Exascend’s AS500 BGA SSD Shifts Autonomous Vehicles into the Next-Generation

By Chad Cox

Production Editor

Embedded Computing Design

May 16, 2024


Exascend’s AS500 BGA SSD Shifts Autonomous Vehicles into the Next-Generation
Image Credit: Exascend

Taipei, Taiwan. Exascend introduced its soldered DRAM-less AS500 series NVMe Ball Grid Array solid state drive (BGA SSD) designed to meet demanding data storage needs of next generation connected autonomous vehicles in rugged environments. The solution supports an operating temperature of -40°C to +105°C with shock and vibration control utilizing Exascend's proprietary Adaptive Thermal Control algorithm.

The AS500 leverages Host Memory Buffer (HMB) technology to enhance I/O functions without SSD onboard DRAM, easing storage capacity within embedded systems while delivering a power consumption under 3.5W.

Leveraging built-in SR-IOV support for up to four virtual machines, the AS500 manages multiple in-vehicle application with Its PCIe Gen4 interface and NVMe 1.4 protocol supplying read/write speeds up to 5000/1600 MB/s and random 4K read/write speeds up to 380K/180K IOPS in HMB mode.

Available up to 1TB capacities, the AS500 is ideal for in-vehicle infotainment, navigation, digital cockpit, black box, and ADAS.

Exascend will showcase the AS500 BGA SSD at the upcoming ADAS & Autonomous Vehicle Technology Expo, June 4-6 in Stuttgart, Germany at booth 6320.

For more information, visit exascend.com.

Editor’s Note: The AS500 is currently undergoing AEC-Q100 Grade 2 qualification to meet rigorous automotive reliability standards.

Chad Cox. Production Editor, Embedded Computing Design, has responsibilities that include handling the news cycle, newsletters, social media, and advertising. Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature.

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