TDK Announces MIPI Standard SoundWire Microphone

By Tiera Oliver

Associate Editor

Embedded Computing Design

January 23, 2020


TDK Announces MIPI Standard SoundWire Microphone

TDK Corporation introduces the MIPI Standard SoundWire microphone for mobile, IoT and other consumer devices.

TDK Corporation introduces the MIPI Standard SoundWire microphone for mobile, IoT and other consumer devices. This multimode microphone provides advanced feature sets with very low power.

The T5808 SoundWire microphone features 66 dBA SNR and 135dB SPL AOP at 650 µA in high quality mode (HQM), and decreases power consumption to 215µA in low power mode (LPM). The T5808 microphone also features concurrent mode (CCM), enabling simultaneous audio streams from HQM and LPM that can transition back and forth without audio glitches.

SoundWire is a standard audio bus that supports multiple audio devices including microphones, speakers, codecs and class D amplifiers. SoundWire integrates audio and control data for up to 11 devices (e.g. 7mics, 4 speakers) on a single bus.

T5808 is currently in mass production and will be available through distribution in Q1 2020.  For samples and additional information, please contact [email protected] or visit


  • HQM: High Quality Mode
  • LPMLow Power Mode
  • CCM: Concurrent Mode
  • AOP: Acoustic Overload Point

Main applications

  • Smartphones
  • Microphone Arrays
  • Tablets
  • Cameras
  • Bluetooth Headsets
  • Notebook PCs
  • Security and Surveillance

Key features

  • 5 × 2.65 × 0.98 mm surface?mount package
  • Low power: 215 µA in Low?Power Mode
  • Extended frequency response from 40 Hz to >20 kHz
  • Sleep Mode: 10 µA
  • High power supply rejection (PSR): −91 dB FS
  • Fourth?order Σ?Δ modulator
  • Digital pulse density modulation (PDM) output
  • Compatible with Sn/Pb and Pb?free solder processes
  • RoHS/WEEE compliant


Key data



Packaging Dimensions (mm)

3.50 × 2.65 × 0.98



Acoutsic Overload Point dB SPL


Low Power Mode µA


Bandwidth kHz


Low Frequency Corner Hz


Digital Interface


Tiera Oliver, Associate Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

More from Tiera