Are you seeking compact yet high-performance capabilities for your next project? Traditional hardware configurations usually sacrifice performance for compactness or vice versa. The COM-HPC®️ Mini with cutting-edge 13th Generation Intel®️ Core™️ Processors offer a breakthrough solution. This space-saving module, measuring just 95 mm x 70 mm, delivers unparalleled performance without the bulk of conventional systems, ensuring you don’t have to compromise. Experience the future of powerful, compact computing today.

Highlights:

Advanced Processing Power: Equipped with 13th Gen Intel®️ Core™️ processors in U, P, and H-Series and up to 14 cores for high-performance needs.
High-Speed Memory: Up to 64 GB of LPDDR5 6000 MT/s memory, featuring In-Band ECC for enhanced performance.
Robust Connectivity: Offers 16 PCIe lanes and dual 2.5 Gb Ethernet with TSN, ensuring superior data transfer speeds.
Scalable Storage Solutions: Optional NVMe SSD up to 1 TB for quick and efficient data access.
Industrial Grade Durability: Operates reliably in extreme temperatures from -40 °C to +85 °C, perfect for industrial environments.
Enhanced Graphics and Display Options: Integrated Intel®️ Iris®️ Xe Graphics and multiple display outputs for high-quality visual applications.