Embedded Computing Design

XELA Robotics announced it has integrated its uSkin sensors into a Tesollo DG-5F five-fingered human sized robotic hand with independent joint control. Due to the integration of XELA Robotics’ tactile sensors, the hand acquired a human-like sense of touch without changing its original size.

IBASE Technology Inc. introduced its MAF801 Edge AI platform powered by 14th/13th/12th Gen Intel Core processors offering dedicated GPU expansion slots to meet the computational demands of AI applications including industrial automation, machine vision, intelligent robotics, and high-density AIoT.

Solid Sands B.V. recently announced that it is acquiring Plum Hall technology and test suites. According to the company, the acquirement will allow Solid Sands the ability to extend its market value and open new corridors for growth while delivering innovative solutions.

AAEON introduced its COM-ARHC6, a COM Express Type 6 Compact Size module (95mm x 95mm) leveraging the Intel Core Ultra Processors (Series 2) platform (formerly Arrow Lake) including the Intel Core Ultra 9 Processor 285H, Intel Core Ultra 7 Processor 255H, and Intel Core Ultra 5 Processor 225H offering up to 99 TOPs of AI performance.

NEXCOM International and Stereolabs publicized a new partnership aiming to deliver cutting-edge AI vision solutions for B2B organizations across mobility, robotics, and industrial automation sectors. The collaboration will see the integration of Stereolabs’ ZED X series cameras with NEXCOM’s ATC series Edge AI computers.

Hilscher announced its latest embedded module, the comX 90, designed for next-generation communication interfaces utilized in industrial devices. Within a compact form factor, the module combines multiprotocol communication, integrated security functions, and IIoT capability.

iDEAL Semiconductor introduced its SuperQ MOSFET technology, a solution built to answer the challenge of critical safety and efficiency trade-off in high-voltage (72V and higher) battery management systems (BMS). According to the press release, the company promotes this new platform as having set a new industry benchmark for short-circuit withstand capability (SCWC), a fundamental safety metric for the BMS discharge switch.

Darveen expanded its DPC-9000 Series with the addition of its IP65-rated Intel Alder Lake-N N97 platform. The DPC-9000 Series delivers enhanced computing power, faster multitasking, and higher power efficiency ideal for real-time data acquisition, responsive touch interaction, and graphical interfaces.

SINTRONES Technology announced the renewal of its IRIS ISO 22163 (International Railway Industry Standard) certification and as a Taiwan Excellence Award 2026 winner for its edge AI rugged computer, the IBOX-650P-IP66.

During January 6–9, 2026 in Las Vegas, Nevada at CES, EMASS will exhibit its ECS-DoT system-on-chip (SoC). The SoC is considered a milliwatt-class, on-device AI platform designed to deliver always-on intelligence with ultra-low latency and reduced power consumption.

Wincomm will be present in Düsseldorf, Germany at MEDICA 2025 (Hall 12, Booth B25) showcasing its WMP-22U and WMP-24U mobile medical panel PCs. According to the company, the PCs promote its INNOVALUE campaign - Innovation with Value, redefining mobility, intelligence, and hygiene in modern healthcare environments. Both leverage the latest Intel Core Ultra 225U/255U processors with integrated CPU/NPU/GPU architecture.

CES 2026 will welcome Dr. Lisa Su, Chair and CEO of AMD, as a keynote speaker. Taking place Monday, January 5^th at 6:30p.m., Dr. Su’s address will focus on AMD’s vision for delivering future AI solutions from cloud to enterprise, edge and devices.

CES 2026 welcomes Joe Creed, Caterpillar CEO, as a keynote speaker offering insights on how Caterpillar has stayed relevant for 100 years, and how he envisions the next 100. “CES is where innovators show up and bold ideas come to life,” said Gary Shapiro, CEO and Vice Chair, CTA. “I’m thrilled to welcome CEO Joe Creed and Caterpillar to the CES keynote stage to show how technology is transforming the way we build.”

Through three days (November 4-6), the Anaheim Convention Center hosted embedded world North America bringing together design engineers, developers, and technology leaders to share and showcase insights and innovations that are moving the embedded industry toward new horizons.

Trident IoT released its multiprotocol Software Development Kit (SDK) and ELCap command-line development tool for general purchase. It delivers multi-protocol, developer directed tools to accelerate Z-Wave, Z-Wave Long Rang and Zigbee based devices.

Wirral, United Kingdom. LDRA announced that its LDRA tool suite now supports enhanced analysis of timing coupling interference on multi-core architectures. Building on previous data coupling and control coupling tools, the new abilities present designers further insight into multi-core performance while allowing them to mitigate timing issues.

Akasa released the Kepler, a 2U rack-mountable, fanless case for Micro-ATX and Mini-ITX motherboards. It supports passive cooling for Intel Core (12th-14th Gen) and Core Ultra (15th Gen) processors up to 35W TDP utilizing Intel LGA1851 and LGA1700 sockets.

RuggON released its VULCAN 10A commercial-grade 10.4” Android vehicle mounted computer engineered for reliable consistency across challenging industrial environments. The CPU leverages the Qualcomm QCS 6490 CPU and runs Android 14 with Google Mobile Services (GMS) certification.

Kigen has announced that Evergy, one of the largest investor-owned utilities in the U.S. Midwest serving 1.7 million customers, has elected to utilize Kigen’s secure eSIM OS and GSMA SGP.32–compliant eIM solution to strengthen grid reliability and resilience.

VadaTech announced its PCI594 built on the Xilinx VU13P UltraScale+TM FPGA providing over 12,000 DSP slices, 360 Mb of UltraRAM, and 3,780K logic cells. To allow large buffer sizes stored during processing as well as for queuing the data to the host, the FPGA interfaces to the quad QSFP28 modules as well as a single DDR4 memory bank that is 64-bit wide with 16 GB total.