Embedded Computing Design

Industry News - Page 219

Analog & Power
ams Claims Most Advanced Spectral ALS Sensor for Next-Generation Smartphone Cameras

Alix Paultre

January 13, 2020

Analog & Power
TE Connectivity releases MS5839-02BA, a Harsh Media Resistant Digital Pressure and Temperature Sensor

Perry Cohen

January 13, 2020

Automotive
R&S' Oscilloscopes and Marvell's Multiport Multi-Gigabit Automotive Ethernet Switch Address Wideband Test

Alix Paultre

January 13, 2020

Automotive
D3 Engineering Launches Automotive Vision Development Kit Based on TI TDA4VM SoC

Brandon Lewis

January 10, 2020

IoT
Outdoor LoRaWAN Gateway for the Internet of Things

Tiera Oliver

January 9, 2020

Industrial
Kithara to Attend embedded world 2020

Perry Cohen

January 9, 2020

Software & OS
End of Support Coming for Windows 7

Perry Cohen

January 9, 2020

Analog & Power
Newark Increases XP Power Products Offerings

Tiera Oliver

January 9, 2020

Analog & Power
XP Power Announces launch of DC-DC Power Module for Scientific, Semiconductor Applications

Perry Cohen

January 9, 2020

Automotive
Renesas Electronics Simplifies Power Supply Design for Automotive Surround View Camera Systems

Tiera Oliver

January 9, 2020

Automotive
HARTING's metroSNAP Automotive Cable Interface Supplies Power, Data, and Signal

Alix Paultre

January 9, 2020

Analog & Power
Time-of-Flight Demo Board Drives Lasers With Automotive-Qualified eGaN Technology

Alix Paultre

January 9, 2020

Analog & Power
Analog Devices? Quad-Output DC/DC ?Modules Reduce Component Count, Board Space, and Power Usage

Alix Paultre

January 9, 2020

Analog & Power
Infineon and Rompower to Advance USB-PD Chargers

Alix Paultre

January 9, 2020

Automotive
Vecow Launches RMS-1000 Series 1U Rackmount In-Vehicle Computing System

Perry Cohen

January 8, 2020

Consumer
Achieving Mass Manufacturability for AR Smart Glasses

March 27, 2024

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IoT
Image Credit: Digi International
Digi International's Digi Connect Sensor XRT-M Powered by Digi Axess

April 16, 2024

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Storage
Image Credit: ATP Electronics
Embedded World 2024: High-Endurance, Robust Cross-Temp Reliability 176-Layer Storage, DDR5-5600 Solutions Take Center Stage at ATP Electronics’ Exhibit

April 5, 2024

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Security
Image Credit: Allegro Software
Embracing FIPS Validation in Medical Device Security

April 15, 2024

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