Embedded Computing Design

SANTA CLARA, CA – EdgeQ Inc and Vodafone have partnered on the development of next-generation, software-programmable 5G ORAN platforms to deliver the world’s first open programmable and fully in-line acceleration card that will support multi-carrier MIMO and address macro cell deployments by converging a 4G and 5G Physical layer onto a single card.

Monheim am Rhein, Germany – The entire E-Series of SiFive RISC-V cores with the BTM trace module are now supported by SEGGER’s J-Trace PRO with streaming trace, Live Code Profiling, and Live Code Coverage.

Morton, Illinois – Hexagon | AutonomouStuff’s new Honda CR-V by-wire kit is company's latest autonomous platform designed to accelerate autonomous development. The kit is part of the AutonomouStuff platform and incorporates AutonomouStuff’s latest PACMod, a control module that is built internally, and can be used as an interface between the computing system and vehicle to enable autonomy on the Honda CR-V.

ERLANGEN, Germany -- Elektrobit announced that for the new AURIX TC4x microcontrollers (MCUs) from Infineon Technologies AG the company’s created the first automotive-grade, embedded, real-time operating system (OS) and hypervisor, the EB tresos AutoCore OS and new EB tresos Embedded Hypervisor based on the AUTOSAR Classic standard, to enable OEMs and Tier1s to grow and distribute automotive E/E architectures.

MONTREAL — Soundskrit announced the availability of the SKR0400, the world's first bio-inspired directional MEMS microphone built for consumer electronics devices. Designed to replace traditional microphone arrays, the bio-inspired SKR0400 features a new transducer to provide increased audio performance.

Everactive’s new development kit enables third-party developers to build IoT products without batteries. The development kit features self-powered hardware and a managed network to provide physical-world data for hyperscale IoT, and includes two Everactive batteryless IoT devices with sensor suites designed to measure temperature, humidity, pressure, and triaxial acceleration.

CHANDLER, Ariz.,— Microchip Technology is introducing its first Arm Cortex®-M4F-based PIC microcontroller (MCU) family designed to combat wireless connectivity design challenges with the integration of Bluetooth Low Energy functionality, which can be directly integrated into a systems’ components. 

OTTAWA, Canada – GaN Systems announced that the company’s power transistors are now powering Renesas Electronics’ new automotive 48V/12V Bidirectional DC/DC Converter to provide power density improvements. Renesas’ converter utilizes GaN Systems’ GS61008P, a 100V enhancement mode GaN-on-silicon power transistor designed to enable a 46% reduction in system size.

SWINDON, United Kingdom – Sensata Technologies announced its new Brake Pedal Force Sensor for electromechanical brakes (EMBs), designed to decrease a vehicle’s stopping distance and improve braking by efficiently capturing the driver’s braking intent.

Uppsala, Sweden –IAR Systems® announced continued support for SiFive’s RISC-V Automotive CPU IP: The IAR Embedded Workbench™ for RISC-V which is aimed at the most recent SiFive Automotive E6-A and S7-A product series and addresses automotive application needs such as infotainment, connectivity, and ADAS, while also incorporating the single instruction set architecture (ISA) utilized by RISC-V to increase code portability and reduce cost and time-to-market.

The electricity market has traditionally been centralized and controlled by grid operators who deliver fixed amounts of energy based on historical local demand. But as the world moves to counteract climate change using renewable energy, those fixed, centralized policies will no longer be sufficient.

TDK Corporation announced the 200W and 300W rated TDK-Lambda CN-B110 series of half brick DC-DC converters that feature a wide input voltage of 43 to 160Vdc. The new converters are compatible with 72Vdc or 110Vdc nominal railway systems and are ideal for rolling stock, railway trackside equipment, robotics, AGVs and scientific research equipment applications.

Westford, MA USA– Swissbit’s new SSD, the N4200 for the application profiles and requirements of data centers, features a firmware architecture designed to tackle real-world data center workloads with comprehensive workload analysis and data for firmware adaptability, and application-specific optimization. Designed for data center providers, the N4200 is currently available in a 8TB storage capacity, with 16TB to follow (7.68 TB and 15.4 TB, respectively).

Siemens Digital Industries Software and United Microelectronics (UMC) are collaborating to develop and execute a new multi-chip 3D integrated circuit (IC) planning, assembly validation, and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies.

Geneva –- STMicroelectronics’ STM32 microcontrollers can now be used for the development of embedded software projects through the company’s STM32 Hotspot organization on GitHub, a community where developers can utilize non-productized code created by ST engineers.

Monheim am Rhein, Germany – October 10th, 2022 – SEGGER announced native J-Link debug probe support for select use cases with the Cadence Tensilica Processor IP. The Cadence Tensilica cores supported in the first implementation phase are the Tensilica Xtensa LX7 CPU, a number of Tensilica HiFi DSPs (HiFi 4, HiFi 3z, HiFi 3, and HiFi 1), and also the Tensilica Fusion F1 DSP.

Stockholm and Irvine, Calif., – Imagimob and Syntiant Corp are collaborating to integrate Imagimob’s tinyML platform with Syntiant’s ultra-low-power NDP120 Neural Decision Processor, enabling the development of production-ready deep learning tinyML applications and ML models using the NDP120 for sound event detection, keyword spotting, fall detection, anomaly detection, gesture detection and more.

Oberursel / Frankfurt, Germany, – MEMPHIS Electronic has plans to release a family of DDR5 memory modules based on Samsung’s DDR5 chipsets in commercial and industrial temperature ranges, and configured with 16 and 32 Gigabyte capacities and 5600 MHz clock frequency.

San Jose, California and Guangzhou, China -- GOWIN Semiconductor Corporation released its new generation Arora V high performance FPGA family featuring advanced 22nm SRAM technology.

Bensheim, Germany –– TE Connectivity (TE) developed the PicoMQS miniaturized automotive connector system for compact signal interfaces deployed in high temperature and high vibration automotive applications.