Patrick Hopper Interviews Maurizio Caporali with Seco at embedded world 2025
July 09, 2025
Video
Patrick Hopper interviews Maurizio Caporali with Seco at the Intel booth at embedded world 2025.
Automotive
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AutoSens and InCabin will return to Huntington Place, Detroit | 9-11th June 2026
May 11, 2026
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embedded world 2026 Podcast with NXP
May 06, 2026
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New Eagle Releases OpenECU NX3 to Simplify EV Architectures with Unified Charging and Control
May 05, 2026
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POLYN Technology Announces Tapeout of Automotive Chip
April 29, 2026
Consumer
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Create reliable, power efficient and safe home appliance designs with a PSOC™ Control C3 and CoolGaN™ solution
February 18, 2026
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Tear Down: Google Pixel Watch 4
February 03, 2026
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TDK Adds SmartMotion for Smart Glasses to its Custom Sensing Solutions for AI Glasses and Augmented Reality
September 30, 2025
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Arm Delivers Personal AI on Consumer Devices with New Lumex CSS Platform
September 10, 2025
Storage
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Rambus Unveils DDR5 9600 RDIMM Chipset for Next-Generation AI and HPC Workloads
July 09, 2026
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Advancing Flash Memory Performance for the Edge AI Era
June 26, 2026
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Floadia Introduces G1 Automotive eFlash IP on TSMC 180BCD Gen3 for Cutting Edge Vehicle Electronics
June 22, 2026
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Biwin Brings Storage and Memory Innovation to COMPUTEX 2026
June 19, 2026
Security
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Using Safety Application Notes to Aid Safety Designs—Part 4: Via FS-Enabled Components
July 14, 2026
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President Trump Announces Executive Order 14412: Securing the Nation Against Advanced Cryptographic Attacks
July 01, 2026
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Navigating the Cyber Resilience Act with NXP Semiconductors and Axis Communications
June 11, 2026
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San Francisco Circuits Achieves CMMC Level 2 Certification, Strengthening Defense Supply Chain Security
June 03, 2026