 2020

VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the FMC259.

Newark Helps Students Across the Globe With micro:bit How-to Videos

Alix Paultre

January 20, 2020

MYIR Introduces $29 ARM SoM Powered by ST STM32MP1

Tiera Oliver

January 16, 2020

Synaptics Launches New TD7850 Automotive TDDI Solution for Touchscreens up to 15 inches

Tiera Oliver

January 16, 2020

STMicroelectronics Combines STM32 MCU and LoRa Transceiver on One SoC

Rich Nass

January 15, 2020

Analog Devices to Show Advanced Audio Solutions at ISE 2020

Alix Paultre

January 15, 2020

Atmosic, Tonly Develop Ultra-Energy-Efficient BLE Module for Battery-Powered Devices

Brandon Lewis

January 13, 2020

D3 Engineering Launches Automotive Vision Development Kit Based on TI TDA4VM SoC

Brandon Lewis

January 10, 2020

COM-HPC: Limitless High-Speed Scalability

Christian Eder

January 10, 2020

Renesas Electronics Simplifies Power Supply Design for Automotive Surround View Camera Systems

Tiera Oliver

January 9, 2020

Renesas Electronics' High-Efficiency Power Management IC Adopted in Google Coral AI Products

Perry Cohen

January 8, 2020

VersaLogic Releases Dual Channel CAN Bus Expansion Module in Mini PCIe Format

Tiera Oliver

January 8, 2020

NXP Debuts i.MX Applications Processor with Neural Processing Unit for Advanced Machine Learning

Tiera Oliver

January 7, 2020

NXP Unlocks Vehicle Data with the S32G Automotive Network Processors

Tiera Oliver

January 7, 2020