Technology - Processing - Chips & SoCs - Page 21

The Problem with the CHIPS Act, Part 2

Embedded Insiders

June 9, 2022

Chips & SoCs

Imagimob Announces tinyML for Sound Event Detection Applications on Synaptics AI Chip

Tiera Oliver

June 14, 2022

AIoT Open Platform for Flexible and Scalable Development

Saumitra Jagdale

June 13, 2022

Transforming Edge AI with Clusters of Neural Processing Units

Saumitra Jagdale

June 13, 2022

Microchip Announces First RISC-V-Based System-on-Chip FPGA Enters Mass Production

Tiera Oliver

June 13, 2022

Agile Analog Receives Its First Chinese Licensee for Its Analog IP

Chad Cox

June 10, 2022

Lattice Introduces Next-Gen Control FPGAs and New Solution Stack for ORAN Deployment

Tiera Oliver

June 1, 2022

Synopsys Launches the Era of Smarter SoC Design with ML-Driven Big Data Analytics Technology

Tiera Oliver

June 1, 2022

NXP Eases Industrial IoT Development with its i.MX RT Industrial Drive Development Platform

Chad Cox

May 27, 2022

Embedded Executive: Denis Marcon, GM, Innoscience Europe

Rich Nass

May 25, 2022

Is Moore’s Law Still Ticking?

Trushal Chokshi

May 23, 2022

embedded world 2022: iWave Systems

iWave Systems

May 23, 2022

Quadric and MegaChips Form Partnership to Bring IP Products to ASIC and SoC Market

Tiera Oliver

May 23, 2022

Renesas to Invest and Restart Operation of Kofu Factory as 300mm Wafer Fab Dedicated for Power Semiconductors

Tiera Oliver

May 19, 2022

Siemens Collaborates with GlobalFoundries to Provide Trusted Silicon Photonics Verification

Tiera Oliver

May 17, 2022

ADLINK Harnesses the Arm SystemReady-Compliant Ampere®️ Altra®️ Module, Pushing COM-HPC to New Heights

ADLINK Technology, Inc.

May 16, 2022

When Supply Chain Issues Reach Their Source & A Farewell to 3G

Embedded Insiders

April 29, 2022

Toshiba Releases New M3H Group of ARM Cortex-M3 Microcontrollers in the TXZ+TM Family Advanced Class

Tiera Oliver

April 28, 2022

On-Demand Webcast: Embedded Tutorial – Breaking barriers with new Sitara high-performance MCUs

Embedded E-cast

April 27, 2022

Defining the Right Amount of Compute Power for AI at the Edge

Flay Mohle

April 19, 2022

Edge AI Design Demands Comprehensive Development Tools

Ananda Roy

April 18, 2022

POLYN Technology Delivers NASP Test Chip for Tiny AI

Tiera Oliver

April 13, 2022

On-Demand Webcast: Embedded Tutorial – The Basics (and Solutions) of AI and Machine Learning

Embedded E-cast

April 11, 2022

FLEX LOGIX LEADS eFPGA MARKET WITH MORE THAN 17 LICENSED CUSTOMERS

Flex Logix Inc.

April 8, 2022

ADLINK’s Ampere Altra Developer Platform with Arm SystemReady Certification

Tiera Oliver

April 7, 2022

Synopsys and Microsoft Launch First Broad-Scale EDA Cloud SaaS Solution

Tiera Oliver

April 4, 2022

Analog Devices’ mmW 5G Chipset Addresses Full 5G NR FR2 Spectrum to Enable Simpler and Smaller Radios

Tiera Oliver

March 31, 2022

Product of the Week: Flex Logix InferX X1M Edge Inference Accelerator

Embedded Computing Design Staff

March 29, 2022

NVIDIA DRIVE Map, Hyperion Continues Road to Autonomous Vehicles at GTC 2022

Tiera Oliver

March 25, 2022

Long-Term Continuation of the PC/104 SBC: The VDX3-6755 Supports Full ISA, CAN Bus, Dual LAN, and Isolated Ios

Taryn Engmark

March 23, 2022

Automotive

From Design to Verification: Best Practices for Automotive Functional Safety Certification

February 5, 2026

Auto Audio Gets Upgrade with Cadence Tensilica
February 05, 2026
New Standardized Interface Targets Key Challenges in Embedded Audio Design
February 04, 2026
Embedded Editor: CES 2026 Trends Roundup
January 19, 2026
SOAFEE Blueprint: Enabling AI-Native, Offline-Resilient Vehicle Software with mimik
January 15, 2026

