Embedded Computing Design

DATA MODUL will exhibit its new compact single-board computer (SBC), the eDM-SBC-iMX95, March 10–12 at embedded world in Nuremberg, Booth 368, Hall 1. The SBC is centered around the latest NXP i.MX95 application processor series and is designed for challenging industrial environments. The eDM-SBC-iMX95 leverages a Hexa-core ARM Cortex-A55 processor with up to 16 GB LPDDR5 RAM (soldered) and up to 128 GB soldered eMMC.

ByteSnap Design launched its WirelessHART product development and certification support services offering wireless communication in process automation and control applications to industrial manufacturers facing comprehensive technical and regulatory challenges when deploying wireless devices in hazardous environments.

PX5 publicized the off-the-shelf functional safety certification of the PX5 NET embedded TCP/IP stack, and in turn, making all three PX5 core products, PX5 RTOS, PX5 FILE, and PX5 NET, now SGS-TÜV Saar certified.

Axiomtek introduced its IMB711, an ATX server-grade motherboard leveraging the Intel C741 chipset. It is powered by the LGA4677 socket for 5th/4th Gen Intel Xeon Scalable processors with up to 270W TDP. The IMB711 is designed for mission-critical applications across AI acceleration, data centers, and advanced healthcare systems.

BIOSTAR announced a new dual-track edge computing approach for its EdgeComp industrial computing portfolio focusing on the growing needs of IoT deployments and edge AI applications. It allows system designers to deploy purpose-built platforms created for specific application requirements. EdgeComp offers two specialized solution paths, the EdgeComp MU-N150 is enhanced for edge computing and IoT environments, while the EdgeComp MS-NANO is engineered to deliver intensive edge AI workloads, including AI vision and intelligent automation.

embedded world Germany 2026 will have PLS Programmierbare Logik & Systeme unveiling the UDE 2026 of the Universal Debug Engine in Hall 4, Booth 4-310. Also on exhibition will be an expanded collection of supported high-end microcontrollers and embedded processors.

Lanner Electronics launched a robotic AI platform designed for next-generation physical AI. The EAI-I351 is designed around the NVIDIA Jetson Thor system-on-module (SoM) to deliver server-class performance for autonomous mobile robots (AMRs), heavy-duty industrial vehicles, and edge-native generative AI applications.

Qbic Technology announced its Industrial Series that integrates Qbic’s compute, control, and HMI innovations into a unified architecture supporting the full lifecycle of industrial device development, from prototyping to deployment. The cohesive design allows users to move beyond fragmented development, and instead, develop reliable long-term product roadmaps.

albatron.ai introduced its TALO-F1200GU, a compact, time-synchronized inertial navigation system (INS) built on the Xilinx Zynq UltraScale+ MPSoC and engineered to deliver efficient consistency to time-delicate data for autonomous mobile robots (AMRs), drones, and robotic applications. The TALO-F1200GU is the first product in albatron.ai’s NeuronEdge solution portfolio.

Aetina Corporation launched its forward looking MXM AI Accelerator Module series accelerated by NVIDIA RTX PRO Blackwell Embedded GPUs. It is part of its CoreEdge MXM AI Module family. By leveraging the NVIDIA Blackwell GPU platform, AI performance has three times more performance power when compared to previous models. The modules integrate innovative AI, ray tracing, and neural graphics technologies.

Avalue Technology delivers a broad portfolio of solutions expanding embedded systems, single-board computers (SBCs), and Edge AI platforms, all supporting real-time data acquisition and processing requirements for smart city, transportation, manufacturing, and retail applications.

During NRF 2026, MediaTek exhibited its wide ranging portfolio of connected solutions for the next generation of smart retail capabilities. MediaTek revealed a performance-optimized IoT platform combining 5G and Wi-Fi 7 support with powerful edge AI and multimedia abilities. The solution is powered by an octa-core ARMv9 CPU and embedded NPU to support generative AI.

SAPPHIRE Technology announced the SAPPHIRE EDGE+ VPR-7P132, a Mini-ITX AMD Embedded+ motherboard engineered as a flexible, high-performance solution for real-time AI, sensor processing, and edge computing applications. The platform leverages the AMD Ryzen AI Embedded processors with AMD Versal AI Edge Series Gen 2 adaptive SoCs on a single board.

Ambiq Micro, Inc. introduced its Atomiq system-on-chip (SoC) that incorporates a Neural Processing Unit (NPU) engineered to facilitate real-time, always-on artificial intelligence at the edge. The SoC is built on Ambiq’s Subthreshold Power Optimized Technology (SPOT) platform. Atomiq is designed to tackle the problem of scaling device intelligence without compromising battery life or increasing thermal and system costs in edge AI applications.

Axiomtek released the eBOX100B, a fanless embedded system powered by the Intel Processor N150 (Twin Lake) and 8GB LPDDR5 onboard memory (16GB optional) in an energy-efficient design. Despite its compact 155 × 110 × 60 mm form factor, the solution offers a variety of I/O including 2.5GbE LAN, HDMI, COM, USB, and an 8-channel DIO. Designers can simply enhance functionality through M.2 and Mini PCIe slots, allowing NVMe SSDs, Wi-Fi/LTE modules, or custom interfaces without redesign.

Phison Electronics publicized expanded capabilities for its aiDAPTIV+ technology extending its advanced AI acceleration to integrated GPU frameworks accelerating inference, increasing memory capacity, and simplifying deployment to unlock large-model AI capabilities on notebook PCs, desktop PCs, and mini-PCs.

While at CES 2026, Skyworks Solutions, Inc. announced its SKY66424-11, a solution the company highlights as the industry’s first vastly integrated Wi-SUN/LoRaWAN RF front-end modules (FEM) developed for smart home and city applications.

Ironwood Electronics released a 19x19mm body, 22X22 array 484 ball BGA package that can be SMT affixed to a top adapter or placed inside a compression mount socket fitted to the top adapter. As for the bottom adapter, it is attached to the target PCB using reflow. Both top and bottom adapters can be plugged and un-plugged several times and operate without conceding performance in rugged automotive applications.

EdgeCortix Inc. publicized its edge AI co-processor, the SAKURA-II, exhibited high levels of radiation resiliency in NASA’s heavy ion testing conducted at Texas A&M Cyclotron showing that the SAKURA-II is ideal for low Earth orbit applications as well as geosynchronous orbit, and lunar operations.

InnoPhase IoT, Inc. showcased its Green Tea Studio (GTS) integrated development ecosystem for its Talaria 6 Family of System-on-Chips (SoCs) during CES 2026. The solution delivers access to existing open-source development environments and third-party software. This allows current MCU applications and solutions to be seamlessly ported while facilitating the development of new IPs.