Embedded Computing Design

Industry News - Page 217

Networking & 5G
STMicroelectronics Announces GUI Design for Low-Cost Devices with TouchGFX Updates and New STM32 Nucleo Shield

Tiera Oliver

October 12, 2020

Networking & 5G
Texas Instruments Introduce DP83TD510E, Ethernet Physical Layer

Perry Cohen

October 9, 2020

Industrial
PICMG Ratifies MicroSAM, Microcontroller-Agnostic Module Form Factor for the Enablement of Smart Sensors

Tiera Oliver

October 8, 2020

Processing
Efinix Announces Availability of Reconfigurable Acceleration Platform (RAP) Initiative

Perry Cohen

October 8, 2020

Processing
Avnet Releases New RFSoC Development Kit for mmWave

Perry Cohen

October 8, 2020

Processing
STMicroelectronics Introduces Bluetooth 5.2-Certified SoC

Tiera Oliver

October 8, 2020

Industrial
ON Semiconductor Introduces CMOS Global Shutter Image Sensor for Machine Vision and Mixed Reality Applications

Tiera Oliver

October 8, 2020

Industrial
Rockwell Automation, Microsoft Announce 5-Year Partnership Expansion

Perry Cohen

October 7, 2020

IoT
Veea Joins Microsoft Azure Certified for IoT

Perry Cohen

October 7, 2020

Industrial
Claroty Releases New Cybersecurity Research Showing Increased Threat During the Pandemic

Perry Cohen

October 7, 2020

Storage
Alliance Memory Expands Lineup of High-Speed CMOS DDR4 SDRAMs With New 8Gb Devices

Tiera Oliver

October 6, 2020

AS4C1G8D4 and AS4C512M16D4 High-Speed CMOS DDR4 SDRAMs
Storage
Renesas I3C Bus Extension and SPD Hub Devices Qualified for ASPEED AST2600 Baseboard Management Controller

Tiera Oliver

October 5, 2020

Processing
TQ Introduces New Intel Atom x6000E Based Computer-on-Module Product Family

Tiera Oliver

October 5, 2020

Storage
Swissbit Expands Miniaturized Storage Solutions with EM-30

Perry Cohen

October 5, 2020

Swissbit announced its has expanded its portfolio of miniaturized storage solutions with the EM-30 device, featuring an e.MMX-5.1 standard interface.
Analog & Power
Vishay Intertechnology Extends EP1 High Energy Wet Tantalum Capacitor With New Ratings in the B and C Case Codes

Tiera Oliver

October 5, 2020

Built on Vishay's SuperTan technology, the EP1 now features high capacitance from 3,600 µF to 40,000 µF in the B case code and 5,300 µF to 58,000 µF in the C case code
Consumer
TDK Adds SmartMotion for Smart Glasses to its Custom Sensing Solutions for AI Glasses and Augmented Reality

September 30, 2025

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Networking & 5G
Product of the Week: Infineon Technologies’ AIROC CYW55913 Connected Microcontroller

October 20, 2025

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Software & OS
Accelerating Innovation: Wi-Fi HaLow for Industrial IoT & CodeFusion Studio for AI Development

November 5, 2025

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HPC/Datacenters
The Power Problem Behind AI Data Center Performance

November 11, 2025

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