Embedded Computing Design

GÖPEL electronic's announced its newest integration of embedded JTAG solutions for the SPEA 3030 DualCore in-circuit tester (ICT) specifically designed for high-volume manufacturing enabling concurrent processing of multiple UUTs with two ICT core executing test sequences simultaneously. Each core has integrated SCANFLEX II BLADE 8 RMx1-A/B/C with inputs including JTAG, SWD, SBW, BDM, and PIC.

Avalue Technology Inc. introduced its AIB-NINX-S, AIB-NINX-SC, AIB-NIAO-S supporting integrated AI SDK, HW, and I/O leveraging the NVIDIA Jetson family. The devices were developed for applications such as AI edge computing, AGV/AMR, defect inspection, traffic monitoring, and medical imaging where object or face detection is needed.

Lanner introduced its ECA-6051, a 2U short-depth edge AI server leveraging NVIDIA MGX reference architecture and NVIDIA’s GH200 Grace Hopper Superchip for 5G edge AI inference. It was developed to enable efficient data transmission with real-time analysis utilizing high bandwidth 5G connectivity.

Ezurio released its certified rugged industrial IoT module, the Sona TI351 Wi-Fi 6 + Bluetooth v5.4 built on the Texas Instruments CC3351 chipset. It supports SDIO and UART interfaces, industrial operating temp range, Wi-Fi and BT LE, utilizing SMT M.2 packaging.

Austin, Texas. VORAGO Technologies and Collabora announced they are partnering to advance the use of open source to realize flexibility for mission critical applications outside of earth’s orbit.

Taipei, Taiwan. VIA Technologies introduced its new fanless NVIDIA Jetson-powered platforms, the VIA AMOS-9100 for Autonomous Mobile Robots (AMRs) and Automated Guided Vehicles (AGVs), and the VIA AMOS-9000 for factory safety and automation, both ideal for innovative AI performance, robust connectivity, and durability.

Sheffield, United Kingdom. sureCore is now licensing its CryoMem suite of Memory IP developed for utilization in very low temperatures necessary for Quantum Computing (QC) applications. This came about at an *Innovate UK-funded consortium to develop cryo-tolerant semiconductor IP. The goal of the project was to design and prove a range of foundation IP that can be licensed to engineers enabling the creation of specific custom Cryo-CMOS SoC solutions. According to the press release, this will help accelerate QC scaling by allowing the migration of the control electronics into the cryostat to be close to the qubits.

Torrance, California. Navitas Semiconductor introduced what it has billed as the world’s first 8.5 kW power supply unit (PSU) powered by GaN and SiC technologies to achieve 98% efficiency, for next-generation AI and hyperscale data centers. The 54V output PSU, optimized for AI applications, complies with Open Compute Project (OCP) and Open Rack v3 (ORv3) specifications while leveraging GaNSafe and Gen-3 Fast SiC MOSFETs arranged in 3-phase interleaved PFC and LLC topologies.

Atlanta, Georgia. MSI introduced its CG480-S5063 AI server based on the NVIDIA MGX architecture and DC-MHS server lineup powered by Intel Xeon 6 processors delivering scalable performance and flexibility leveraging dual Intel Xeon 6 processors and 8 FHFL dual width GPU slots, enabling the power of the NVIDIA H200 NVL GPUs. The CG480-S5063 supports 32 DDR5 DIMM slots and 20 PCIe 5.0 E1.S NVMe bays for managing data intensive applications. According to MSI, its Intel Xeon 6 processor-based DC-MHS servers and server motherboards deliver scalability and flexibility ideal for data center and HPC environments.

Austin, Texas. Ambiq is joining the Edge Impulse network to deliver scalable AI models on the Apollo4 Plus System-on-Chip (SoC) ideal for edge AI such as speech, health, and more AI applications. The Apollo4 Plus utilizes Subthreshold Power Optimization Technology (SPOT) to achieve 10X more proficiency for AI processing vs. other Arm M4-based solutions.

 

Avalue’s new waterproof, dustproof, and shockproof touchscreen panel PC SPC-10W35 leverages the Intel Celeron J6412 processor (codenamed Elkhart Lake). It has earned IP65/54 making it ideal for automated industries, manufacturing industry, food processing, and pharmaceutical laboratories.

Munich, Germany. NOVOSENSE Microelectronics and Continental Automotive Technologies are partnering on the design of automotive-grade sensors to develop safer vehicle systems including safety functions and system reliability, from airbag triggers to battery pack monitors. A signed memorandum will extend cooperation to the development of sensor ICs as well as for the global integration of NOVOSENSE’s products within Continental’s worldwide platforms.

Chicago, Illinois. Littelfuse, Inc. expanded its NanoT tactile switch family featuring miniature, surface-mounted, waterproof tactile switches, now incorporating new operational force options and top- and side-actuated models. According to the press release, the series is the smallest tactile switch solution available today.

AAEON's UP brand released the UP 710S, the next generation credit card sized single-board with adjusted height measuring at just 25.13mm. The solution’s size, when compared to previous models, does not reduce I/O options. The UP 710S upholds key features like GPIO, I2C, SPI, and COM that were possible via a 40-pin HAT through dedicated wafers.

San Jose, California. Point2 Technology introduced the Point2 P1B12,1 its innovative Smart Retimer system-on-chip (SoC) for AEC applications in hyperscale AI/ML datacenters. It incorporates eight-unidirectional SerDes channels with smart Clock Data Recovery (CDR)/Retimer operations that support 112G PAM4 and 56G NRZ data rates. The Point2 P1B121 is designed for low-power and low-latency operations in 800 gigabit (800G) and 1.6 Terabit (1.6T) Active Electrical Cables (AECs). At 3 nanoseconds (3ns), the P1B121 chip latency is 20X lower than standard DSP-based PAM4 Retimers.


 

As the need for faster, more efficient data processing increases, Field Programmable Gate Arrays (FPGAs) are a fundamental technology bridging the gap between traditional hardware accelerators and cutting-edge applications like Artificial Intelligence (AI). They are becoming a critical building block for innovations from edge computing to cloud infrastructure.

Axiomtek announced its P117-ADL-TRA 17” industrial touch panel PC supporting applications such as multimedia kiosks, heavy-duty industrial computing, and factory automation. The PC delivers enhanced performance and flexibility by leveraging scalable 13th/12th Gen Intel Core i7/i5/i3 or Pentium processors with the Intel H610 chipset. Consistent image display is managed by the XGA TFT LCD display with a 5-wire resistive touchscreen and 250 nits of brightness.

Wincomm shared that its WMP-27T-PIS series has earned the Taiwan Excellence Award 2025, granted by the Ministry of Economic Affairs. The award identifies products with innovative performance in research and development, design, quality, and market impact, while emphasizing the assurance it is "made in Taiwan."

Emproof and DDC-I introduced a partnership to deliver advanced security solutions for Deos-based systems outlined in the whitepaper, Advanced Embedded Security with DDC-I Deos and Emproof Nyx. The collaboration combines the capabilities of DDC-I’s Deos real-time operating system (RTOS) with Emproof’s security solution, Emproof Nyx addresses threats such as reverse engineering and exploitation attacks while supporting customized protection.

Collabora announcd a partnership with MediaTek that is empowering Collabora to establish, develop, and maintain MediaTek's IoT Edge AI Genio platforms upstream. The objective is complete support for the official Evaluation Kit (EVK) in Debian and other Linux distributions.