Embedded Computing Design

In this episode of Embedded Insiders, we’re joined by embedded systems veteran Steve Yates, founder of ADI Engineering and now Founder & CEO of StellarIoT. Steve dives into his latest venture, a platform designed to support rugged, AI-powered digital transformation in remote industries—combining open software, rugged hardware, satellite, private 5G connectivity, and zero-touch AIoT operation.

In this episode of Embedded Insiders, Erik Kling, President & Head of IoT Americas at Vodafone IoT, discusses the connectivity gaps in remote healthcare and how cellular IoT connectivity supports challenges across industrial, supply chain, and healthcare industries. 

AI is a technology that generally requires a significant amount of power and high compute performance. Hence, it’s typically relegated to the Cloud or to an Edge-based computer.

Performing AI at the endpoint has not been feasible for those reasons. With ambiq’s Sub-threshold Power Optimized technology (SPOT), performing AI at the endpoint is a reality. And the doors/applications that it opens are extremely cool. 

Hear more about it in this week’s Embedded Executives podcast, where I spoke to Ambiq’s Vice President of AI, Carlos Morales. Note that Ambiq just recently released the latest version of neuralSPOT, which now includes key performance enhancements specific to the company’s Apollo5 family, amongst other features, some of which are specific to AI development.

In this episode of Embedded Insiders, Rich and Jeff Baldwin, Director of Engineering at Sealevel Systems, discuss the process of designing systems for harsh environments and how Sealevel’s expertise helps customers get started with safe and reliable solutions.

Our next segment is sponsored by Infineon Technologies. Rich Nass is joined by Erik Wood, Infineon’s Senior Director of Microcontroller Cryptography and Product Security, and the two discuss quantum computing and how the experts at Infineon are working to keep systems secure.

Designing a device that incorporates AI can be daunting, for a good reason—it’s very complex. When you push that design out to the Edge, it brings in even more challenges, both on the hardware and software sides of the equation. 

To understand what these challenges are and where a designer can turn for help, I spoke to Amir Panush, the CEO of Ceva, on this week’s Embedded Executives podcast. He addresses these issues on a regular basis and has a good understanding of what a designer needs to know.

We’re in the era of quantum computing. That brings with it a lot of great things. But at the same time, it brings some not so good things. Once again, we’re in a race to stay ahead of the bad guys to keep our systems secure. 

Folks like the experts at Infineon are doing what they can to do just that. And the best part is that they are trying to insulate their customers from having to deal with all the different measures that must be put in place. 

Hear from Erik Wood, Infineon’s Senior Director of Microcontroller Cryptography and Product Security, to see if this sounds like a fit for your design. Check out this week’s Embedded Executives podcast to learn more.

In this episode of Embedded Insiders, Contributing Editor Rich Nass chats with Earle Foster, Senior Vice President of Sales at Sealevel Systems, about how to build embedded systems without starting from scratch. They explore when to rely on fully custom and off-the-shelf components, and where semi-custom solutions are most suitable.

Later, Ken talks with Soracom Co-Founder and CTO Kenta Yasukawa about the company’s latest GenAI developments, with a brief mention of our upcoming AI at the Edge Day.

But first, Ken and I break down the latest news on NVIDIA’s H20 chip and developing export regulations around advanced AI chips.

The boom coming from AI is requiring data centers to be built as fast as we can build them. To that end, there is a lot of discussion about the power that’s needed to drive these data centers. What there’s not a lot of discussion about are the interconnects that are used within these power-hungry computing camps. And that’s the specialty of Point2 Technology, a fairly new company that boasts ultra-low power interconnect solutions. 

To understand how the company’s technology works, I spoke to Sean Park, Point2’s President, CEO, and Founder, on this week’s Embedded Executives podcast.

Hello Embedded Engineers, Developers and Makers! Welcome to In Case You Missed it: Embedded Insights, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.

TSMC recently announced its exit from the GaN space. Well, maybe “announced” is the wrong word, but they did let customers know that they will not be producing GaN devices going forward. 

Details are still coming out, so we don’t know exactly when that stoppage will occur. So what does that mean for TSMC partners who relied on them to produce their products? 

To understand what that means, I spoke to Johannes Schoiswohl, the Senior Vice President and General Manager of Infineon’s GaN Business Line. Infineon may have an easier time than others making this transition, but it’s an interesting time nonetheless. Check out this week’s Embedded Executives podcast to learn more.