Technology - Processing - Chips & SoCs
Processing - Chips & SoCs
Tria Unlocks AI and IoT Potential with Qualcomm-Powered SMARC Modules
March 28, 2025
As edge computing continues to transform with AI in the forefront, having a powerful and energy-efficient module is essential for next-generation applications. Tria's MSC SM2S-QCS6490 SMARC 2.1.1 and MSC SM2S-QCS5430 SMARC 2.1.1 modules are built with Qualcomm technology, delivering high-performance processing, AI acceleration, and extensive connectivity options. Whether for IoT, AI-driven automation, or real-time data processing, these modules are designed to handle the most demanding workloads efficiently.
Processing - Chips & SoCs
Lantronix and Teledyne FLIR Deliver Cutting-Edge AI Vision with Advanced Image Processing
March 26, 2025
Lantronix Inc. is now integrating its Open-Q System-on-Module (SoM) solutions, including hardware and software, with Teledyne FLIR’s thermal infrared (IR) camera modules and Prism embedded software. It is ideal for AI-enabled camera applications in autonomous navigation, drones, surveillance, and robotics.
Processing - Chips & SoCs
Intel, Curtiss-Wright, wolfSSL, and SYSGO Join Forces to Revolutionize Mission-Critical Systems
March 21, 2025
Intel, wolfSSL, Curtiss-Wright, and SYSGO are collaborating to develop next-generation COTS solutions that prioritize safety, security, and innovation in aerospace and industrial industries. By utilizing each company’s strengths, the partnership delivers high performance ruggedized environments that ensure compliance with safety and security standards for mission-critical applications, without requiring specific software, therefore reducing time to market.
Chips & SoCs
SYSGO Enhances Functional Safety and Performance with Intel's 13th Gen Core Processors
March 18, 2025
AMD Unveils 5th Gen AMD EPYC Embedded Processors for Networking, Storage, and Industrial Edge Markets
March 13, 2025
AI & Machine Learning
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TAITRA Confirms Jensen Huang’s COMPUTEX 2025 Keynote, Streaming Live on May 19
March 20, 2025
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Mastering FPGA Optimization: High-Speed Data Movement & AI Acceleration on AMD Versal SoCs
March 20, 2025
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Cortex-A320 CPU and Ethos-U85 NPU Set New Industry Standards
March 11, 2025
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MediaTek Unveils Genio 720 and Genio 520 IoT Platforms for Generative AI Applications
March 11, 2025
Storage
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Western Digital Powers the Future of Data with High-Capacity HDDs and RAID Systems
March 20, 2025
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The Road to embedded world: BIWIN’s Mini SSD Brings Lightning-Fast Speeds and Rugged Durability
February 25, 2025
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The Road to embedded world: Explore BIWIN’s Rugged eMMC and High-Performance LPDDR5X
February 24, 2025
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The Road to embedded world: Apacer’s CoreSnapshot Technology Revolutionizes Data Backup & Recovery for Enterprises
February 21, 2025
Networking & 5G
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Bluetooth: New Specifications and New Capabilities
March 18, 2025
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Embedded Executive: The Evolution of a Wireless Standard, LoRa Alliance
February 05, 2025
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Satellite Connectivity for Vehicles: RN941Y Module Brings Reliable Communication to Remote Areas
January 10, 2025
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Ezurio Launches BL54L10 Series - Bluetooth LE + 802.15.4 + NFC Module
November 26, 2024
Security
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The Growing Importance of Continuous Observability in the Age of Cyber Resilience
March 20, 2025
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Embedded Executive: Consider Security Far Earlier Than You Think | NXP
March 19, 2025
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embedded world Product Showcase: Tropic Square’s TROPIC01 Hardware Security Element
March 17, 2025
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Embedded Executive: Hacks Are Still Happening | Digi
March 12, 2025