Embedded Computing Design

The OKMX6ULL-C SBC from Forlinx is a FETMX6ULL-C SoM with carrier board. The FETMX6ULL-C SoM is based on NXP i.MX6ULL, Cortex-A7 low power featuring processor@ 800MHz.

The new Avnet development kit called the ZUBoard 1CG, based on the newest member of the AMD-Xilinx Zynq UltraScale+ MPSoC family, features the lowest cost member of the AMD-Xilinx Zynq UltraScale+ MPSoC, enabling engineers to jump-start their design work.

The new Avnet development kit called RZBoard V2L, based on the Renesas RZ/V2L processor, supports the latest in energy-efficient object detection. This kit will be on display at the Embedded Vision Summit May 17-19, 2022, in Santa Clara, California.

Semtech Corporation announced that REYAX Technology has launched a new antenna transceiver module, the REYAX RYLR998, featuring Semtech's LoRa and has 868/915MHz frequency range.

Analog Devices, Inc. (ADI) introduced the DS28E30 1-Wire ECDSA Secure Authenticator, a cost-effective solution to detect and help protect products from counterfeiting or misuse. 

Qeexo, developer of the Qeexo AutoML, and Bosch Sensortec GmbH announced that machine learning algorithms created using Qeexo’s AutoML can now be deployed on Arduino Nicla Sense ME with Bosch BHI260AP and BME688 sensors.

Rohde & Schwarz introduced two new maximum frequencies for the R&S SMW200A vector signal generator, bringing high performance to digitally modulated signals up to 67 GHz and beyond.

To offer developers access to high performing peripherals without sacrificing power consumption, Microchip Technology announced the SAMA7G54 Arm CortexA7-based MPU running up to 1 GHz.

Virtium, a provider of industrial Solid-State Drive (SSD) and Memory Module solutions, introduced the next generation of their StorFly XE class M.2 NVMe SSD product portfolio.

Renesas Electronics announced that the security engine of its RA Family of 32-bit Arm Cortex-M microcontrollers (MCUs) has been certified by the National Institute of Standards and Technology (NIST) Cryptographic Algorithm Verification Program (CAVP). The drivers to utilize the certified SCE9 Protected Mode are included in the RA Family Flexible Software Package (FSP) v3.6.0 and later.

Quadric and MegaChips announced a strategic partnership to deliver ASIC and SoC solutions built on Quadric’s edge AI processor architecture.

Intel released an open source tool to migrate code to SYCL1 through a project called SYCLomatic, which helps developers port CUDA code to SYCL and C++ to accelerate cross-architecture programming for heterogeneous architectures.

SmartCow's CityStation users can leverage the power of NVIDIA’s Omniverse via their Digital Twin integration to shorten the early stages of smart city project development and assist with overall stage maintenance.

Renesas announced that it will conduct a 90-billion-yen worth investment in its Kofu Factory, located in Kai City, Yamanashi Prefecture, Japan. While the Factory was closed in October 2014, Renesas intends to reopen the fab in 2024 as a 300-mm wafer fab capable of manufacturing power semiconductors.

Siemens Digital Industries Software announced that its Calibre nmPlatform now enables designers to leverage the newest GlobalFoundries (GF) silicon photonics platform.

 AMD announced the Kria KR260 Robotics Starter Kit, the latest addition to the Kria portfolio of adaptive system-on-modules (SOMs) and developer kits.

Premio Inc. released its RCO-6000-CML AI Edge Inference Computers now supporting Intel 10th Generation CML-S (Comet Lake S) and Xeon W processors.

Innovatrics and Blaize announced a technology partnership to deliver ready-to-use facial recognition solutions designed for access control and public security applications leveraging SmartFace Embedded and Blaize edge computing devices. 

Nexperia has launched a new portfolio of application specific MOSFETs (ASFETs) for automobile airbag applications, headlining with the release of the BUK9M20-60EL single N-channel 60 V, 13 mOhm logic level MOSFET in LFPAK33 packaging.

Versinetic, a smart charging consultancy, showcased its dynamic load balancing module LINKRAY and its new EV Charger Development Kits at this year’s POWER2DRIVE exhibition at Messe, Munich, Germany between 11 - 13 May 2022.