Embedded Computing Design

Akasa introduced the AK-CC7409BP01, a low-profile CPU cooler designed for thermally demanding, space-constrained environments. It is compatible with Intel LGA1851 and LGA1700 sockets and has an integrated copper vapor chamber heatsink and a UL-certified side blower fan delivering consistent cooling at 29.5mm in height. It is suited for 1U servers, SFF systems, and other applications where vertical clearance is limited.

TASKING will be highlighting its upgraded compiler at embedded world in Nuremberg March 10-12 (Booth 4-150, Hall 4). It supports the Renesas RH850/U2x microcontroller (MCU) family, including the new RH850/U2C series.

During embedded world Germany (March 10–12, Nuremberg), Infineon Technologies will showcase its latest PSOC microcontrollers, tools, and DEEPCRAFT AI Suite. Stop by Hall 4A, Booth 138 to explore new solutions across many applications and learn ways to accelerate your time-to-market on designs and AI/ML models.  

APLEX Technology Inc. will be in Booth 3-533 at embedded world Germany exhibiting its innovations designed for harsh environments in industries such as oil and gas, food and beverage, maritime, and more. APLEX provides factory automation and food and beverage automation solutions.

Menlo Microsystems Inc. (Menlo Micro) publicized that its collaboration with Purdue University has resulted in a commercial-ready architecture for quantum control and readout electronics at cryogenic temperatures. As published in the Nature Microsystems & Nanoengineering journal, the work explains Menlo Micro’s cryogenic MEMS Ideal Switch platform in scalable quantum computing applications.

Attendees to embedded word Germany will have a chance to stop by hall 2, booth 647 to see Greenliant’s latest portfolio of industrial solid state drives (SSDs) engineered for mission critical applications. Products demonstrated offer advanced endurance, robust data retention, increased data integrity, and stable performance.

Kudelski Labs will be attending embedded world Germany in Hall 3A, Booth 3A-334 showcasing its latest security solutions with live demonstrations. The demos will focus on how semiconductor and device manufacturers can deploy secure and future-ready products at scale while meeting emerging requirements under the EU Cyber Resilience Act.

Trenz will be bringing its lineup of brand-new hardware to embedded world Germany. At its booth, 5-140, Trenz will showcase ten new products (seven AMD-based and three Altera-based solutions) covering everything from budget friendly FPGA platforms and high-IO designs to RF signal processing and next-generation edge AI.

Munich, Germany. Infineon Technologies AG introduced its ModusToolbox Power Suite, a complete software platform for digital power conversion designs based on PSOC Control C3 microcontrollers (MCUs). Included are easy-to-use power conversion libraries, graphical user interfaces (GUIs), visualization tools, and application examples.

At embedded world Germany, Ellisys and Metirionic will collaborate to demonstrate tools and innovations giving designers the ability to evaluate Bluetooth Channel Sounding features and functionalities. Debutting will be an exhibit that combines Metirionic Advanced Ranging Stack (MARS) with the Ellisys Bluetooth Vanguard Advanced Bluetooth Analysis System.

NEXCOM will introduce its tough multi-purpose APPC C21-01 series fanless panel PCs built to meet the growing demands of AI-enabled edge computing and smart factory environments at embedded world Germany. NEXCOM’s booth (Hall 3, Booth 3-341) will display live demos of products focusing on the motto “Unleashing the Ingenuity of Software-Defined Edge Computing”, to emphasize the transformative potential of SD Edge Computing across AIoT and AI applications. The APPC C21-01 series acts as a high-performance bridge between industrial automation and intelligent data processing.

As part of Automate 2026, being held between June 22-25 at McCormick Place, Chicago, will be the third annual Humanoid Robot Forum. Automate also will introduce a dedicated Humanoid Robot Pavilion on the show floor, sponsored by NVIDIA.

ADLINK Technology Inc. will exhibit its edge AI portfolio at embedded world Germany (Hall 3, Booth 3-147) under the theme “Leading Edge AI Computing.” ADLINK’s highlights will include a unified edge AI architecture in a range of form factors such as COM modules and industrial motherboards to embedded systems, workstation-class GPU servers, and modular MXM and PEG GPU acceleration.

During embedded world Germany, congatec will exhibit its latest innovations in application-ready platforms while located at Hall 3, Booth 241. congatec is "going bigger" following an investment in JUMPtec (the former module business of Kontron AG) that expands its portfolio to even more modules, application examples, and services.

embedded world Germany will have SAPPHIRE Technology (Booth 324) showcasing its portfolio of embedded and commercial computing platforms powered by AMD Embedded+ architecture. Available demonstrations will showcase how its heterogeneous computing is reshaping modern edge system designs.

Wincomm released the WMP-22T-PIS-L and WMP-24T-PIS-L, a 21.5” and 23.8” medical All-in-One PC designed for operating rooms (OR) and critical healthcare environments. The WMP-22T/24T-PIS-L series combines an advanced fanless design with a built-in power supply in an anti-bacteria aluminum housing weighing just 7.8 and 8.6 kg.

To demonstrate the benefits of its advanced Non-Volatile Memory (NVM) innovations, Weebit will be located at Hall 4, Booth 4-658 during embedded world Germany with live edge AI demos on silicon with its integrated ReRAM.

Visitors can find MSI IPC at Hall 3-439 at embedded world Germany during March 10 to 12, 2026. MSI IPC will showcase its Edge AI computing innovations via live demonstrations designed for real world industrial and commercial applications.

Visitors to BIWIN’s booth (#1-140) at embedded world Germany will see the ePoP5X that combines LPDDR5X DRAM and eMMC storage into a single package, all facilitated by BIWIN's innovative multi-die stacking, ultra-thin die processing, and heterogeneous multi-chip integration technologies.

During its exhibition at embedded world Germany, EMASS (Hall 4, Booth 4-483) will have application specific demonstrations with its ECS-DoT system-on-chip (SoC), a milliwatt-class, on-device AI platform designed for always-on intelligence, ultra-low latency, and reduced power consumption. Demos will highlight how ECS-DoT enables continuous sensing, inference, and decision-making directly on-device, without reliance on the cloud or regular battery replacement.