congatec develops low-profile motherboards for industrial connected devices
March 22, 2017
congatec’s conga-IC175 is a thin industrial-grade motherboard family that’s designed with Intel’s 7th Generation Core U (Kaby Lake) processor, aimed at connected applications, including those that...
congatec’s conga-IC175 is a thin industrial-grade motherboard family that’s designed with Intel’s 7th Generation Core U (Kaby Lake) processor, aimed at connected applications, including those that are space-constrained, high-performance, and/or low-power. Besides all the enhancements of the new processor generation, they also offer comprehensive IoT support including a SIM card socket for 3G/4G or Narrow Band connectivity and first versions of congatec’s Cloud-API.
The low profile Mini-ITX motherboards ship with four different dual-core processor variants and have a configurable cTDP from 7.5 W to 25 W. Two SO-DIMM sockets support up to 32 Gbytes of DDR4-2133 memory. For non-volatile memory, the boards offer one M.2 slot supporting Intel’s Optane memory. Two SATA 3.0 interfaces allow additional HDDs or SSDs to be connected. The industrial-grade I/O set includes two Gigabit Ethernet, one PCIe x4, one mPCIe for generic expansions, four USB 3.0, six USB 2.0, eight GPIO, and two serial COM ports.
The boards support the 64-bit versions of Microsoft Windows 10 and Windows 10 IoT as well as all common Linux operating systems.
Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.
Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.
Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.
Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events. In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.
Nass holds a BSEE degree from the New Jersey Institute of Technology.
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