Embedded Computing Design

Application - Consumer - Page 19

Image Provided by KIOXIA
KIOXIA Advances Development of UFS Ver. 3.1 Embedded Flash Memory Devices with QLC-Technology

KIOXIA

January 27, 2022

Consumer
TDK Creates a Recycling System for PET Films

Chad Cox

February 1, 2022

Unlocking Next-Gen Performance for Portable Consoles

Kristof Beets

February 1, 2022

Novelda’s Tiny UWB Sensor Can Detect Human Presence with Little Power

Rich Nass

January 31, 2022

TDK Expands SmartSound Family of Performance MEMS Microphones

Tiera Oliver

January 28, 2022

Do You Need $30 Wire Cutters? Or are $2 Snips OK?

Jeremy S. Cook

January 27, 2022

Toshiba Announces New High-Voltage Laboratory in Germany

Toshiba Electronics Europe GmbH

January 27, 2022

Image Provided by Renesas Electronics Corporation
Renesas Ships 1 Billionth Device from RX Family of 32-bit Microcontrollers

Renesas Electronics Corporation

January 27, 2022

TP-Link Features Tapo Smart Home Products

Saumitra Jagdale

January 25, 2022

Designing Multimedia Solutions Using Cloud Custom IP-Based Solution Services

Prathamesh Ghodke

January 21, 2022

Entering the Metaverse and How Shortages Impact Engineers on the Street

Embedded Computing Design Staff

January 20, 2022

Magnachip Introduces New Gen LV MOSFET for Battery Protection Circuit Modules in Smartphones

Taryn Engmark

January 20, 2022

Don’t Let Storage Be an Afterthought in Designing for IoT, the Metaverse, and Automotive

Yaniv Iarovici

January 17, 2022

Magnachip Launches New Generation of High-Voltage 600V SJ MOSFETs for Consumer Products and Industrial Applications

Tiera Oliver

January 14, 2022

Image Courtesy of ACEINNA
ACEINNA Launches High Power, 65 amp Current Sensor

ACEINNA

January 13, 2022

Veea’s Smart Hub Adds Wi-Fi 6 Mesh Router Technology

Rich Nass

January 11, 2022

Infineon Announces Start of Production of New CO2 Sensors, Providing Innovative Solution for the Growing Demand for Accurate Indoor Air Quality

Infineon

January 6, 2022

Infineon Introduces the AIROC™ CYW20829 Bluetooth® LE System on Chip

Taryn Engmark

January 6, 2022

Top 5 Microcontroller Development Boards of 2021

Saumitra Jagdale

January 6, 2022

Image Courtesy of Movandi
5G mmWave Phased Array Antenna Modules from Movandi and Doosan

Chad Cox

January 5, 2022

Photo Courtesy of Guide Sensmart
Guide Sensmart Releases Consumer Grade Autofocus Thermal Camera for Smartphones

Chad Cox

January 5, 2022

CY Vision Launches AR Technology for Windshields for Next-Generation Vehicles at CES 2022

Taryn Engmark

January 5, 2022

Photo Courtesy of GAF Energy
GAF Energy Announces Timberline Solar: Combines Solar and Traditional Roofing Installation and Materials

Chad Cox

January 5, 2022

Image Courtesy of Arbe Robotics
Free Space Mapping Now On Arbe Robotics' Imaging Radar Perception Stack

Chad Cox

January 5, 2022

Photo Courtesy of the Company
Panasonic Partners With Totem USA for First UL-Certified eBike in U.S. Markets

Chad Cox

January 5, 2022

NXP Advances IoT Connectivity with Industry’s First Secure Tri-Radio Device

Taryn Engmark

January 4, 2022

CEVA Bluebud™ Platform Takes Center Stage for a Differentiated Wireless Audio Experience

Taryn Engmark

January 4, 2022

MicroEJ and Baracoda Integrate MICROEJ VEE with the Bconnect Communication Protocol for Connected Bathrooms

Tiera Oliver

January 4, 2022

Oledcomm Launches LiFiMAXTab, the First Android Tablet with Integrated LiFi

Taryn Engmark

January 4, 2022

Image Courtesy of the Company
ACEINNA Launches High Power, 65 amp Current Sensor

ACEINNA

January 3, 2022

AI & Machine Learning
From IPC to Server-Grade AOI Infrastructure: Optimizing High-Speed AOI with Server-Grade Computing Architecture

June 1, 2026

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Automotive
Image Credit: Synopsys
Synopsys Achieves First ISO/PAS 8800 Certification for AI-Driven Automotive Systems

May 13, 2026

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Industrial
Application Highlight: ADLINK Robotics and Automation

June 1, 2026

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Edge AI
Image Credit: APLEX
APLEX Touts Edge AI, HMI Architectures, and High-Hygiene Computing Solutions at COMPUTEX 2026

June 2, 2026

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