Embedded Computing Design

CES 2026 saw the introduction of the NVIDIA Jetson T4000 module, and with it, the announcement of AAEON’s development timeline (expected to be available in Q2 of 2026) for its BOXER-8742AI, built on the T4000 module. AAEON commented that its BOXER-8742AI delivers features designed to operate production-ready performance, massive AI compute, and sensor capabilities for physical AI applications in integrated fanless embedded AI systems.

Ambarella, Inc. is highlighting its CV7 edge AI vision system-on-chip (SoC) at CES 2026. The solution is built for a variety of AI applications including AI-based 8K consumer products, multi-imager enterprise security cameras, robotics, industrial automation, and high-performance video conferencing devices.

During CES 2026, Bosch Sensortec will showcase its BMI5 platform introducing its three models, the BMI560, BMI563, and BMI570. The solutions are considered by the company as a new generation of inertial sensors engineered to deliver efficient performance across multiple device classes.

Visit femtoAI at CES 2026 in Las Vegas from January 6–9, with an open house on January 7th from 5 p.m.–7 p.m. at the Venetian Hospitality Suite. The company recently announced that it has had a banner year of growth with milestones that include shipping over 100,000 units of its Sparse Processing Unit (SPU) AI accelerator, closing a new funding round, launching a growing developer community, and strategically expanding its executive leadership team to drive future scale.

Dracula Technologies will exhibit LAYER V2.0 at CES 2026, its updated organic photovoltaic (OPV) technology that delivers a 30 percent increase in overall performance when juxtaposed with the prior generation. LAYER V2.0 supports higher power output for similar surface area, or comparable performance from a reduced module footprint.

Greenliant recently acknowledged that its small form factor (16mm x 20mm) NVMe NANDrive EX Series ball grid array (BGA) solid state drives (SSDs) are being sampled in industrial, aerospace, and mission critical programs.

Akasa released the compact (68.4 x 96 x 37.3 mm) Skyline 3 Pro, an aluminum fanless case with a skyline-shaped top cover and engineered to allow full access to the ASUS Tinker Board 3 and 3S single-board computers (SBCs) interfaces.

Microelectronics US 2026 will be held from April 22–23 at the Palmer Events Center in Austin, Texas. Registration for the event is now open, and it is expected to bring together experts from leaders in semiconductors, photonics, and embedded systems with a goal to accelerate collaboration across design, manufacturing, and innovation.

During January 6-9, ETAS (Booth 16203) will showcase its calibration tools in the Microsoft Marketplace at CES 2026 in Las Vegas. It is the first time ETAS products will be offered on Azure, and demonstrations will show how the tools accelerate the digital transformation of automotive development through cloud technology.

IBASE Technology Inc. released the Intel Core Ultra 100U powered ASB200-962U, a small form factor fanless edge AI computer engineered for efficient and reliable AI inference. It supports up to 96GB DDR5 memory and delivers I/O connectivity allowing for seamless integration with cameras, sensors, and peripheral components.

Rapidus Corporation announced its release of a suite of AI design tools to support its Rapidus AI-Assisted Design Solution (Raads), an initiative to help realize its Rapid and Unified Manufacturing Service (RUMS) concept.

At Venetian Expo Booth #50752, intoPIX will demonstrate its innovations in real-time, low-power image processing and video compression for manufacturing applications during CES 2026. The company is also celebrating its 20th anniversary and an Emmy Award acknowledging its dedication to the JPEG XS standard.

Accenture has agreed to acquire a 65 percent interest in US-based AI data center engineering and consulting firm DLB Associates and its affiliated companies (collectively “DLB”). The purchase will extend Accenture’s end-to-end data center abilities.

Cincoze released its scalable DIN-Rail computer series, MD-3000, the first sku of the Machine Computing MAGNET product line. The MD-3000 series is designed for vision-driven smart manufacturing applications.

Siemens and GlobalFoundries (GF) will collaborate with the goal of leveraging both companies’ AI-based abilities to enhance performance of semiconductor manufacturing. The companies will emphasize automation technologies for semiconductor fabrication (fab automation), electrification, digital solutions, and software ranging from chip development to product lifecycle management.

Cirrus Logic released its new family of closed-loop haptic drivers, its CS40L51, CS40L52, and CS40L53, the company’s first haptic driver solutions compliant with AEC-Q100 automotive standard. The released solutions are moving Cirrus Logic’s proficiency within consumer electronics to automotive applications with the goal of bringing more consistency to in-cabin interfaces.

Arteris, Inc. has come to an arrangement to obtain Cycuity, Inc. Cycuity’s technology and knowledge strengthens Arteris’ current product portfolio, allowing engineers to better understand and improve security while transmitting data in chiplets and SoCs.

Avalue Technology Inc. announced the ECM-ASL3 3.5-inch industrial single-board computer compatible with Intel Alder Lake-N, Amston Lake, and even Twin Lake platforms permitting rapid upgrades to product lines with minimal adjustments. The solution is ideal for edge AI, smart manufacturing, automation, automotive equipment and medical monitoring.

APLEX Technology Inc. released its NuTAM series presenting the stainless-steel, fanless touch panel PC NuTAM-9E leveraging Intel Core Ultra 5/7 processors. Built on the Intel 4 compute tile technology, the Core Ultra features a hybrid architecture of Performance-cores (P-cores) and Efficient-cores (E-cores), integrated CPU, Intel Arc GPU, and NPU capabilities. The solution comes in three display sizes including 15”, 17”, and 21.5” TFT-LCD.

RunSafe Security recently released its 2025 report, AI in Embedded Systems: AI is Here. Security Isn’t. The report focuses on how AI use is expanding across embedded software development. It offers insights into what the data indicates for engineering, product, and security leaders who are integrating AI into workflows.