A 2-in-1 Stacked Card Connector from ATTEND

By Chad Cox

Production Editor

Embedded Computing Design

July 15, 2024

News

A 2-in-1 Stacked Card Connector from ATTEND
Image Credit: ATTEND

ATTEND launched its 2-in-1 stacked card connector designed to redefine space efficiency and functionality in electronic components. Supporting Micro SD, Nano-SIM, and Micro SIM cards, it enables competent data transfer while optimizing PCB space usage.

Highlights:

  • Tray push-push type:
    • Dual-stack card connector (tray is separated)
  • Vertical stacking design:
    • Saves up to 50% PCB space
  • Support for multiple card types:
    • Compatible with Micro SD, Nano-SIM, and Micro SIM cards
  • Integrated incorrect insertion prevention and tray detection:
    • Ensures proper card insertion and detection
  • Robust tray lock function:
    • Protects against shock and vibration
  • Extended ejection length:
    • 6 mm ejection length for easy card removal
  • Adaptable design:
    • 2 mm tray edge for flexible panel/casing integration
  • Durability tested:
    • Withstands 5,000 mating cycles
  • Wide operating temperature range:
    • From -40°C to +85°C
  • Compliance:
    • Meets EN60721-3-5 Class 5M3 random vibration and Level II shock test standards

Ideal Applications:

  • Mobile Devices
  • IoT Devices
  • Drone
  • Electronics
  • Industrial Automation l
  • Automotive
  • Wearable Devices
  • Medical Devices
  • Home Automation

For more information, visit attend.com.

Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.

He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.

Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.

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