Embedded Computing Design

Uppsala, Sweden – IAR Systems announced extended support for the company’s Visual Studio Code, encompassing the latest IAR Build and IAR C-SPY Visual Studio (VS) Code Extensions v1.20, and compatible with the most recent IAR Embedded Workbench.

Munich, Germany – The Codasip University Program has joined Intel Pathfiner for RISC-V in a collaboration to bring Codasip RISC-V IP cores, the Codasip Studio development environment, and Intel's FPGA platforms to undergraduate and graduate courses. Codasip's University Program is currently working with a number of universities, in light of the expansion of Intel’s Pathfinder ecosystem, to provide students with access to Codasip Studio and project-based RISC-V assignments.

DFI has plans to release a new 181.6mm x 57mm x 118.4mm, fanless Edge AI inference computer, the EC70A-TGU, powered by Intel® 11th Gen Tiger Lake Core™ processors and featuring 8GB of onboard memory for AI applications such as industrial automation, smart transportation, medical imaging, AMRs/AGVs, and more.

Munich– A recent GSMA Report ¹ revealed that out of 88 countries there 260 mobile operators currently providing commercial eSIM services for smartphones, with the expectation that 76% of all smartphone connectivity services will be eSIM-enabled by 2030.

Thalwil, Switzerland – u-blox announced the u-blox ZED-F9K-01A, a high-precision AEC-Q104 GNSS module integrated with embedded advanced hardware, software, and the most recent IMU (Inertial Measurement Unit) for self-contained positioning in predominately ADAS applications.

In a joint development agreement, ROHM Semiconductor, Mazda Motor Corporation (Mazda), and Imasen Electric Industrial Co., Ltd., (Imasen) have plans to develop inverters and SiC power modules for the electric drive units of electric vehicles, including e-Axle. ROHM is participating in this ‘cooperative framework for the electric drive units development and production’ by reverse developing SiC MOSFETs and modules starting from the finished vehicle.

Lauterbach and AbsInt have combined Lauterbach's PowerTrace modules for real-time tracing and AbsInt's TimeWeaver for estimating worst-case execution time (WCET) to calculate the worst-case program runtime in safety-critical applications.

MUNICH, Germany and TOKYO, Japan ― Renesas Electronics announced the RAA270205 4x4-channel, 76-81GHz high-definition transceiver, a MMIC (monolithic microwave integrated circuit) transceiver designed for imaging radar, long-range forward-looking radar, 4D radar, and corner and central-processing radar architectures commonly known as  “satellite” automotive radar systems.

MUNICH-- Skyworks Solutions and MediaTek have begun a strategic initiative to develop a complete modem-to-antenna automotive-grade 5G solution, the 5G New Radio Sky5A RF front-end solution, to address the increasing data and connectivity demands of next-generation automotive applications.

Thalwil, Switzerland – u-blox and GMV are collaborating on ready-to-use functional safe positioning solution to accompany u-blox’s current GNSS receiver portfolio and advanced GNSS augmentation service PointPerfect.

Austin, TX – Ambiq announced neuralSPOT®, an open-source AI developer-customized SDK with software and tools designed for AI application development, workflows, and collaboration. Designed for Ambiq’s latest Apollo4 Plus system-on-chip (SoC) family, neuralSPOT utilizes the company’s proprietary SPOT® platform for enhanced energy efficiency in electronic products.

Electronica, MUNICH, Germany, November 15, 2022 -- As we globally move towards more modern and clean energy resources, NXP Semiconductors is meeting the needs of today’s electrification applications with the new S32K39 series of automotive microcontrollers (MCUs) designed for high-precision traction inverters in electric vehicle control applications.

MUNICH – Nov. 14, 2022 – As part of a strategic collaboration, Mercedes-Benz selected onsemi’s silicon carbide (SiC) technology, the VE-Trac SiC modules, for the all-electric Mercedes-Benz VISION EQXX’s traction inverter. Designed to increase the EV’s range by up to 10%, the VE-Trac SiC modules allowed the EV to complete a 1,202 km (747 mile) trip from Stuttgart, Germany to Silverstone, England, making the trip the longest distance traveled on a single charge.

MILPITAS, California – CETECOM announced the first Automotive Experience Lab (AEL), a proof-of-concept testing center for automotive application testing in a simulated environment.

SAN JOSE, Calif – Supermicro’s JumpStart remote access program is based on the company's all-new H13 systems with 4th Gen AMD EPYC processors to enable workload testing and application tuning for developers and IT administrators of AI, deep learning, manufacturing, storage, and other industries.

CHANDLER, Arizona— Microchip Technology’s recently announced LAN8840 and LAN8841 Gigabit Ethernet transceiver devices are a standard-based solution designed to provide critical process synchronization to developers of industrial-grade networking solutions, such as process automation applications.

Built from scratch by Southern Methodist University students in Dallas, a DIY, aka do-it-yourself, supercomputer using NVIDIA’s Jetson Nano modules is helping provide the hands-on experience students may not receive with a standard supercomputer, which is often too large for a typical university learning environment.

Wilmington, MA / USA and Munich, Germany – AUO Corporation is utilizing Analog Devices’ matrix LED display driver technology in their automotive widescreen display portfolio to provide local dimming, improved power consumption, and support for functional safety to deliver an immersive widescreen display experience to customers.

Codasip and SiliconArts, provider of photo-realistic ray tracing graphics rendering, have combined Codasip’s RISC-V processor IP and SiliconArts ray tracing GPUs for the development of augmented reality applications.

As electronic devices are continuously shrinking in order to keep up with the demands and advancements of next-generation technologies, semiconductor companies must consistently keep up with those requirements. Storage and memory technologies such as DRAM are embedded in almost every electronic device active on the market today, and they are no exception to the laws of physics in the semiconductor space.