Embedded Computing Design

Press Releases - Page 122

IoT
VIA Enables Support for Alibaba Cloud IoT Open Edge Computing Platform Link Edge in VIA ARTiGO A820 Enterprise IoT Gateway

VIA Technologies, Inc.

August 8, 2018

Processing
Achronix and Mentor partner to provide link between high-level synthesis and FPGA technology

Achronix

August 7, 2018

Analog & Power
Rochester Electronics and Analog Devices team to eliminate design requalification costs with replication of obsolete semiconductor devices

Rochester Electronics

August 6, 2018

Processing
7 Hands-On Workshops Highlight Free ST Developers Conference; Register Today

STMicroelectronics

August 3, 2018

Storage
Leti and CMP announce multi-project wafer service with integrated silicon OxRAM

August 2, 2018

IoT
Advantech, Behr Technologies, Hitachi Solutions, and Microsoft collaborate to develop IIoT connectivity solutions

Advantech Co., Ltd

July 30, 2018

Automotive
dSPACE supports AUTOSAR 4.3 features

dSPACE, Inc.

July 25, 2018

AI & Machine Learning
C-SKY selects UltraSoC embedded intelligence for Chinese developed AI SoC

RealWire

July 25, 2018

Processing
Newark element14 offers a range of Exclusive Brands providing price, performance and product customization benefits

Newark Element 14

July 24, 2018

Security
NXP and Dover Microsystems join forces to deliver network security, safety, and privacy for processors

Dover Microsystems

July 24, 2018

Processing
RISC-V Foundation Forms Security Committee

Ted Speers

July 24, 2018

Industrial
2018 Automation Taipei turns new chapter with record scale and brand numbers

chanchao

July 23, 2018

Automotive
Luxoft commits software developers in Berlin to MBition GmbH to help drive innovation in Daimler AG cars

Luxoft

July 16, 2018

Processing
STMicroelectronics acquires graphical user interface software specialist Draupner Graphics

STMicroelectronics

July 13, 2018

Analog & Power
Leti and Soitec launch a new substrate innovation center to develop engineered substrate solutions

July 11, 2018

Healthcare
The Future of Miniaturized Healthcare: Silicon Labs’ BG29 Bluetooth LE SoC

April 4, 2025

MORE
Industrial
Image Credit: MicroBin Corporation
MicroBin Corporation: mbXDVK

April 11, 2025

MORE
Storage
FMC and Neumonda Team Up to Bring DRAM Manufacturing Back to Germany

April 3, 2025

MORE
Software & OS
Image Credit: McObject
CORTEX Biophysik Leverages McObject’s eXtremeDB to Boost Cardiovascular Diagnostics for Athletes and Clinicians

April 11, 2025

MORE