Embedded Computing Design

Munich, Germany – 7 March 2023 – Infineon Technologies AG has taken the initial steps to create a Rust ecosystem and is now the first major semiconductor manufacturer to officially support Rust for its microcontrollers, as it provides built-in support for memory-safe software development, making it ideal for use in the design of mission-critical automotive software.

Munich, Germany – In collaboration with 3D time-of-flight technology provider, pmdtechnologies, Infineon Technologies AG announced the IRS2976C Time of Flight (ToF) VGA sensor, part of the REAL3™ product family and designed to support long-range, low-power 3D camera use cases with Infineon's advanced pixel technology.

LEUVEN (Belgium) — imec recently announced a digitally calibrated charge-pump (CP) phase-locked loop (PLL) capable of generating high-quality frequency-modulated continuous-wave (FMCW) signals for mmWave radars.

London, England – Imagination Technologies launched the IMG DXT, a ray tracing GPU providing enhanced graphics for mobile device users by enabling mobile device manufacturers to integrate ray tracing into their SoCs, ranging from simple shadowing in hybrid implementations to high-end graphics.

SAN JOSE, California – Rambus Inc.’s new Gen3 6400 MT/s DDR5 Registering Clock Driver (RCD) is now available and sampling to leading DDR5 memory module (RDIMM) manufacturers with a 33% increase in data rate and bandwidth over Gen1 4800 MT/s solutions.

ERLANGEN, Germany – Elektrobit announced a new generation of its EB corbos Starter Kit, a turnkey solution designed for carmakers and Tier 1 suppliers developing ECUs and distributing updates vis software-defined vehicles. The EB corbos Starter Kit enables users to safely install, update, and uninstall software on the AUTOSAR Adaptive Platform.

Tewksbury, MA – January 25, 2023 –  Avery Design Systems and CoMira Solutions are partnering to enable chiplet design using the UCIe (Universal Chiplet Interconnect Express) die-to-die interface standard, announced earlier this year, to provide interoperable chiplets and support an open chiplet ecosystem and universal interconnect at the package level.

TOKYO, Japan ― Renesas Electronics Corporation announced the new RAJ2810024H12HPD, an automotive Intelligent Power Device (IPD) designed to efficiently control the power distribution of next-generation E/E (electrical/electronic) automotive architectures.

TYSONS CORNER, VA – Sheeva.AI, a provider of in-car payments enabling vehicle location-based services that monetize the driver experience, and AeonCharge, an app developer helping EV drivers locate, activate, and pay for charging sessions across charger networks through a single platform, are partnering to bring in-vehicle activation and payment to over 50,000 public EV chargers in North America.

To meet the low-power, high-performance needs of today’s consumer and industrial applications, like advanced processing, communication networks, and human-machine interfaces, the GD32 microcontroller family from GigaDevice is based on the 240MHz Cortex®-M4 core for high-end processing, connectivity, and power efficiency, with intricate algorithm and security support.

At CES 2023, Owl Autonomous Imaging announced their new Thermal Ranger™ ADAS & Autonomous Navigation Development Platform designed to help improve object classification and distance measurements with a monocular thermal camera solution providing 2D & 3D perception, 3D segmentation, and RGB-to-thermal fusion when other cameras and perception sensors are impaired by the environment.

TDK Corporation will be producing the InvenSense IAM-20685, a small-scale ASIL-B monolithic 6-axis MEMS IMU compliant with ISO 26262 for automotive ADAS and autonomous systems such as automated parking, ADAS domain controller, vision systems, vehicle redundant IMU, navigation system aids for dead reckoning, telematics, and accurate positioning.

At CES 2023 in Las Vegas, from January 5 to January 8, 2023, in West Hall at booth 6757, Rohde & Schwarz will be showcasing a variety of automotive radar and ultra-wideband testing solutions.

TOKYO, Japan ― Renesas and Fixstars Corporation are jointly developing tools for autonomous drive and advanced driver-assistance systems (ADAS) that enable software simulation and optimization, specifically for the R-Car system-on-chip (SoC) devices from Renesas.

Beaverton, OR – In an effort to extend code contribution across smart home networks and smart devices, the Z-Wave Alliance announced that the Z-Wave Source Code project is now available on GitHub to Alliance members. The Standards Development Organization’s code project will allow members to provide code to progress the Z-Wave standard.

Munich, Germany and Natick, MA –MathWorks and Infineon Technologies AG announced that Infineon’s latest AURIX™ TC4x family of automotive microcontrollers now feature hardware support for the MathWorks Simulink® products.

KIRKLAND, Wash. — Alliance Memory announced the expansion of its AS25F series of multiple input/output serial NOR flash memory products with two new 1.8V, 128Mb devices designed to support single, dual, and quad SPI modes for computer, consumer, communications, IoT, and mobile markets.

SAN FRANCISCO –  Robert Bosch GmbH and XPENG Motors have joined the ELISA (Enabling Linux in Safety Applications) Project, assembled by the Linux Foundation, to support and improve the use of Linux in safety-critical applications such as connected cars.

Geneva – STMicroelectronics launched new silicon-carbide (SiC) high-power modules that are designed to increase the performance and driving range of electric vehicles. The five new SiC-MOSFET based power modules have been chosen by Hyundai to be used in the E-GMP electric-vehicle platform shared by KIA EV6 and several models.

Munich, Germany – Codasip announced that the organization, Codasip Labs, is now positioned as an innovation hub within the company, supporting the development and commercialization of security, functional safety, and AI/ML applications to foster cooperative research between Codasip and its partners, customers, and academia.