G.SKILL DDR4 Memory Achieves DDR4-5886 & 23 Overclocking Records During Computex 2019

G.SKILL International Enterprise Co., Ltd.

June 17, 2019

Renesas Launches Low-Power Technology for Embedded Flash Memory Based on SOTB Process

Laura Dolan

June 13, 2019

Everspin 1 Gb STT-MRAM with DDR4 Interfaces Now in Pilot Production

Brandon Lewis

June 13, 2019

Renesas Releases 28 nm Flash Memory Technology

Laura Dolan

June 12, 2019

Micron's Automotive-Grade UFS Portfolio Provides Immersive Cabin Experience in Connected Vehicles

Laura Dolan

June 12, 2019

Toshiba's Advanced Image Recognition Processor Helps Toyota Alphard/Vellfire Win Safety Performance Award

Laura Dolan

June 11, 2019

Entrust Datacard Acquires Thales' nCipher Security HSM Portfolio

Brandon Lewis

June 11, 2019

Memory Card Standards Migrate Toward High Speed PCI Express

Gibson Ming-Dar

June 11, 2019

Increasing Storage Requirements Drives More NAND into Automotive Designs

Laura Dolan

June 4, 2019

Rugged SD Cards Made to Withstand Shock, Vibration, Write Cycles

James Bou

June 3, 2019

STMicro's STM32G4 Microcontrollers Address Next-Gen Digital Power Apps

Alix Paultre

June 3, 2019

MagnaChip?s Second Generation 0.13-micron Embedded Flash Technology Now Available

Laura Dolan

May 30, 2019

Renesas Releases RX23E-A Group

Laura Dolan

May 30, 2019

Toshiba's ARM Cortex-M4-Based Microcontrollers Deliver High-Speed Data Processing

Alix Paultre

May 30, 2019

ICP Germany Develops Industrial 3D NAND SSD

May 30, 2019

SmartDV Appoints HyperSilicon Exclusive Sales Representative in China

SmartDV? Technologies

May 22, 2019

ESD Alliance CEO Outlook 2019: eSilicon CEO Jack Harding to Participate

eSilicon

May 20, 2019

Arm Debuts eMRAM IoT test chip with Samsung, Cadence

May 15, 2019

How to Remotely Reset Your Serial SPI Memory Device, and Why

Paul Hill

May 8, 2019

eSilicon Expands Technical Advisory Board

eSilicon

May 7, 2019

Hyperstone NAND Flash Use Case Tracker Optimizes Memory Configuration, Management

May 6, 2019

A Resilient Error Correction Scheme for 3D TLC NAND

Gibson Ming-Dar

May 6, 2019

GOWIN Adopts HyperBus Interface for Internal PSRAM, External HyperRAM

Brandon Lewis

May 4, 2019

HyperBus provides efficient use of package pins for high-speed interfacing with low pin count external memories, as well as internal PSRAM on GOWIN programmable devices.

eSilicon Completes Tapeout of 7nm 400G Gearbox/Retimer Test ASIC

Brandon Lewis

May 3, 2019