Embedded Computing Design

Seattle, WA and Stuttgart – Lumotive and Gpixel announced the availability of the M30 Reference Design Platform consisting of Lumotive’s LM10 LCM™ beam steering chip and Gpixel’s GTOF0503 ToF sensor for next-gen 3D lidar sensors for mobility and industrial applications, such as autonomous navigation robots for logistics use cases.

TOKYO-- Renesas Electronics Corporation announced that its 8A34001 System Synchronizer for IEEE 1588 has been integrated in the AMD Zynq® UltraScale+™ RFSoC DFE ZCU670 Evaluation Kit and reference design for 5G New Radio (5G NR).

SANTA CLARA -- AMD introduced the Ryzen™ Embedded V3000 Series processors, adding the performance of the “Zen 3” core to the V-Series portfolio for increased processing performance in storage and networking applications. When compared to the previous AMD Ryzen Embedded V1000 series, the V3000 series boasts greater CPU performance, DRAM memory transfer rate, CPU core count, and I/O connectivity.

Mobile World Congress, LAS VEGAS – Quectel Wireless Solutions released its new SC680A smart module featuring the Qualcomm QCM4290 platform and a customized 64-bit ARM v8.0 compliant octa-core Kryo 260 application processor enabling speed and on-device performance for mid-tier IoT devices such as POS, industrial handhelds for logistics and warehousing, in-vehicle infotainment and dashcam solutions, micro-mobility applications, and small electric cars.

SAN JOSE and MILPITAS, Calif. — The Autonomous Vehicle Computing Consortium (AVCC) and SEMI announced an alliance to drive autonomous vehicle innovation. The terms of the agreement state that both leadership and members of the two organizations will jointly promote the development of technology standards, and offer recommendations for driving mass market adoption of autonomous vehicles.

SANTA CLARA, Calif. -- SiTime Corporation introduced a new automotive oscillator family, based on SiTime’s advanced MEMS technology. The new SiT9396/7 precision timing solutions are designed to ensure the reliability and flexibility of level 4 and 5 ADAS, domain/zone controllers, radar, and LiDAR subsystems.

MOUNTAIN VIEW, Calif. – Flex Logix Technologies announced the InferX Hawk, a hardware and software-ready mini-ITX x86 system enabling the customization, build, and deployment of edge and embedded AI systems.

NXP Semiconductors and Elektrobit are collaborating to co-develop a software platform to support NXP’s high-voltage battery management system (HVBMS) reference design.

BEIJING, China and SAN JOSE, Calif., USA -- The second-generation of the advanced automotive touch-sensing technology, a formula material sensor and advanced algorithm from Taifang Technology, the Taifang Automobile Intelligent Perception System 2.0 (TAIPS), was announced with increased system incident sensitivity from the previous TAIPS 1.0 version.

CHANDLER, Ariz., Microchip Technology announced a new family of Terabit-scale Ethernet PHYs (physical layer), the META-DX2+, designed to provide OEMs the ability to double router and switch system capacities with 112G PAM4 connectivity for 800G ports, and support for encryption and Class C/D precision timing.

SANTA CLARA, CA – Today, NVIDIA released a new line of Jetson Orin Nano system-on-modules (SoMs), an expansion of the previous Jetson Nano series that’s 80x faster with the ability to deliver up to 40 trillion operations per second (TOPS) of AI performance in a small, compact package.

ERLANGEN, GERMANY – Elektrobit and Argus Cyber Security launched the EB zoneo SwitchCore Shield, a pre-integrated embedded intrusion detection and prevention (IDPS) solution designed for network management systems in next-generation vehicles.

AUSTIN, TEXAS. Release 7.0 of the StarlingX open-source edge computing and IoT cloud platform is now available to help Industrial IoT enterprises deploy ultra-low latency edge clouds.

MONHEIM AM RHEIN, GERMANY. SEGGER has released the Device Support Kit (DSK) for its J-Link debug probes and Flasher in-circuit programmers that simplifies the process of supporting new devices on the popular development tools.

SWINDON, UK. Sensata Technologies announced the Lithium Balance n3-BMS battery management system, an off-the-shelf ISO 26262 ASIL C-certified solution for electric vehicles that use up to 1000 volts/2000 amps of power. It’s also built on a unique software structure that lets developers insert custom code and algorithms in less time and at lower cost.

IAR Systems announced the latest version of the complete development toolchain IAR Embedded Workbench® for Arm v. 9.30, which fully supports the Renesas’ RZ/T2 and RZ/N2 series MPUs, based on Arm® Cortex®-R52.

OrionVM, Infrastructure as a Service (IaaS) provider and cloud computing pioneer, announced the addition of technology partner Blaize, the artificial intelligence (AI) computing provider of edge and automotive computing solutions, to create a new AI as a service (AIaaS) offering.

As part of a partnership with Geehy Semiconductor, SEGGER’s J-Link debug probes, as well as its family of Flasher in-circuit programmers, fully support the Geehy Polaris APM32 series MCU. Geehy and their customers now enjoy the benefits of J-Link Prime with these devices being supported right out of the box.

On this episode of Embedded Insiders, we’re exploring a new world of hardware. More specifically, a software-based platform for hardware revision control and collaboration. It’s basically the new Github for hardware engineers and it’s called AllSpice, and co-founder Kyle Dumont is giving us a peak inside the Git-style platform.

Magnachip Semiconductor introduced its third- generation 200V Medium Voltage (MV) Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) for Light Electric Vehicles (LEV) motor controllers and industrial power supplies.