Embedded Computing Design

Recently Arm introduced its Armv9 edge AI platform featuring the new Arm Cortex-A320 CPU and the Arm Ethos-U85 NPU, a leading AI accelerator delivering efficient and secured intelligence at the edge. The solution provides an 8x improvement in machine learning (ML) performance compared to the Cortex-M85-based platform launched last year.

Connect Tech, an NVIDIA Elite Partner, will attend NVIDIA GTC, where at Booth 245, its experts will be available to showcase demonstrations that highlight Gen AI at the Edge. Demos will include the integration of generative AI models and RAG techniques on Anvil for NVIDIA Jetson AGX Orin, demonstrating how Agentic AI applications can help solve real-world smart city problems, and another that highlights the ROS2 and NVIDIA Isaac ROS optimization services for high-performance robotics development.

QNX will be stationed in Hall 4, Booth 544 during embedded world where it will welcome attendees to learn more about its new solutions for mission-critical embedded applications. Highlights will include QNX Embedded General Software Platform, QNX Everywhere, QNX OS 8.0 in the Cloud, as well as a robotic arm demonstration.

At embedded world 2025, Ceva (Hall 4, Booth 462) will highlight its leading-edge wireless communications and Edge AI IP innovating smart edge devices for the future. Enabling seamless edge intelligence, Ceva’s solutions allow billions of devices to connect, sense, and analyze data efficiently. Ceva will demonstrate how AI-driven connectivity is a growing importance with advancements in Bluetooth technology and fresh use cases for edge NPUs in embedded ML applications.

Edge Impulse (Hall 4, Booth 505) will highlight collaborations with leading silicon partners, including STMicroelectronics, at embedded world 2025 with its in-booth demonstrations such as the STM32N6, ST’s new flagship microcontroller, which delivers a 600x performance gain over current high-end STM32 microcontrollers thanks to the integration of the Neural-ART Accelerator, an advanced NPU from STMicroelectronics.

NEXCOM, an Intel Titanium partner, will exhibit its innovative products and solutions that leverage Intel CPUs during embedded world in Hall 5, Booth 235. Amongst the highlights will be the Neu-X304 edge computer system powered by 12/13th Gen Intel Core Processor and the VTC 6232-C4SIP fanless 4-CH PoE in-vehicle computer with Intel Atom x7433RE.

Visitors to Hall 3, Booth 257 at embedded world will witness the ASUS IoT RUC-1000G, an innovative edge AI computing platform designed for seamless AI deployment, system integration, and high-performance GPU utilization. The solution is powered by Intel’s Core Ultra S-series processors with W880 chipset, PCIe 5.0 support, and a modular half-rack design for scalable AI applications.

SAPPHIRE Technology is introducing the SAPPHIRE EDGE+ VPR-5050 Series and products from its EDGE AI SERIES during embedded world. Hall 5, Booth 322 will demonstrate the EDGE + MB series featuring the EDGE+ VPR-5050-MB and EDGE+ VPR-5050A-MB Mini-ITX motherboards, ideal for AI acceleration, industrial automation, and edge computing. The solutions leverage AMD Embedded+ architecture with integrated AMD Ryzen Embedded V2748 processors with AMD Versal AI Edge adaptive SoCs.

congatec, an Intel Titanium partner, will be exhibiting its new Computer-on-Modules at embedded world (Hall 3, Booth 241) leveraging the latest Intel technologies from the credit card sized conga-SA8 SMARC module built with low-power Intel Core 3 technology to the high-performing conga-HPC/cBLS COM-HPC Client module utilizing intel Core S processor technology.

Austin, Texas. Earlier, Emerson released new additions to its data acquisition (DAQ) lineup, including the NI cDAQ-9187 and cDAQ-9183 Ethernet chassis and NI 9204 input module. Access to a GitHub repository for NI FlexLogger DAQ software plug-ins is available leading to lower costs for operating high-performance test and measurement systems over Ethernet.

Stutensee, Germany. Tria Technologies, an Avnet company, will launch five innovative families utilizing Qualcomm’s Dragonwing and Snapdragon platforms at embedded world. The solutions deliver powerful computing and efficiency for the next generation of IoT devices. The enhanced AI performance opens innovation for AI deployment at the edge.

AAEON, a Titanium member of the Intel IoT Solutions Alliance, will be in Hall 1, Booth 306 at embedded world highlighting its edge AI hardware platforms. Its collaboration with Intel aims to bring innovative products to market and implement edge AI solutions through bilateral initiatives, shared practices, and joint goals.

At embedded world 2025, Advantech will be in Hall 3, Booth 339 showcasing its series of Edge Computing and Edge AI solutions leveraging Intel’s innovations including Bartlett Lake S, Arrow Lake, Twin Lake, Sapphire Rapids-W, and Battlemage. Demonstrations will include AI-powered defect detection, edge AI Server, and embedded boards.

Supermicro will demonstrate its latest lineup of infrastructure solutions supporting edge AI and IoT applications. Visit Hall 1, Booth 208 at this year’s embedded world with highlights including Supermicro's SYS-E403-14B, 3U SYS-322GA-NR system, and a range of compact and fanless platforms.

embedded world will host AntennaWare at Booth 3-109 where it will highlight its BodyWave antennas. AntennaWare will demonstrate the improved connectivity of BodyWave antennas for wearables, effectively addressing detuning and body blocking issues that interfere with signals, even in non-line-of-sight (NLoS) scenarios.

While attending embedded world, stop by Booth 4-738 where MICROIP will showcase its innovations in ASIC design integration and AI software services. Demonstrations will include solutions engineered for the increasing demand of high-performance, low-power semiconductor technologies.

Vecow will showcase its latest AI-accelerated solutions for edge computing, mobile robots, spatial AI, thermal solution, and Generative AI at this year’s embedded world (Hall 3, Booth 449).

Sealevel team members will be on hand at embedded world 25 (Hall 3, Stand 555) where they will showcase solutions for test and measurement, manufacturing automation, complete system control, and military and aerospace. Another main attraction will be the international introduction of Sealevel’s newest addition to its Relio industrial computer line, the R1 Edge.

ADLINK Technology Inc. will showcase its latest advancements in Hall 3, Booth 147 at embedded world 2025 where its motto will be "Greener Tech, Smarter Edge AI" promoting the company’s dedication to sustainability, intelligent Edge, AI, and Smart Manufacturing. ADLINK will highlight its solutions designed to reduce energy consumption and optimize operational efficiency.

Smiths Interconnect will be located at Hall 4a Booth 606 during this year’s embedded world, where it will showcase its SpaceABLE^® 10G SL Series and 28G SL Series radiation-resistant onboard embedded optical transceiver modules delivering radiation hardness, robustness, longevity, and high I/O density.