UnitedSiC Pushes the Envelope with SiC FETs

By Rich Nass

Contributing Editor

Embedded Computing Design

September 23, 2021

Blog

UnitedSiC Pushes the Envelope with SiC FETs

The embedded industry is getting more comfortable with silicon carbide (SiC) power semiconductors, as it’s no longer considered a “new” or “bleeding edge” technology. It’s now considered a mainstream technology.

To that end, UnitedSiC, a maker of SiC devices, has released a 750-V, 6-mΩ device. The company claims that the RDS(on) value is less than half the nearest SiC MOSFET competitor. The part also offers a 5-μs short-circuit withstand time rating.

In all, UnitedSiC is adding nine new device/package options to its 750-V SiC FET series, rated at 6, 9, 11, 23, 33, and 44 mΩ. All devices are available in the TO-247-4L package while the 18-, 23-, 33-, 44-, and 60-mΩ parts also come in the TO-247-3L.

Such components are well suited for challenging, emerging applications. These include traction drives and on- and off-board chargers in electric vehicles and all stages of uni- and bi-directional power conversion in renewable energy inverters, power factor correction, telecoms converters, and ac/dc or dc/dc power conversion. Established applications also benefit from a boost in efficiency from the backwards compatible parts. Pricing in lots of 1000 range from $4.15 to $23.46.

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

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