From the Idea to the Product: HEITEC Demonstrates its Complete Range of Services Based on Six Selected Steps of Product Development
February 25, 2020
Worldwide premiere of the new product HeiSys - an embedded system platform - robust, modular, multi-dimensionally scalable, for use e.g. as gateway device for IoT or various, also mobile applications.
Also, expansion of the HEITEC standard housing technology portfolio, versatile VPX system platforms, in both 19-inch and rugged form factor
At embedded world 2020 (hall 1, booth 340), HEITEC will be presenting its development expertise in six selected steps for board and system solutions. As a representative example of its design know-how, the company will show its embedded system platform HeiSys, which can be used, among others, as a universal gateway or as an edge computer, especially for IoT and mobile applications. The modularity of this system platform enables customers to implement applications with intensive data processing quickly, flexibly, fail-safe and without great effort. HEITEC will also be presenting its latest VPX system platforms, which, on one hand, have been developed as an optimized extension to the existing portfolio and on the other hand for use in harsh environments. In addition, there will be no shortage of news in terms of corporate strategy and expansion plans.
In six selected steps from the idea to the product
The product development process is illustrated by the following six steps:
- Hardware development
- Software development
- Printed Circuit Board Assembly (PCBA)
- Housing technology
- System integration
The various aspects of each phase are explained in detail using both, process-specific videos and physical exhibits. Customers can take advantage of complete services from a single source or individual services. Product development: Embedded system platform - HeiSys as an ideal basis for IoT applications and mobile use. A representative example of complex design performance is the robust HeiSys system platform developed by HEITEC. During the development of HeiSys, the six steps described above were thoroughly followed through to complete system integration. This new product, which is multi-dimensionally scalable and modular in design, providing customers with a very good basis for the rapid implementation of their application, can be used, inter alia, as a gateway or box PC. By using standardized processor and I/O modules, the system can be scaled to the desired computing power and expanded by the required communication interfaces. With the approval according to EN50155, HeiSys is also certified for mobile use as a rolling stock.
Housing technology: New VPX system platforms
HEITEC's range of standard products and system platforms forms the immediately available hardware basis for almost any desired solution, from prototyping up to fully integrated systems. Newcomers are two VPX system platforms of different form factors, which will be presented at the booth. Thanks to their modularity, the demonstrators can be adapted quickly and cost-effectively to customer-specific requirements. In addition to 19-inch components, subracks, desktop and system cases as well as system platforms - based on various standards such as CompactPCI, CompactPCI Serial, VME/VPX and xTCA - the focus will be on derivatives and customer-specific designs. A further focus is on the increasingly important topics of EMC, heat dissipation and reliability.
Live act at the booth
Every 30 minutes the motto "From the idea to the product" and the product development process behind it will be visualized live at the HEITEC booth.
A central corporate objective is to expand the company's presence, particularly in Asia. HEITEC will present news about this and about its strategy in this region.
HALL 1 / BOOTH 340
For more information, visit: www.heitec.de/en