PCIM: Silicon Carbide Overcomes Packaging, Parasitic Inductance En Route to Market
August 07, 2017
Video
Embedded Computing Design
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PCIM: Silicon Carbide Overcomes Packaging, Parasitic Inductance En Route to Market
Wide-bandgap semiconductors have finally arrived in product form, with Silicon Carbide (SiC) solutions taking center stage at PCIM 2017. Dr. Kevin Speer of Littelfuse addresses some of the challenges that limited SiC solutions in the past, and the achievements in packaging, overcoming parasitic inductance, and service that are enabling wide-bandgap mosfets and Schottsky diodes on the market today.
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