Associate Editor

Embedded Computing Design

Tiera Oliver, Associate Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

Articles 181 - 200
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Fibocom Launches AI Smart Module SCA825-W - News

August 22, 2022

Powered by Qualcomm Technologies' premium-tier SoC (System-on-Chip) QCS8250, the module is designed to meet the requirements of high-end AIoT scenarios such as HD video conferences, HD livestreaming, cloud gaming, edge computing, robotics, drones, AR/VR, and so on.

Analog & Power

Efinix Extends Family of Titanium Products with Launch of the Titanium Ti180 FPGA - News

August 18, 2022

Efinix announced the launch of its Titanium Ti180 FPGA. This 180K logic element device is designed to deliver performance in a cost effective, low-power footprint.

Industrial

Micro-ATX Motherboards Designed for Continuous Operation in Industrial Environments - News

August 17, 2022

Display solutions and embedded systems provider, Review Display Systems (RDS) announced the introduction of a new family of industrial motherboards from embedded computing technology supplier, Kontron.

IoT

Quectel Announces New Generation SC200E LTE Smart Module Series to Power High-Demand AIoT Applications - News

August 16, 2022

Quectel Wireless Solutions, a global IoT solutions provider, announced that it has launched its new generation of multi-mode Smart LTE Cat 4 modules, the SC200E series.

IoT

Softing Introduces OPC UA-Based OT/IT Integration Solution with MQTT Connection - News

August 15, 2022

With the new edgeAggregator, Softing offers a flexible, container-based solution for managing complex system architectures in OT/IT integration all the way to edge and cloud applications.

Industrial

Premio Adds AMD Ryzen Embedded Processors to its Portfolio of Industrial-Grade Single Board Computers - News

August 15, 2022

Premio Inc. released its first ever x86 single board computer (SBC) in support of the AMD Ryzen™ Embedded SoC (System on Chip). Premio’s new SBC provides a new class of performance in an integrated single-board solution that includes multi-core performance and rich visual graphics from AMD’s semiconductor design.

Industrial

smartLink product family from Softing offers extended functionalities for Plant Asset Management - News

August 15, 2022

Two product releases from Softing's smartLink family offer enhanced functionalities for Plant Asset Management and the implementation of Industry 4.0 connectivity in industrial networks.

Automotive

Infineon and Delta Enable Bidirectional Charging at Home: Electric Cars as Buffer Storage for Solar Power - News

August 15, 2022

Infineon Technologies AG and Delta Electronics, a Taiwan-based global provider of power and energy management solutions, have developed a three-in-one-system that integrates solar, energy storage, and charging of electric vehicles.

Automotive

Vecow Joins the Autoware Foundation to Accelerate the Development of Autonomous Driving Technologies and In-Vehicle Computing Platforms - News

August 15, 2022

Vecow announced that the company has joined the Autoware Foundation in an effort to push forward the expansion of autonomous/self-driving car markets on a global scale, bringing Autoware, an open-source software stack for self-driving technology, closer to Vecow's partners worldwide.

Open Source

Forlinx Releases TI AM6254 Based OK6254-C Development Board - News

August 12, 2022

Based on the TI AM6254 processor, the SoM FET6254-C and development kit OK6254-C from Forlinx were presented at TI's booth as the Embedded World 2022 held in Nuremberg from Jun.21 to Jun.23

Industrial

IBASE Launches EN50155 Certified MPPC1201PC Fanless Railway Panel PC - News

August 11, 2022

The MPPC1201PC fanless 12.1" panel PC is designed for intelligent railway transportation applications. The PC also received CE/FCC certification and passed the EN50155 2017 strict shock and vibration standards for rolling stock equipment and EN45545-2 EU fire safety standard.

Security

RTI Specifies a Safe Computing Platform for Future Rail Operations with European Railway Operators and Industry - News

August 11, 2022

With digitalization, many new technologies will enter the railway system that place high safety requirements on IT environments. As part of the sector initiative, Real-Time Innovations (RTI) has collaborated with a group of European rail operators and industry companies to move this initiative forward. 

Software & OS

NVIDIA Announces Release of Omniverse With New USD Connectors and Tools, Simulation Technologies, and Developer Frameworks - News

August 11, 2022

NVIDIA announced a new range of developer  frameworks, tools, apps, and plugins for NVIDIA Omniverse, the platform designed for building and connecting metaverse worlds based on Universal Scene Description (USD). 

Industrial

Renesas’ RZ/N2L MPUs for Industrial Ethernet Simplify Implementation of Network Functionality in Industrial Equipment - News

August 10, 2022

Renesas Electronics announced the RZ/N2L microprocessor units (MPUs) for Industrial Ethernet communication that are designed to make it easy to add network functionality to industrial equipment and devices.

Automotive

Ultra-Low Capacitance ESD Protection Diodes from Nexperia Protect Automotive Data Interfaces - News

August 09, 2022

Nexperia announced an extension to its portfolio of low clamping and ultra-low capacitance ESD protection diodes. This portfolio is designed to protect high-speed data lines such as USB 3.2, HDMI 2.0, LVDS, automotive A/V Monitors, displays, and cameras.

Analog & Power

Easy-PC PCB Design Suite Incorporates IPC-2581 As Part of a Manufacturing Integrity Release - News

August 09, 2022

Number One Systems, a technology-leading PCB design solution company, announced the release of Easy-PC version version 26, which incorporates an IPC-2581 export capability, along with over 25 other new technology features based on user requests from professional PCB designers.

Security

Khronos glTF 2.0 Released as an ISO/IEC International Standard - News

August 09, 2022

The Khronos Group announced that its glTF 2.0 specification for the efficient transmission and loading of 3D models has been released as the ISO/IEC 12113:2022 International Standard.

Processing

Microchip Expands Its Portfolio of MPU-Based System-on-Modules (SOMs) with the SAM9X60D1G-SOM - News

August 08, 2022

Microchip Technology announced it has expanded its portfolio of microprocessors system-on-modules (SOMs) with the SAM9X60D1G-SOM ARM926EJ-S-based embedded MPU running up to 600 MHz.

IoT

Energous and Flagship Announce First Retail Deployment of Wirelessly Powered Wiliot IoT Pixel Tags Energized by WattUp PowerBridges - News

August 08, 2022

Energous Corporation and Flagship announced the first retail deployment of Wiliot Internet of Things (IoT) Pixel smart tags energized by WattUp PowerBridges has been deployed at a retail store in Sydney. All tags in the deployment are energized by multiple Energous WattUp PowerBridges.

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Congress Passes CHIPS Act, Positions U.S.-based Semiconductors to Compete Globally - Blog

August 05, 2022

On July 27 and 28th, the United States Congress passed a historical piece of legislation, a bill positioned to advance semiconductor manufacturing in the U.S. now just awaits President Biden to sign it into law.

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