Embedded Executive: Peggy Carrieres, Global VP of Sales Enablement, Avnet

Rich Nass

August 25, 2021

Mixel Achieves ISO 26262 for Automotive Functional Safety and ISO 9001 Certification for IP Quality Management System

Tiera Oliver

August 16, 2021

Renesas Releases the RAA215300 PMIC for AI

Chad Cox

August 13, 2021

Eta Compute’s Low-Power Architecture Offers Long-Lasting AI Vision Workloads on a Single Battery

Saumitra Jagdale

August 12, 2021

New SMARC Design Guide Helps with High-Speed Signals, Long-Lifecycle Engineering

Chad Cox

August 10, 2021

NVIDIA Maintains Position in 2020 Market for AI Processors for Cloud and Data Center

Tiera Oliver

August 6, 2021

MediaTek’s Kompanio 1300T SoC Platform Ups the Tablet Performance Experience

Rich Nass

August 4, 2021

Getting more for less: designing smarter Edge AI

Tony King-Smith

August 3, 2021

Bringing Down the Duration of Hardware Design Life Cycle for Compact High Performing Architecture

Saumitra Jagdale

August 3, 2021

Dev Kit Weekly: Xilinx Kria KV260 Vision AI Starter Kit

Brandon Lewis

July 30, 2021

The KV260 Vision AI Starter Kit is based on Xilinx’s Kria K26 system on module, which is a … wait, wait, wait. A system on module from Xilinx?

First Single-Chip Network Synchronization Solution Provides Precise Timing for 5G Radio Access Equipment

Taryn Engmark

July 30, 2021

u-blox Wins Chinese Court Ruling Against Techtotop in Patent and Copyright Infringement Suits

Taryn Engmark

July 29, 2021

u-blox Introduces Dual-Output Automotive Dead Reckoning Modules Qualified for Operation Up to 105 °C

Tiera Oliver

July 23, 2021

Winbond’s Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Solution

Taryn Engmark

July 22, 2021

Renesas Launches R-Car Gen3e for Automotive Infotainment, Cockpit, and Digital Cluster Systems

Tiera Oliver

July 20, 2021

STMicroelectronics Eases Connected-Sensor Design with User-Friendly Workspace for BlueNRG SoCs

Chad Cox

July 14, 2021

Retrofit ATX Mainboard

ICP Germany

July 14, 2021

Texas Instruments Announces New MCU Portfolio

Tiera Oliver

July 12, 2021

An Easier, Lower Cost Path to Customizable SoCs

Jeff DiCorpo

July 8, 2021

Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets

Tiera Oliver

July 7, 2021

Embedded Executive: Jeff DiCorpo, SVP Business Development, efabless

Rich Nass

July 7, 2021

Weebit Nano Demonstrates Integration of Selector with ReRAM Cell for Stand-Alone Memory Market

Tiera Oliver

July 6, 2021

The SoC Evolution: From Early Handsets To Edge Intelligence

Asem Elshimi

June 30, 2021

Power Modeling and Estimation in Early System Design, Part 2

Deepak Shankar

June 28, 2021