Industry News - Page 177
IoT
-
embedded world Germany: NEXCOM Introduces APPC C21-01 Fanless Panel PCs to Bridge Industrial Automation and Edge AI
February 27, 2026
-
The Road to embedded world: ADLINK Highlights Scalable Edge AI Computing from COM Modules to Multi-GPU Servers
February 27, 2026
-
embedded world Germany: MSI IPC Unveils Industrial Edge AI Platforms for Smart Cities and Manufacturing
February 23, 2026
-
Choosing the Right Silicon for Edge AI: How Intel, AMD, NVIDIA, and Arm Are Shaping the Next Generation of Distributed Computing
February 17, 2026
Storage
-
The Road to embedded world: Weebit ReRAM Powers Live Edge AI Silicon Demos
February 24, 2026
-
The Road to embedded world: BIWIN ePoP5X Combines LPDDR5X and eMMC for Space-Constrained AI Devices
February 22, 2026
-
The Road to embedded world: BIWIN Highlights TAU208 UFS 3.1 Automotive Storage
February 13, 2026
-
MEMPHIS Electronic Showcases Long-Term Memory Availability Planning at embedded world Germany
February 11, 2026
Networking & 5G
-
The Hidden Complexity of Bluetooth Antenna Design in Channel Sounding
March 02, 2026
-
Futuristic Embedded: Hospital AI, Bluetooth in Industrial, and DNA Storage
February 26, 2026
-
Embedded Executive: LE-UWB Touts Low Power Plus High Bandwidth | SPARK Microsystems
February 18, 2026
-
Embedded Executive: Wireless Charging Just Got Faster | WPC
January 14, 2026
Security
-
EU CRA: Guidance for Non-IP Embedded Communication Systems
February 24, 2026
-
The Road to embedded world: PQShield Advances Post-Quantum Cryptography
February 17, 2026
-
STM32 OTA Firmware Update
February 04, 2026
-
Embedded Executive: The Latest On the Chips Act | PQSecure
February 04, 2026