Embedded Computing Design

IBASE Technology Inc. introduced the AMD EPYC Embedded 8004 powered MBB1002, an AI eATX motherboard developed to deliver enhanced multi-core performance and power efficiency, aiding faster AI inference, real-time analytics, and high-throughput computing for edge AI and data-intensive applications.

Codasip announced it will put more focus of its business into cyber-resilient semiconductor architectures and semiconductor System on Chips (SoCs). Because of the change, the company will divest its low-end RISC-V processor design business to a public US semiconductor company.  The purchaser will also take a broad license to Studio, Codasip’s processor EDA tool that allows rapid customization of Codasip processor cores. The acquisition is planned to close in a month.

Innatera released Synfire, an open, community-driven platform designed to unify and accelerate the neuromorphic ecosystem. Now open for registration, the platform will be made available near the end of April. Synfire is designed to address the challenge of fragmentation across tools, models, and deployment pipelines.

NTX Embedded introduced its Octolux RDS (Rapid Development System) offering automation engineers a development platform that enables them to define and fully validate a working pre-production system in just 12 weeks. When utilized, OEMs can meet the ever-growing demand for artificial intelligence with ease-of-use, efficiency, improved control, security, and enhanced connectivity in new commercial and industrial equipment.

Axiomtek released the NVIDIA Jetson Thor powered AIE015-AT Developer Kit that integrates the NVIDIA Blackwell GPU architecture with 2560 CUDA cores and 5th-gen 96 Tensor Cores, delivering up to 2070 FP4 TFLOPS of AI performance and 128GB of LPDDR5X memory. Highlights include quad 25GbE, CSI-2, USB 3.2, COM/CANbus, UART/I2C/I2S/GPIO interface, M.2, and mPCIe, along with a 9–36VDC power input with ignition control.

Collabora has announced the release of Apertis v2026, a modernized foundation for industrial embedded designs. The release is based on Debian 13 (Trixie) and offers updated system libraries, development tools, compilers, and core services, alongside a new default Wayland compositor, a reworked SDK, and enhanced packaging pipelines.

7STARLAKE released its THOR11-H6 and THOR11-X6 1U short-depth servers powered by the Intel Xeon D 6556P-B SoC. With up to 32 high-performance cores, 84 threads, advanced I/O, and built-in accelerators, the platform permits AI workloads, virtualized RAN (vRAN), media processing, and network security for defense networking and edge computing.

Digi International launched its Digi IX25, a next-generation industrial cellular router solution offering secure, scalable connectivity for critical networking infrastructure. The platform combines networking, compute, and secure connectivity in one device. To streamline deployment and reduce costs as well as potential failure points, four integrated Gigabit Ethernet ports eliminate the need for external switches in field cabinets and kiosks.

While there are many facets of human machine interfaces (HMI), a growing trend is how Mobile HMI can be used to improve medical environments. HMIs are no longer fixed panels on a wall. Walk through any medical facility, and one will witness multiple users rolling mobile carts or holding hand-held devices. Mobile HMIs range from tablets and smart panel PCs to smartphones.

MSI IPC will attend Japan IT Week Spring 2026 from April 8^th to 10^th in Tokyo, Japan. MSI IPC will be in West Hall 3, Booth #W21-22 where it will exhibit its latest Edge AI computing solutions via live demonstrations developed for real world industrial and commercial applications.

VadaTech introduced its PCI598 - PCIe FPGA with quad QSFP-DD XCVP1902 VersalTM Premium Series, based on the AMD XCVP1902 VersalTM Premium Series FPGA. It delivers more than 6,800 DSP slices with total PL memory of 1116Mb and 8,460,288 LUTs.

VadaTech introduced its VT808, a 3U rugged chassis that accommodates four x16 PCIe Edge card modules. It allows up to four power supplies that can provide 2+2 redundancy with a Power Entry Module (PEM) that manages power to each slot.   

Paul Smith, Senior Director at Sapphire Technologies, walks Embedded Computing Design's Rich Nass through a series of the company's products.

During embedded world Germany, Kudelski Labs revealed that Axelera AI integrated the Kudelski Secure Enclave, robust to AVA_VAN.3 (“KSE3”) into Europa, its new Edge AI processing platform. The joint effort strengthens Europa’s security architecture, ensuring advanced inference workloads can be executed with assurance across rigorous edge environments such as smart infrastructure, industrial automation, and autonomous robotics.

Bosch Sensortec’s ultra-low power, high-performance BMP585 barometric pressure sensor now supports the Snapdragon Wear Elite Platform and is integrated into the Snapdragon Wear Elite Platform’s reference design. The platform delivers on-device AI capabilities with precise pressure data that allows for accurate altitude tracking and a new layer of contextual awareness for next-generation wearables.

Sundance Multiprocessor Technology Ltd (Sundance) announced its SMT135-C, an Efinix Titanium Ti135 evaluation board based on the SoM6 Ti135 system-on-module (SoM) built around the Efinix Titanium Ti135 FPGA, in a N676 package.

Cincoze presents its rugged DX-1300 compact (242 × 173 × 75 mm) industrial computer, the latest addition to its DIAMOND product line. The platform leverages the Intel Arrow Lake-S platform Core Ultra 200S processor and features an integrated CPU, GPU, and NPU hybrid computing architecture delivering up to 36 TOPS of AI power with support for up to 96GB of 6400 MHz DDR5 CSODIMM memory.

IBASE Technology Inc. introduced the palm-sized fanless edge computing system, the ASB100-PI800, leveraging the Intel Atom x7433RE processor and built on the IBASE PI800 PICO-ITX board. The ASB100-PI800 delivers consistent energy efficient computing performance for space-constrained and low-power industrial IoT applications.

Tria Technologies introduced two wireless modules, the SPB611 and SPB209, both supporting multiple short-range protocols and helping to speed up the development of wireless-enabled embedded systems. The SPB611 delivers Wi-Fi 6 (802.11ax 80 MHz) dual-band and Bluetooth 5.2, while the SPB209 offers Wi-Fi 5 (802.11ac) and Bluetooth 4.2. The SPB611 offers a tri-radio option to add 802.15.4-2020 (Thread and ZigBee) mesh networking capabilities. To reduce the size of the system, both modules can be supplied with an LTE filter and PCB antenna.

While attending embedded world Germany, Trenz Electronic showcased ten new FPGA-based platforms including seven AMD-based and three Altera-based solutions. Highlighted were a range of solutions from cost-optimized FPGA platforms to high-I/O designs, RF signal processing, and edge AI applications.