Embedded Computing Design

Join Ambarella at Hall 5, Booth 5-355 during embedded world Germany where it will exhibit its AI SoCs, software stack, and developer tools that help teams build, integrate, and deploy edge AI solutions at scale. The booth is centered on the theme “The Ambarella Edge: From Agentic to Physical AI” and will have live demos highlighting innovations that offer a competitive advantage across various AI applications, from agentic automation and orchestration to physical AI systems operating in real-world environments.

Innatera will be in Hall 3A, Booth 3A-430 at embedded world Germany, exhibiting its expanding portfolio of neuromorphic deployments developed with partners and customers. The booth focus is not just on how to implement architecture, but how brain-inspired computing is applied across sensing, industrial monitoring, and intelligent devices.  

At embedded world Germany, Solectrix Medical (Hall 4A, Booth 152) will exhibit an Open Standard Module (OSM) in the Size-M format based on the NXP i.MX 95 applications processor. The module was designed for a leader in the medical industry as part of its system strategy for diagnostic devices.

Sundance will attend embedded world Germany where it will be located at the OpenSystems Media stand, Hall 1, Booth 500, showcasing its innovative SMT135-C. During the event, Chris Bowers, Sundance’s FPGA specialist, will lead an in-depth technical session on the SMT135-C where he will discuss the module’s highlights, performance capabilities, and suitable deployments. Engineers and developers will gain valuable insights into cutting-edge FPGA applications.

Throughout embedded world Germany (March 10–12, Nuremberg), SECO will be in Hall 1 at Booth 320 where it will focus on its NXP Semiconductors-based solutions. The spotlight will be on SECO’s portfolio built on NXP applications processors, with an emphasis on the i.MX 95 Applications Processors Family.

Rambus Inc. announced its HBM4E Memory Controller IP capable of facilitating innovative HBM memory deployments for next-generation AI accelerators, graphics, and HPC applications. It operates at up to 16 Gigabits per second (Gbps) per pin delivering a throughput of 4.1 Terabytes per second (TB/s) to each memory device. For an AI accelerator with eight attached HBM4E devices, this translates to over 32 TB/s of memory bandwidth for demanding AI workloads.

WITTENSTEIN high integrity systems (WHIS) will attend embedded world Germany where it will be in Hall 4, Booth 337 highlighting its RTOS solutions with proven evidence, global trust, certification leadership, and technology engineered from the ground up for safety critical embedded systems. WHIS offers fully pre-certified, standards compliant solutions purpose-built for safety-critical industries.

Altera will be in Hall 5, Booth 5-329 at embedded world Germany where it is planning to highlight how its Agilex FPGAs are engineered to meet the real-time demands of physical AI systems. Altera’s adaptable FPGA platforms deliver scalable acceleration from multi-sensor ingestion and AI inference to real-time control. Booth demonstrations will show how FPGAs power multi-sensor processing, AI-driven perception, and low-latency decision-making at the edge.

Akasa introduced the AK-CC7409BP01, a low-profile CPU cooler designed for thermally demanding, space-constrained environments. It is compatible with Intel LGA1851 and LGA1700 sockets and has an integrated copper vapor chamber heatsink and a UL-certified side blower fan delivering consistent cooling at 29.5mm in height. It is suited for 1U servers, SFF systems, and other applications where vertical clearance is limited.

TASKING will be highlighting its upgraded compiler at embedded world in Nuremberg March 10-12 (Booth 4-150, Hall 4). It supports the Renesas RH850/U2x microcontroller (MCU) family, including the new RH850/U2C series.

During embedded world Germany (March 10–12, Nuremberg), Infineon Technologies will showcase its latest PSOC microcontrollers, tools, and DEEPCRAFT AI Suite. Stop by Hall 4A, Booth 138 to explore new solutions across many applications and learn ways to accelerate your time-to-market on designs and AI/ML models.  

APLEX Technology Inc. will be in Booth 3-533 at embedded world Germany exhibiting its innovations designed for harsh environments in industries such as oil and gas, food and beverage, maritime, and more. APLEX provides factory automation and food and beverage automation solutions.

Menlo Microsystems Inc. (Menlo Micro) publicized that its collaboration with Purdue University has resulted in a commercial-ready architecture for quantum control and readout electronics at cryogenic temperatures. As published in the Nature Microsystems & Nanoengineering journal, the work explains Menlo Micro’s cryogenic MEMS Ideal Switch platform in scalable quantum computing applications.

Attendees to embedded word Germany will have a chance to stop by hall 2, booth 647 to see Greenliant’s latest portfolio of industrial solid state drives (SSDs) engineered for mission critical applications. Products demonstrated offer advanced endurance, robust data retention, increased data integrity, and stable performance.

Kudelski Labs will be attending embedded world Germany in Hall 3A, Booth 3A-334 showcasing its latest security solutions with live demonstrations. The demos will focus on how semiconductor and device manufacturers can deploy secure and future-ready products at scale while meeting emerging requirements under the EU Cyber Resilience Act.

Trenz will be bringing its lineup of brand-new hardware to embedded world Germany. At its booth, 5-140, Trenz will showcase ten new products (seven AMD-based and three Altera-based solutions) covering everything from budget friendly FPGA platforms and high-IO designs to RF signal processing and next-generation edge AI.

Munich, Germany. Infineon Technologies AG introduced its ModusToolbox Power Suite, a complete software platform for digital power conversion designs based on PSOC Control C3 microcontrollers (MCUs). Included are easy-to-use power conversion libraries, graphical user interfaces (GUIs), visualization tools, and application examples.

At embedded world Germany, Ellisys and Metirionic will collaborate to demonstrate tools and innovations giving designers the ability to evaluate Bluetooth Channel Sounding features and functionalities. Debutting will be an exhibit that combines Metirionic Advanced Ranging Stack (MARS) with the Ellisys Bluetooth Vanguard Advanced Bluetooth Analysis System.

NEXCOM will introduce its tough multi-purpose APPC C21-01 series fanless panel PCs built to meet the growing demands of AI-enabled edge computing and smart factory environments at embedded world Germany. NEXCOM’s booth (Hall 3, Booth 3-341) will display live demos of products focusing on the motto “Unleashing the Ingenuity of Software-Defined Edge Computing”, to emphasize the transformative potential of SD Edge Computing across AIoT and AI applications. The APPC C21-01 series acts as a high-performance bridge between industrial automation and intelligent data processing.

As part of Automate 2026, being held between June 22-25 at McCormick Place, Chicago, will be the third annual Humanoid Robot Forum. Automate also will introduce a dedicated Humanoid Robot Pavilion on the show floor, sponsored by NVIDIA.