Simple Integration, Short Time to Market, and High ROI Are the Hallmarks of the CLEA AI IoT Offering

SECO

March 18, 2021

We spend a lot of time discussing the various hardware elements of an AI system. Should it be a CPU or a GPU or a combination? What about the new entrant, the TPU? Then there’s the memory subsystem and the bus architecture. Not to mention the different sensors that are needed for the specific application.

Qualcomm Releases Vision AI Development Kit, and Azure IoT Starter Kit

Perry Cohen

March 15, 2021

QuickLogic, SparkFun, and Crowd Supply Launch the SparkFun Thing Plus - QuickLogic EOS S3 Development Kit

Tiera Oliver

March 15, 2021

Leopard Imaging Partnering with Socionext, AWS to Deliver New AI Processing Solution

Perry Cohen

March 10, 2021

K210 AI Accelerator a Compact Raspberry Pi HAT for Computer Vision Applications

Saumitra Jagdale

March 10, 2021

Aetina Announces NGC-Ready SuperEdge AI Inference Platform

Aetina Corporation

March 2, 2021

Maxim Integrated to Exhibit 28 Products at First All-Digital embedded world

Maxim Integrated

March 2, 2021

Embedded Computing Design's Best in Show at the First All-Digital embedded world

Perry Cohen

March 2, 2021

More Productivity with Cloud services

ARM

March 1, 2021

How Embedded Tech Is Securing Connectivity in Autonomous Vehicles

Shannon Flynn

February 26, 2021

QuickLogic Releases the Qomu Development Kit

Perry Cohen

February 24, 2021

MVTec Presents New Concept Feature at the embedded world DIGITAL

Tiera Oliver

February 23, 2021

ADLINK Will Showcase Edge AI Strategy and Next-Gen Modules at embedded world 2021

Tiera Oliver

February 23, 2021

The Path to AI at the Edge

Rich Nass

February 22, 2021

The Most Technical Time of the Year

Perry Cohen

February 18, 2021

Machine Learning Model Analysis Using TensorBoard

Aekam Parmar

February 15, 2021

The Impact of AI on Software Quality Assurance

Erik Fogg

February 12, 2021

High-Performance, Low-Power DRAM Combines with SoC in a SiP

Rich Nass

February 8, 2021

Automotive Applications Will Benefit from the Latest Arm Development Tools

Ronan Synnott

February 4, 2021

OKdo Now Supplying Product Portfolio from Google Coral

Perry Cohen

January 22, 2021

Embedded Executive: Ed Kuzemchak, CTO, Software Design Solutions

Rich Nass

January 20, 2021

The Evolution of AI Inferencing

Geoff Tate

January 19, 2021

Gowin Semiconductor Embeds 64Mb HyperRAM DRAM from Winbond for AI Edge Computing Solution

Tiera Oliver

January 18, 2021

Winbond Electronics announced that FPGA manufacturer Gowin Semiconductor has embedded a Winbond 64Mb HyperRAM fast memory device in its new GoAI 2.0 machine learning platform. 

RTI, NXP Semiconductor Announce New Partnership

Perry Cohen

January 6, 2021