Tear Down: Google Pixel Watch 4

February 3, 2026

TDK Adds SmartMotion for Smart Glasses to its Custom Sensing Solutions for AI Glasses and Augmented Reality
September 30, 2025
Arm Delivers Personal AI on Consumer Devices with New Lumex CSS Platform
September 10, 2025
TDK Announces High-Performance IMU to Accelerate Optical Image Stabilization Adoption
August 08, 2025
Application Highlight: Infineon Makes HMI the Main Event
August 04, 2025

Industry Acquisitions, Connectivity, IoT, AI, and Embedded Trends For 2026

February 12, 2026

The Road to embedded world: Discover Vecow’s AI PC Revolution and Robotics Supercomputers
February 12, 2026
Virscient to Present Cutting-Edge Wireless Connectivity and Audio Technologies at embedded world Germany
February 11, 2026
The Road to embedded world: MiTAC Showcases Scalable Industrial Edge Computing Solutions for AI Workloads
February 11, 2026
IBASE IB301 AI Edge Platform Targets Real-Time Analytics and Industrial Automation
February 10, 2026

Building Trust in Embedded Systems & Smarter HMI Design

January 15, 2026

DevTalk with Rich and Vin: UI Design
January 09, 2026
Engineering Real-Time: Lessons Learned While Chasing Determinism Part 4
December 11, 2025
Secure Boot and the Manufacturing Chain: Implementation and Impact
December 09, 2025
Engineering Real-Time: Lessons Learned While Chasing Determinism Part 3
December 03, 2025

Technology - Processing - Chips & SoCs - Page 21

The Problem with the CHIPS Act, Part 2

Chips & SoCs

Imagimob Announces tinyML for Sound Event Detection Applications on Synaptics AI Chip

AIoT Open Platform for Flexible and Scalable Development

Transforming Edge AI with Clusters of Neural Processing Units

Microchip Announces First RISC-V-Based System-on-Chip FPGA Enters Mass Production

Agile Analog Receives Its First Chinese Licensee for Its Analog IP

Lattice Introduces Next-Gen Control FPGAs and New Solution Stack for ORAN Deployment

Synopsys Launches the Era of Smarter SoC Design with ML-Driven Big Data Analytics Technology

NXP Eases Industrial IoT Development with its i.MX RT Industrial Drive Development Platform

Embedded Executive: Denis Marcon, GM, Innoscience Europe

Is Moore’s Law Still Ticking?

embedded world 2022: iWave Systems

Quadric and MegaChips Form Partnership to Bring IP Products to ASIC and SoC Market

Renesas to Invest and Restart Operation of Kofu Factory as 300mm Wafer Fab Dedicated for Power Semiconductors

Siemens Collaborates with GlobalFoundries to Provide Trusted Silicon Photonics Verification

ADLINK Harnesses the Arm SystemReady-Compliant Ampere®️ Altra®️ Module, Pushing COM-HPC to New Heights

When Supply Chain Issues Reach Their Source & A Farewell to 3G

Toshiba Releases New M3H Group of ARM Cortex-M3 Microcontrollers in the TXZ+TM Family Advanced Class

Sponsored

On-Demand Webcast: Embedded Tutorial – Breaking barriers with new Sitara high-performance MCUs

Defining the Right Amount of Compute Power for AI at the Edge

Edge AI Design Demands Comprehensive Development Tools

POLYN Technology Delivers NASP Test Chip for Tiny AI

Sponsored

On-Demand Webcast: Embedded Tutorial – The Basics (and Solutions) of AI and Machine Learning

FLEX LOGIX LEADS eFPGA MARKET WITH MORE THAN 17 LICENSED CUSTOMERS

ADLINK’s Ampere Altra Developer Platform with Arm SystemReady Certification

Synopsys and Microsoft Launch First Broad-Scale EDA Cloud SaaS Solution

Analog Devices’ mmW 5G Chipset Addresses Full 5G NR FR2 Spectrum to Enable Simpler and Smaller Radios

Product of the Week: Flex Logix InferX X1M Edge Inference Accelerator

NVIDIA DRIVE Map, Hyperion Continues Road to Autonomous Vehicles at GTC 2022

Long-Term Continuation of the PC/104 SBC: The VDX3-6755 Supports Full ISA, CAN Bus, Dual LAN, and Isolated Ios

Trending Articles

Circuit Mind Study Finds AI Automation Driving Measurable Gains in Circuit Design Efficiency

The Zephyr Project Grows Membership, Highlights Security and Resilience at embedded world 2026

Auto Audio Gets Upgrade with Cadence Tensilica

STM32 OTA Firmware Update

Texas Instruments to Acquire Silicon Labs

Automotive

From Design to Verification: Best Practices for Automotive Functional Safety Certification

Consumer

Tear Down: Google Pixel Watch 4

IoT

Industry Acquisitions, Connectivity, IoT, AI, and Embedded Trends For 2026

Software & OS

Building Trust in Embedded Systems & Smarter HMI Design