Avnet Introduces 96Boards ON Semiconductor Dual Camera Mezzanine for Fast Prototyping

By Tiera Oliver

Assistant Managing Editor

Embedded Computing Design

September 10, 2020

News

Avnet Introduces 96Boards ON Semiconductor Dual Camera Mezzanine for Fast Prototyping

Allows design and system engineers to develop embedded vision applications with camera sensor modules at a much lower cost of entry.

Global technology solutions provider, Avnet, introduced the 96Boards ON Semiconductor Dual Camera Mezzanine development and prototyping platform for the AP1302 imaging processor, coupled with dual imaging camera modules. According to the company, the platform will enable design and system engineers to create cost-effective embedded vision applications utilizing industry-standard technologies.

The two Imager Access System (IAS) camera modules that ship standard on this Mezzanine use the AR0144 monochrome digital image sensor from ON Semiconductor. The AR0144 is a 1-megapixel Mobile Industry Processor Interface (MIPI) sensor (1280 horizontal by 800 vertical resolution) and will run at 60 frames per second at full resolution. Its global shutter pixel design is designed for accurate and ideal capture of moving scenes while producing digital images. The ability to capture clear images is ideal for applications such as scanning, industrial inspection, and drone navigation.

By using the 96Boards standard, this card can enable low-latency vision system prototyping by leveraging capabilities of the Xilinx Ultra96-V2 platform.

The platform utilizes MIPI and the camera serial interface (CSI2) standardizations which are specifications of the MIPI Alliance. The MIPI-CSI2 specification defines the interface between the image sensors, ISP, and a host processor, and is used for high-speed communications output from image sensors in most embedded systems.

The API 1302 image co-processor from ON Semiconductor performs image processing functions within the platform, including turning, configuration, and calibration of the sensors. These processing functions also help to reduce design efforts of developing an embedded camera system. The AP1302 interfaces the sensors and the host processor using MIPI-CSI2 lanes.

The IAS image sensor module interface from ON Semiconductor helps solve this problem and enables:

  1. Simplified camera system design: A single, standardized interface helps to connect the imaging module to the processing board, such as the 96Boards Mezzanine.
  2. Shorter lifecycle: Solution decreases time to market by enabling low-touch design.
  3. Lowered learning curve: Prior imaging system expertise is not required since IAS is a plug-and-play solution.

The purpose of the standardized IAS interface is to help any embedded vision system or board designer to gain access to all compatible image sensor modules.

The Avnet-designed 96Boards ON Semiconductor Dual Camera Mezzanine development and prototyping platform comes with two IAS sensor modules and an AP1302 imaging co-processor. It is available today in the Americas, EMEA, APAC, and Japan for $199 (USD). 

For more information, visit: Avnet

Tiera Oliver is the assistant managing editor at Embedded Computing Design. She is responsible for web content editing, product news, and story development. She also manages, edits, and develops content for ECD podcasts, including Embedded Insiders.

She utilizes her expertise in journalism and content management to oversee editorial content, coordinate with editors, and ensure high-quality output across web, print, and multimedia platforms. She manages diverse projects, assists in the production of digital magazines, and hosts company podcasts by conducting in-depth interviews with industry leaders to deliver engaging and insightful discussions.

Tiera attended Northern Arizona University, where she received her bachelor's in journalism and political science. She was also a news reporter for the student-led newspaper, The Lumberjack. 

More from Tiera