TDK's New MEMS IMU Supports Scalable Design within In-Cabin Automotive Applications

By Chad Cox

Production Editor

Embedded Computing Design

July 01, 2025

News

TDK's New MEMS IMU Supports Scalable Design within In-Cabin Automotive Applications
Image Credit: TDK

TDK Corporation introduced the InvenSense SmartAutomotive IAM-20680HV, a high-value 6-axis Inertial measurement unit (IMU) for automotive applications involving rugged environments including those with temperatures towards +125 °C. It integrates a 3-axis gyroscope and a 3-axis accelerometer in a 3 x 3 x 0.75 mm3 (16-pin LGA) footprint.

The solution is pin-to-pin and register compatible with all the TDK automotive non safety MEMS sensors. Unlike other TDK models, the full-scale gyroscope is limited to ±125 dps, allowing for greater resolution and improved precision. The IAM-20680HV enables design teams to scale various ranges of automotive applications, such as telematics, heads-up displays, navigation systems, door control, and crash-recording.

“In a fast-evolving automotive industry where high performance must meet affordability; innovation, scalability, and efficiency are no longer options,” said Alberto Marinoni, Senior Director Product Marketing Automotive at InvenSense, a TDK Group company. “Our technology empowers Tier 1s and OEMs to develop cutting-edge solutions in a cost-sensitive environment without compromising on quality or performance.”

Ideal Applications:

  • GNSS modules & positioning
  • Heads-up displays
  • Cockpit domain controllers
  • Navigation systems
  • E-calls
  • Telematic box positioning
  • Door control
  • Driving-style recording

For more information, visit invensense.tdk.com/smartautomotive/.

Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.

He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.

Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.

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