Embedded Computing Design

SAPPHIRE Technology introduced the rugged production-ready EDGE+ Apex SOM/Carrier Robotics Platform engineered to accelerate the development and deployment of physical AI in autonomous robotics. The EDGE+ Apex platform is built for continuous operation in robotics deployments.

oToBrite announced the compact GMSL2 Repeater, a solution that doubles rugged camera-to-SoC transmission to 30 meters on large machines. Without changing the camera architecture or the location of the compute unit, a repeater can regenerate the GMSL2 signal at the midpoint of the link, doubling the 15-meter reach of a standard GMSL2 connection.

Astera Labs, Inc. has expanded its 200G Taurus family with Taurus 3.2T Smart Signal Conditioners that now include footprint-compatible 3.2T bi-directional 16-lane Smart Retimers and Smart Redrivers for 200G-per-lane Ethernet, UALink, and ESUN connectivity in AI infrastructure. Taurus’ new Smart Swap feature is built on the OCP Signal Conditioner Standard Footprint and enables operators to make late-binding decisions between footprint-compatible retimers and redrivers.

Newark publicized it has begun a partnership with Hailo with the goal to expand access to high-performance AI solutions for global customers. Newark is now offering Hailo’s AI products through its worldwide distribution network, e-commerce platforms, and engineering community. This will allow engineers, developers, and enterprises to efficiently integrate advanced edge AI capabilities into their edge designs at scale.

Currently testing Bluetooth devices regularly halt at a manual check in a phone app, however, SimpleBLE now provides the same BLE functions into repeatable test benches, production tools, and device SDKs.

TITAN Haptics introduced TITAN Haptics Launchpad in the United States in a bid to extend its global haptics engineering proficiency to hardware startups designing next generation solutions where tactile interaction strengthens user experience, product differentiation, and perceived quality.

WINSYSTEMS released its rugged 3.5-inch single board computer (SBC), the SBC35-474. The SBC is powered by the Intel Atom x7000RE Series (Amston Lake) processors and engineered for industrial OEMs, system integrators, and critical infrastructure operators. It combines scalable processing performance, extensive I/O, and expansion options, with long-term product availability.

Sundance Multiprocessor Technology Ltd. launched its compact embedded computing platform, the VCS³ Stack. The solution combines heterogeneous computing, advanced sensor integration, and industrial connectivity by leveraging the AMD Zynq UltraScale+ MPSoC-based Single-Board Computer (SBC). The complete system weighs just 70 grams, making it one of the lightest stacks currently available.

APLEX Technology Inc. released its Intel Processor N97 powered ACS-330 Embedded Edge AI Controller supporting up to 32GB of DDR5 memory while providing dependable computing performance in a low-power design.

Automate 2026 welcomed Murrelektronik and six new products the company was promoting. The automated solutions showcased how machine builders and system integrators can streamline system design while expanding flexibility, performance, and scalability. The solutions are said to support the continuous move to modular, decentralized automation by reducing complexity across safety, connectivity, power distribution, and IO-Link integration.

Arteris, Inc. shared that Speedata deployed Arteris FlexNoC technology in its Callisto processor. The Speedata Analytics Processing Unit (APU) runs Apache Spark SQL, AI Data Preparation, Agentic Analytics, and batch ETL workloads natively in silicon. Arteris FlexNoC provides the on-chip interconnect that connects compute, memory, and I/O across the design, delivering the bandwidth and scalability these workloads demand.

Avalue Technology Inc. released the RIVAR-1539 Industrial Panel PC Platform that leverages the latest Intel Twin Lake N150 Processor. The RIVAR-1539 combines a low-power computing architecture, fanless design, industrial-grade reliability, and extensive I/O connectivity. The solution is built for Smart Service Applications.

AAEON released information that it is partnering with The Imaging Source, manufacturer of industrial cameras. AAEON’s BOXER-8645AI is compatible with The Imaging Source’s Acuva series of rugged, high-speed GMSL2 IP67 cameras. The companies will combine to build solutions for vision-enabled applications in robotics, agriculture, automotive, and other embedded and industrial vision systems.

NXP announced the UCODE Nxm, a RAIN RFID IC designed for high-capacity item identification in industrial IoT and digital product passport applications. It supports 880 bits of total shared memory with up to 496-bit EPC memory and up to 752-bit user memory. The integrated circuit is designed for manufacturing, logistics, healthcare, and aviation. It can store extended data directly on the tag while maintaining standards-based privacy and data integrity.

McObject released its updated eXtremeDB 9.0 with two improvements that include native Approximate Nearest Neighbor (ANN) indexes and a new Edge Client requiring as little as 8 KB of memory. The additions mark eXtremeDB’s as a database engine for mission critical embedded systems, edge AI workloads, and IoT deployments which demand deterministic performance, minimal footprint, and reliable upstream data movement.

7STARLAKE introduced its F50 Airborne Liquid-Cooled AI Super Server engineered to meet ARINC 429 avionics standards that support mission-critical airborne functions including navigation, flight control, and engine monitoring. The solution integrates an optimized liquid-cooling design to ensure consistent operation in harsh airborne operating environments. It is built on 7STARLAKE’s Open Modular and Scalable Architecture.

During Automate 2026, the Taiwan Excellence Pavilion, organized by both Taiwan's International Trade Administration (TITA) and the Taiwan External Trade Development Council (TAITRA), was a success. 23 Taiwanese Excellence award-winning businesses highlighted various innovations supporting the next generation of smart manufacturing, industrial automation, robotics, and AI-enabled production systems.

Digi International released DANI, the Digi Artificial Network Intelligence agent, an AI network operations agent natively embedded in a networking device management platform, Digi Remote Manager (DRM). DANI facilitates operators in monitoring and diagnosing network issues, identifying root causes, and recommends actions through a single conversational interface.

Rambus introduced its DDR5 9600 Server RDIMM chipset Built around the new Rambus 6th Generation Registering Clock Driver (RCD06) with a 20 percent increase in bandwidth over the previous generation. The chipset enables RDIMMs, operating up to 9600 MT/s, unlocking the bandwidth and capacity commanded by agentic AI, high-performance computing (HPC), and other data-intensive workloads.

According to ByteSnap Design, battery maintenance is beginning to be one of the largest obstacles to large-scale Industrial IoT (IIoT) deployments. The company recently published an engineering blueprint, “Energy Harvesting: The Key to Maintenance-Free Industrial IoT” in response to hardware designers facing soaring maintenance costs and tightening environmental guidelines.