Embedded Computing Design

Teledyne LeCroy announced the launch of their new DL-ISO High Voltage Optically Isolated 1 GHz Probe and Power-Device test software, which when combined with their High Definition Oscilloscopes (HDO) offer accurate electrical characterization of gallium nitride (GaN) and silicon carbide (SiC) power semiconductor devices.

Forlinx Embedded's AI Edge Computing Terminal FCU3001 is an artificial intelligence edge computing device equipped with NVIDIA Jetson Xavier NX, with a 6-core 64-bit ARM architecture processor, its GPU with 384 Volta cores and 48 Tensor cores, up to 21 TOPS, 8GB of LPDDR4 memory and 16GB eMMC storage.

Vishay Intertechnology announced that it has extended its NTCS0603E3.....T and NTCS0805E3.....T series of Automotive Grade, glass protected NTC thermistors in the 0603 and 0805 case sizes with new electrical resistance values at +25 °C (R25).

BUGSENG launched a new certified functional safety package for its ECLAIR Software Verification Platform. This enables customers to accelerate the development of safety-critical software and its certification in compliance with ISO 26262:2018 (for any ASIL), IEC 61508:2010 and EN 50128:2011 (for any SIL), IEC 62304:2006 (for any software safety class), and ISO 25119:2018 (for any SRL).

POLYN Technology announced that its first Neuromorphic Analog Signal Processor (NASP) chip is packaged and evaluated, demonstrating proof of the technology’s brain-mimicking architecture. Per the company, it is the first Tiny AI true analog design to be used next to sensors.

For maximum protection, especially in mission-critical applications, Swissbit has now introduced "powersafe", an additional PLP (Power Loss Protection) level that also secures data as it transfers from host to controller (Dynamic Data) or from DRAM to NAND (Cached Data).

Pudu Robotics unveiled two intelligent robots that are empowered by Thundercomm’s advanced SOM (system on module) products and technologies. The two robots: SwiftBot and PUPU D1 are designed to meet different demands from food delivery in restaurants and goods delivery in various scenarios, separately.

Power Integrations announced the energy-saving HiperLCS-2 chipset, a new IC family that is designed to simplify the design and manufacture of LLC resonant power converters. The company also announced the HiperPFS-5 family of power-factor-correction (PFC) ICs with an integrated 750 V PowiGaN gallium-nitride switch

IAR Systems announced the latest version of the graphical modeling and code generation solution IAR Visual State. The new version introduces cross-platform host support that allows IAR Visual State to run on either Linux or Windows, enabling flexible and efficient development workflows based on state machines.

Siemens Digital Industries Software announced that its transition to a software-as-a-service (SaaS) led business is progressing and momentum is increasing.

SolidRun announced its i.MX 8XLite System on Module (SOM) line engineered for a variety of V2X applications. Available in single- or dual-core configurations, these new SOMs pack all the essential components required to develop V2X, V2I, and industrial IoT applications in a 30 x 47mm form factor.

ADLINK Technology announced the availability of the Ampere Altra Developer Platform based on the COM-HPC Ampere Altra module, the world’s first 32/64/80-core COM-HPC based server type module with the performance and scalability necessary to drive a variety of use cases across the cloud-to-edge development communities.

NXP Semiconductors announced the first release of radar signal processing algorithms as part of the new Premium Radar SDK (PRSDK).

SEGGER’s Embedded Studio for RISC-V, Version 6, now uses real-time memory management which improves efficiency and response time when allocating and freeing up memory, satisfying requirements for hard real-time in applications written in C++.

Synopsys announced a new cloud-optimized electronic design automation (EDA) deployment model that delivers chip and system design flexibility via a single-source, pay-as-you-go approach.

OnLogic introduced the CL250 ultra small fanless edge computer. The system, built to power industrial IoT and edge computing applications in challenging environments, joins the company's CL200 Series of industrial computers.

Energous Corporation and Atmosic Technologies announced the Wirelessly-Charged Sensor Evaluation Kit featuring Atmosic's ATM3 energy harvesting Bluetooth Low Energy System-on-Chip (SoC) solution and Energous' FCC-certified 1W WattUp PowerBridge transmitter.

Semtech Corporation announced its collaboration with Enthu Technology Solutions India Pvt Ltd, a next-generation technology company that helps enterprises and startups reimagine their businesses for the digitally connected age, and Xorowin Mechatronics, a technology company focused on producing cyber-physical systems for industrial automation needs.

Analog Devices, Inc. introduced a millimeter wave (mmW) 5G front-end chipset that addresses required frequency bands enabling designers to reduce complexity and bring smaller and more versatile radios to market faster.

ITTIA announced support for the QNX Software Development Platform 7.1, featuring the QNX Neutrino Real-Time OS and a full suite of development tools for embedded systems.