SAN JOSE, CA. Toshiba Memory America, Inc. has started sampling new Automotive UFS JEDEC Version 2.1 embedded memory solutions that combine BiCS FLASH 3D flash memory and a controller in a single package. 

The new UFS devices key features include:

1.    Extended Temperature Range: Supports -40°C to +105°C. Also meets AEC-Q100 Grade2 specifications.

2.    Wide Capacity Range: Supports 32GB to 256GB for automotive applications such as entertainment and information systems and ADAS.

3.    High Performance: 256GB product’s sequential read and write performance are improved by approximately 6 percent and 33 percent, respectively, over previous generation devices.

4.    Functions Well-Suited for Automotive Applications: Supports functions such as Refresh, Thermal Control and Extended Diagnosis.

“Due to the significant performance improvements it brings, UFS has become the mainstream solution for high-end and mid-tier smartphones,” said Toshiba Memory America, Inc’s, director of managed flash memory products, Scott Beekman. “It’s only natural that automotive applications follow the same course. Our long history in UFS – we were the first to introduce it back in 2013 – puts us in a unique position to anticipate and support evolving applications to enable these types of transitions.”

For more information, visit business.toshiba-memory.com.