The Road to embedded world: Neousys Technology
March 29, 2022
Blog
Platforms that can handle AI at the Edge will be the focus for Neousys Technology, at the 2022 embedded world trade fair. The company will be located in Hall 1, Booth 1-119. Over the past couple of years, Neousys has made a commitment to developing embedded computers designed with NVIDIA GPUs and Google Coral’s AI accelerator cards. The focus of these platforms are areas that require maximum power efficiency, inference computing, and potentially harsh or rugged environments. According to the company, the goal is to move Edge AI technologies from the lab to the field.
Based in New Taipei City, Taiwan, Neousys Technology will be announcing a new platform at embedded world 2022, which takes advantage of the latest 12th Gen Intel Core processor, the Alder Lake-S CPU. That platform is dubbed the Nuvo-9000.
A second product being showcased is a rugged server that is built with using AMD’s EPYC 7003/7002 Milan/Rome server CPU and the Tesla T4 GPU/ RTX A5000 or A6000. This powerful combination has the potential to take Edge AI computing to a higher level.
All the Neousys systems are designed to meet most environmental challenges and deliver optimal CPU/GPU performance in 24/7 operation. They are already time-tested in factories, roadside applications, and in industrial/commercial vehicles for automation, robotics, vision inspection, video analytics, and autonomous driving. Learn lots more in this video that shows everything from requirements at the Edge, how to overcome a designer’s pain points, and the company’s product portfolio.
Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.
Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.
Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.
Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events. In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.
Nass holds a BSEE degree from the New Jersey Institute of Technology.
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