Industry News - Page 231
IoT
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embedded world Germany: NEXCOM Introduces APPC C21-01 Fanless Panel PCs to Bridge Industrial Automation and Edge AI
February 27, 2026
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The Road to embedded world: ADLINK Highlights Scalable Edge AI Computing from COM Modules to Multi-GPU Servers
February 27, 2026
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embedded world Germany: MSI IPC Unveils Industrial Edge AI Platforms for Smart Cities and Manufacturing
February 23, 2026
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Choosing the Right Silicon for Edge AI: How Intel, AMD, NVIDIA, and Arm Are Shaping the Next Generation of Distributed Computing
February 17, 2026
Storage
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The Road to embedded world: Weebit ReRAM Powers Live Edge AI Silicon Demos
February 24, 2026
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The Road to embedded world: BIWIN ePoP5X Combines LPDDR5X and eMMC for Space-Constrained AI Devices
February 22, 2026
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The Road to embedded world: BIWIN Highlights TAU208 UFS 3.1 Automotive Storage
February 13, 2026
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MEMPHIS Electronic Showcases Long-Term Memory Availability Planning at embedded world Germany
February 11, 2026
Processing
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The Road to embedded world: congatec “Goes Bigger” With Application-Ready Platforms
February 26, 2026
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The Road to embedded world: EMASS ECS-DoT SoC Powers Real-Time Edge Inference
February 20, 2026
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Sundance Will Showcase Thermal-Efficient Efinix Titanium Ti135 FPGA Module at embedded world’ 26, Germany
February 18, 2026
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Solectrix to Introduce its proFRAME Base Board 3.1 PXIe Targeting Aerospace, Automotive, and Railway Test Applications at embedded world Germany
February 18, 2026
Security
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EU CRA: Guidance for Non-IP Embedded Communication Systems
February 24, 2026
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The Road to embedded world: PQShield Advances Post-Quantum Cryptography
February 17, 2026
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STM32 OTA Firmware Update
February 04, 2026
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Embedded Executive: The Latest On the Chips Act | PQSecure
February 04, 2026