Winbond’s Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Solution

Taryn Engmark

July 22, 2021

Renesas Launches R-Car Gen3e for Automotive Infotainment, Cockpit, and Digital Cluster Systems

Tiera Oliver

July 20, 2021

STMicroelectronics Eases Connected-Sensor Design with User-Friendly Workspace for BlueNRG SoCs

Chad Cox

July 14, 2021

Retrofit ATX Mainboard

ICP Germany

July 14, 2021

Texas Instruments Announces New MCU Portfolio

Tiera Oliver

July 12, 2021

An Easier, Lower Cost Path to Customizable SoCs

Jeff DiCorpo

July 8, 2021

Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets

Tiera Oliver

July 7, 2021

Embedded Executive: Jeff DiCorpo, SVP Business Development, efabless

Rich Nass

July 7, 2021

Weebit Nano Demonstrates Integration of Selector with ReRAM Cell for Stand-Alone Memory Market

Tiera Oliver

July 6, 2021

The SoC Evolution: From Early Handsets To Edge Intelligence

Asem Elshimi

June 30, 2021

Power Modeling and Estimation in Early System Design, Part 2

Deepak Shankar

June 28, 2021

New Lattice CertusPro-NX FPGAs Offer the Size, Power, and Speed Needed for Edge Applications

Rich Nass

June 28, 2021

SkyLab B.V. To Utilize Semtech’s LoRa Edge for Prototyping Board

Chad Cox

June 23, 2021

AIROC Wi-Fi & Bluetooth Combo Chip Offer Connectivity for TomTom's Satellite Navigation

Tiera Oliver

June 22, 2021

Product of the Week: Cadence Spectre FX FastSPICE Simulator

Embedded Computing Design Staff

June 22, 2021

SmartDV Joins the Xilinx Partner Program

SmartDV

June 21, 2021

Xilinx-Compliant Design IP Accessible to Xilinx Customers through Partner Program

IBM's 2 nm Transistor Breakthrough Puts Chip Design Under the Microscope

Anupurba Mukherjee

June 18, 2021

MicroSys Electronics Introduces System-on-Module with NXP S32G274A Processor

Tiera Oliver

June 15, 2021

Electronic Parts Shortage: Why the Automotive Industry Took the Worst Hit

Dan Dooley

June 15, 2021

Mythic Expands Product Lineup with Analog Matrix Processor for Edge AI Applications

Tiera Oliver

June 9, 2021

Sequans Licenses CEVA 5G Modem IP for Broadband IoT Platform

CEVA, Inc.

Sequans Communications S.A.

June 1, 2021

AI Chipmaker Hailo Partners with Lanner Electronics to Launch Next-Generation AI Inference Solutions at the Edge

Lanner Electronics

Hailo

June 1, 2021

How Flexibility, Accessibility & AI Helped Xilinx Beat 2020

Embedded Insiders

June 1, 2021

Ceva Acquires Intrinsix Corp

Chad Cox

May 27, 2021