Infineon and Honda Collaborate on Automotive Semiconductor Solutions
February 01, 2024
News
Munich, Germany and Tokyo, Japan –Infineon and Honda Motor Co., Ltd. have signed a Memorandum of Understanding (MoU) to build a strategic collaboration and align future product and technology roadmaps.
Both companies also agreed to continue discussions on supply stability, as well as to encourage transferring mutual knowledge and collaborate on projects aimed at accelerating the time to market of technologies.
Infineon will further support Honda with technologies to enable competitive and advanced vehicles. The technical support will focus on power semiconductors, Advanced Driver Assistance Systems (ADAS), and E/E architectures, where both parties will collaborate on new architecture concepts.
“Infineon’s system understanding, our broad product portfolio and outstanding quality have made us an appreciated partner to Japan’s automotive industry,” said Peter Schiefer, President of the Automotive Division at Infineon. “We are honored to be the semiconductor partner for a strategic collaboration with Honda. Intensifying a long-standing partnership even further is always a confirmation of the added value created and at the same time an expression of the trust in contributing to future successes.”
For more information, visit: www.infineon.com
Tiera Oliver, Assistant Managing Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She develops content and constructs ECD podcasts, such as Embedded Insiders. Before working at ECD, Tiera graduated from Northern Arizona University, where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student-led newspaper, The Lumberjack.
