Alliance Memory LPDDR4 SDRAMs Cut Power Consumption, Up Performance
February 08, 2021
News
Alliance Memory recently expanded its offering of high-speed CMOS mobile low-power SDRAMs with new LPDDR4 devices that all feature on-chip ECC.
For improved performance with higher power efficiency than previous-generation LPDDR3 SDRAMs, the 2-Gbit AS4C128M16MD4-062BAN, 4-Gbit AS4C256M16MD4-062BAN and AS4C128M32MD4-062BAN, and 8-Gbit AS4C256M32MD4-062BAN offer lower power consumption and faster speeds as compared to previous generations. All the devices are offered in 200-ball FBGA packages.
With operation 1.1/1.8 V, the devices increase battery life in portable electronics for the consumer and industrial markets, including tablets, wearables, handheld gaming consoles, personal navigation systems, and more. Providing increased efficiency for advanced audio and high-resolution video in embedded applications, the LPDDR4 SDRAMs deliver clock speeds of 1.6 GHz for transfer rates of 3.2Gbits/s. For automotive applications, including infotainment and ADAS systems, the AEC-Q100 qualified devices operate over a temperature range of -40°C to +105°C.
The LPDDR4 SDRAMs are organized as one channel (AS4C128M16MD4-062BAN and AS4C256M16MD4-062BAN) and two channels (AS4C128M32MD4-062BAN and AS4C256M32MD4-062BAN) per device, with individual channels consisting of eight banks of 16 bits. The components offer fully synchronous operation; programmable read and write burst lengths of 16, 32, and on the fly; and selectable output drive strength. An on-chip temperature sensor controls the self-refresh rate.
Samples and production quantities are available now, with lead times of eight weeks. Pricing for U.S. delivery starts at $6.00 per piece for 2-Gbit devices; $12 for 4-Gbit devices; and $16 for 8-Gbit devices.
Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.
Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.
Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.
Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events. In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.
Nass holds a BSEE degree from the New Jersey Institute of Technology.
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