Embedded Computing Design

Axiomtek released the eBOX100B, a fanless embedded system powered by the Intel Processor N150 (Twin Lake) and 8GB LPDDR5 onboard memory (16GB optional) in an energy-efficient design. Despite its compact 155 × 110 × 60 mm form factor, the solution offers a variety of I/O including 2.5GbE LAN, HDMI, COM, USB, and an 8-channel DIO. Designers can simply enhance functionality through M.2 and Mini PCIe slots, allowing NVMe SSDs, Wi-Fi/LTE modules, or custom interfaces without redesign.

Phison Electronics publicized expanded capabilities for its aiDAPTIV+ technology extending its advanced AI acceleration to integrated GPU frameworks accelerating inference, increasing memory capacity, and simplifying deployment to unlock large-model AI capabilities on notebook PCs, desktop PCs, and mini-PCs.

While at CES 2026, Skyworks Solutions, Inc. announced its SKY66424-11, a solution the company highlights as the industry’s first vastly integrated Wi-SUN/LoRaWAN RF front-end modules (FEM) developed for smart home and city applications.

Ironwood Electronics released a 19x19mm body, 22X22 array 484 ball BGA package that can be SMT affixed to a top adapter or placed inside a compression mount socket fitted to the top adapter. As for the bottom adapter, it is attached to the target PCB using reflow. Both top and bottom adapters can be plugged and un-plugged several times and operate without conceding performance in rugged automotive applications.

EdgeCortix Inc. publicized its edge AI co-processor, the SAKURA-II, exhibited high levels of radiation resiliency in NASA’s heavy ion testing conducted at Texas A&M Cyclotron showing that the SAKURA-II is ideal for low Earth orbit applications as well as geosynchronous orbit, and lunar operations.

InnoPhase IoT, Inc. showcased its Green Tea Studio (GTS) integrated development ecosystem for its Talaria 6 Family of System-on-Chips (SoCs) during CES 2026. The solution delivers access to existing open-source development environments and third-party software. This allows current MCU applications and solutions to be seamlessly ported while facilitating the development of new IPs.

Telit Cinterion mentioned it will collaborate with Nokia to deliver mission-critical and heavy industries with innovative mission-critical communication and in-network compute capabilities. The partnership will integrate Telit Cinterion’s cellular, satellite, and Wi-Fi communication modules with Nokia’s Cognitive Digital Mine (CDM) platform.

CES 2026 saw the introduction of the NVIDIA Jetson T4000 module, and with it, the announcement of AAEON’s development timeline (expected to be available in Q2 of 2026) for its BOXER-8742AI, built on the T4000 module. AAEON commented that its BOXER-8742AI delivers features designed to operate production-ready performance, massive AI compute, and sensor capabilities for physical AI applications in integrated fanless embedded AI systems.

Ambarella, Inc. is highlighting its CV7 edge AI vision system-on-chip (SoC) at CES 2026. The solution is built for a variety of AI applications including AI-based 8K consumer products, multi-imager enterprise security cameras, robotics, industrial automation, and high-performance video conferencing devices.

During CES 2026, Bosch Sensortec will showcase its BMI5 platform introducing its three models, the BMI560, BMI563, and BMI570. The solutions are considered by the company as a new generation of inertial sensors engineered to deliver efficient performance across multiple device classes.

Visit femtoAI at CES 2026 in Las Vegas from January 6–9, with an open house on January 7th from 5 p.m.–7 p.m. at the Venetian Hospitality Suite. The company recently announced that it has had a banner year of growth with milestones that include shipping over 100,000 units of its Sparse Processing Unit (SPU) AI accelerator, closing a new funding round, launching a growing developer community, and strategically expanding its executive leadership team to drive future scale.

Dracula Technologies will exhibit LAYER V2.0 at CES 2026, its updated organic photovoltaic (OPV) technology that delivers a 30 percent increase in overall performance when juxtaposed with the prior generation. LAYER V2.0 supports higher power output for similar surface area, or comparable performance from a reduced module footprint.

Greenliant recently acknowledged that its small form factor (16mm x 20mm) NVMe NANDrive EX Series ball grid array (BGA) solid state drives (SSDs) are being sampled in industrial, aerospace, and mission critical programs.

Akasa released the compact (68.4 x 96 x 37.3 mm) Skyline 3 Pro, an aluminum fanless case with a skyline-shaped top cover and engineered to allow full access to the ASUS Tinker Board 3 and 3S single-board computers (SBCs) interfaces.

Microelectronics US 2026 will be held from April 22–23 at the Palmer Events Center in Austin, Texas. Registration for the event is now open, and it is expected to bring together experts from leaders in semiconductors, photonics, and embedded systems with a goal to accelerate collaboration across design, manufacturing, and innovation.

During January 6-9, ETAS (Booth 16203) will showcase its calibration tools in the Microsoft Marketplace at CES 2026 in Las Vegas. It is the first time ETAS products will be offered on Azure, and demonstrations will show how the tools accelerate the digital transformation of automotive development through cloud technology.

IBASE Technology Inc. released the Intel Core Ultra 100U powered ASB200-962U, a small form factor fanless edge AI computer engineered for efficient and reliable AI inference. It supports up to 96GB DDR5 memory and delivers I/O connectivity allowing for seamless integration with cameras, sensors, and peripheral components.

Rapidus Corporation announced its release of a suite of AI design tools to support its Rapidus AI-Assisted Design Solution (Raads), an initiative to help realize its Rapid and Unified Manufacturing Service (RUMS) concept.

At Venetian Expo Booth #50752, intoPIX will demonstrate its innovations in real-time, low-power image processing and video compression for manufacturing applications during CES 2026. The company is also celebrating its 20th anniversary and an Emmy Award acknowledging its dedication to the JPEG XS standard.

Accenture has agreed to acquire a 65 percent interest in US-based AI data center engineering and consulting firm DLB Associates and its affiliated companies (collectively “DLB”). The purchase will extend Accenture’s end-to-end data center abilities.