Embedded Computing Design

At the 2024 Future of Memory and Storage (FMS), FADU’s CEO, Jihyo Lee, will co-keynote with Meta's Ross Stenfort and Western Digital's Eric Spanneut, unveiling next-generation datacenter solutions focused on low power and high efficiency.

Soracom, Inc. unveiled two offerings intended to expedite the deployment of larger, more complex IoT projects by embedding Generative AI (GenAI) features more comprehensively within the IoT connectivity stack.

Ji-Hyo Lee, CEO of FADU, will deliver a keynote at Future of Memory and Storage on August 6th. The focus will be “Navigating the AI Revolution.” Lee will present an in-depth examination of flash storage innovation as hyperscalers and the AI market expand. He will consider the connection between hyperscaler infrastructure advancements and flash storage demands and discuss the effects on standardization efforts through the Open Compute Project (OCP) and other initiatives.

ATP Electronics announced the N651Si Series E1.S solid state drives (SSDs), designed for performance, endurance, and data retention in the most demanding applications. These SSDs support an industrial temperature range of -40°C to 85°C, and feature hardware power loss protection (HW PLP), ensuring high reliability and cost-effectiveness in rugged environments

Harriet Coverston has contributed significantly to file systems and archival storage systems, showing that high-performance archiving and file systems can be integrated on a large scale. She developed the Quick File System (QFS), which led to the creation of SAM-QFS, the first multi-node clustered file system that incorporated archiving to meet the high-performance scaling requirements of large real-time streaming data systems.

AAEON released two compact and fanless All-in-One Panel PCs, the ACP-1075 and ACP-1078, featuring 7” WSVGA projected capacitive touch screens. The solutions are ideal for industrial and retail markets such as data accumulation, monitoring in manufacturing, and inventory management.

AVerMedia announced the compatibility of its Jetson Orin equipped Box PC family with the latest NVIDIA JetPack 6.0 SDK featuring enhanced AI model performance, support for the latest CUDA and cuDNN libraries, and security features for mission-critical use cases. The latest Board Support Package (BSP) with NVIDIA JetPack 6.0 is available for download.
 

NplusT released its TMC-100, the newest solution in its TESTMESH family. It was developed purposely for dependable evaluation of neuromorphic computational arrays. The TMC-100 is delivered with analog instrumentation such as waveform generators, reference voltages, and current sensing and measurement circuits, while incorporating digital signal competences to support complex test arrays.

San Jose, California. Edge Impulse announced an innovation enabling visual anomaly detection on any edge device, from NVIDIA GPUs to Arm MCUs, through the first model architecture of its kind, FOMO-AD (Faster Objects, More Objects - Anomaly Detection). To enhance the productivity of visual inspection systems, the scalable FOMO-AD can train models to identify and index anything outside set criteria as an anomaly in video and image data.

Hillsboro, Oregon. Lattice Semiconductor added its logic-optimized Lattice Certus-NX FPGA devices to its FPGA portfolio. The Certus-NX-28 and Certus-NX-09 support power efficiency, small size, and adaptable migration preferences. The solutions are built on the Lattice Nexus FPGA platform.

Phoenix, Arizona. Avnet launched Tria, and Tria Technologies, to merge its compute design and manufacturing offerings. “The new brand embodies Avnet’s unique ability to deliver standalone modular embedded compute solutions in a world where OEMs are increasingly looking to move from their own chip-down manufacturing to part- or full- pre-made embedded compute platforms,” said Thomas Staudinger, president of Embedded Solutions, Avnet. “It brings together all of Avnet’s compute design and manufacturing capabilities under one brand.”

Taipei, Taiwan. BIOSTAR released its fanless MS-1315UE/MS-1315URE/MS-1345UE/MS-1345URE industrial application platforms. The flexible solutions leverage the Intel Raptor Lake SoC Core i3 and i5 processors delivering efficiency within CRM SI builds. Users can govern customer contact details, transaction history, accounts, and communications.

From October 8 – 10, embedded world North America will hold its premiere in Austin, Texas. Experts int the embedded systems industry will meet at the Austin Convention Center in the “Silicon Hills” of Texas, USA. embedded world North American is organized by subsidiary NürnbergMesse North America Inc.

Rome, Italy. Exein raised €15 million, led by 33N, an expert investor in cybersecurity and infrastructure software, and Partech joining in. Existing backers United Ventures, eCAPITAL, and Future Industry Ventures (a Redstone/SBI fund) also participated. The funding will support Exein’s growth across Europe, the US, and Asia. 

AAEON released its 70mm x 70mm Qseven form factor AQ7-ADN CPU module leveraging Intel’s innovative processors from the 6W Intel Processor N200 and N50 to the 15W Intel Core i3-N305. For processing speed, the AQ7-ADN offers up to 8GB of high-bandwidth soldered LPDDR5x system memory with up to 64GB of eMMC for storage and SATA support delivering four PCIe slots.

ATTEND launched its 2-in-1 stacked card connector designed to redefine space efficiency and functionality in electronic components. Supporting Micro SD, Nano-SIM, and Micro SIM cards, it enables competent data transfer while optimizing PCB space usage.

blukii unveiled an innovative Bluetooth beacon incorporating the ATM33 system-on-chip (SoC) from Atmosic Technologies. Utilizing Atmosic’s ultra-low power technology, the beacon features the longest battery life in its class.

Santa Clara, California. FMS: the Future of Memory and Storage announced its pre-conference Professional Development Series (PDS) on Monday, August 5^th. The talks will feature four educational seminar tracts giving visitors the chance to earn FMS Professional Development certificates. The seminar presenters are well-respected technologists from Elephance Memory, Meta, Microsoft, OCP, Quantum Technology, Seagate, and Wolley.

During October 8 - 10, 2024 in Austin, Texas, embedded world North America will host leading experts, key players and industry associations in the embedded community. embedded world North America offers an incomparable insight into the world of embedded systems including components and modules to operating systems, hardware and software design, M2M communication to services, and the numerous issues of a complex system design.

Taipei, Taiwan. Neousys has added the waterproof and dustproof NRU-230V-AWP and NRU-240S-AWP series to its Jetson family. The solutions leverage NVIDIA’s Jetson AGX Orin system-on-module with eight GMSL2 ports (NRU-230V-AWP only), four PoE+ GbE, and one 10GbE.