Technology - Processing - Chips & SoCs - Page 4

A Modular Future: Chiplets, AI, and Advanced Packaging

Embedded Computing Design Staff , Embedded Insiders

February 13, 2025

Chips & SoCs

ICYMI: Embedded Insights Episode 5

Ken Briodagh

February 21, 2025

The Road to embedded world: Unlock Next-Gen Edge AI with SiMa.ai's ONE Platform

Chad Cox

February 20, 2025

Bridgetek to Launch its 5th Generation Embedded Video Engine (EVE) at embedded world 2025

Chad Cox

February 20, 2025

The Road to embedded world: Enclustra’s Latest FPGA and SoC Solutions Take Center Stage

February 19, 2025

Integrated SoC Shrinks the Size of the 4-20 mA Smart Transmitter

Franco Contadini

February 18, 2025

ESA Backs Frontgrade Gaisler in Pioneering Ultra-Deep Sub-Micron Space Chip Development

Chad Cox

February 7, 2025

EdgeCortix Inc.'s SAKURA-I AI Accelerator Demonstrates Radiation Resilience, Advancing AI-Driven Space Exploration

Chad Cox

January 30, 2025

xMEMS Releases Solid-State µCooling Chip for Thinner, Faster Mobile Tech

Embedded Computing Design Staff

January 29, 2025

Cadence Bolsters IP Portfolio with Secure-IC Acquisition, Closing Expected in 2025

Chad Cox

January 27, 2025

Product of the Week: Infineon Technologies’ PSOC™ 63 Bluetooth™ LE MCU

Embedded Computing Design Staff

January 27, 2025

What to Know When Selecting a Hardware Platform for Your Next Project

Lisandro Pérez-Meyer , Stephanie Van Ness

January 24, 2025

Toradex's New SMARC SoM Family: Reliable, Cost-Effective, and Ready for Tomorrow’s Challenges

Chad Cox

January 24, 2025

Alif Semiconductor Launches Ensemble MCUs with Ethos-U85

Chad Cox

January 23, 2025

Flex Power Modules Upgrades BMR510 with Higher Current Capacity and Simplified VRM Design

Chad Cox

January 22, 2025

Product of the Week: Infineon Technologies’ AIROC™ CYW55513 Wi-Fi and Bluetooth® Combo IC

Embedded Computing Design Staff

January 20, 2025

Pioneering Post-Quantum Security

Chad Cox

January 16, 2025

The Logitech Mevo Core 4K camera enables seamless wireless live streaming anywhere with the help of AIROC™ CYW55573 and Murata 2EA Module solution

Mei-Ling Chiang

January 13, 2025

AAEON's GAR-A750E Graphics Card: A New Era of High-Fidelity Image Rendering and Multi-Resolution Video Streams

Chad Cox

January 13, 2025

Exostiv Labs Brings Unmatched Internal Capture and Debugging to AMD Versal Adaptive SoCs

Chad Cox

January 10, 2025

Vecow ECX-4000 Series Delivers Advanced Neural Processing and Graphics Power

Chad Cox

January 9, 2025

ASRock's Intel 800 Series Motherboards for Complex Workloads

Chad Cox

January 8, 2025

NanoCOM-ADN: Compact Powerhouse for IoT and Edge Computing with 2.5GbE and PCIe 3.0 Support

Chad Cox

January 6, 2025

STMicroelectronics to boost AI at the edge with new MCU

Ken Briodagh

December 20, 2024

AAEON’s uCOM-IMX8P Debuts with 4K Display and AI Capabilities

Chad Cox

December 19, 2024

IC’Alps and SEALSQ Set New Standards for Secure Chip Development

Chad Cox

December 16, 2024

Chipping In: Europe’s Role in the Semiconductor Industry

Embedded Computing Design Staff , Embedded Insiders

December 12, 2024

IBASE IB996 CPU Card Combines Intel Core Power with Extensive I/O and Display Options

Chad Cox

December 12, 2024

Mouser Product of the Week: Intel Core Ultra Processors

Embedded Computing Design Staff

December 9, 2024

Renesas Announces Automotive Multi-Domain SoC Built with 3-nm Process Technology

Tiera Oliver

November 25, 2024

Storage

Embedded Executive: We Are In a Memory Crisis | Everspin

April 1, 2026

embedded world 2026 Podcast with Rambus
March 27, 2026
Accelerate AI Workloads with Rambus HBM4E Memory Controller
March 05, 2026
Greenliant to Demo High-Endurance Industrial SSD Portfolio at embedded world Germany 2026
March 03, 2026
The Road to embedded world: Weebit ReRAM Powers Live Edge AI Silicon Demos
February 24, 2026

Qualcomm Announces 5G-Advanced Leap with Qualcomm X105 5G Modem-RF

March 4, 2026

Ellisys and Metirionic Collaborate at embedded world to Demonstrate Bluetooth Channel Sounding Innovations
March 02, 2026
The Hidden Complexity of Bluetooth Antenna Design in Channel Sounding
March 02, 2026
Futuristic Embedded: Hospital AI, Bluetooth in Industrial, and DNA Storage
February 26, 2026
Embedded Executive: LE-UWB Touts Low Power Plus High Bandwidth | SPARK Microsystems
February 18, 2026

Sundance SMT135-C Delivers Low-Power FPGA Performance for Vision and Edge Computing

March 27, 2026

Trenz Electronic Showcases 10 New FPGA Platforms at embedded world Germany
March 26, 2026
Ultra-Low-Power Wireless SoC Integrates an NPU
March 26, 2026
embedded world 2026 Podcast with Tria Technologies
March 23, 2026
embedded world Product Showcase: Ambient Scientific’s GPX10 Pro
March 09, 2026

Axelera AI Integrates Kudelski Secure Enclave into Europa Edge AI Platform

March 27, 2026

The EU Cyber Resilience Act & Industrial Power Conversion in Data Centers
March 26, 2026
Embedded Executive: Once Again, You MUST Implement Security | Thistle Technologies
March 18, 2026
Meeting the EU Cyber Resilience Act: Kudelski Labs Highlights Future-Ready Security Solutions at embedded world
March 03, 2026
EU CRA: Guidance for Non-IP Embedded Communication Systems
February 24, 2026

Technology - Processing - Chips & SoCs - Page 4

A Modular Future: Chiplets, AI, and Advanced Packaging

Chips & SoCs

ICYMI: Embedded Insights Episode 5

The Road to embedded world: Unlock Next-Gen Edge AI with SiMa.ai's ONE Platform

Bridgetek to Launch its 5th Generation Embedded Video Engine (EVE) at embedded world 2025

The Road to embedded world: Enclustra’s Latest FPGA and SoC Solutions Take Center Stage

Integrated SoC Shrinks the Size of the 4-20 mA Smart Transmitter

ESA Backs Frontgrade Gaisler in Pioneering Ultra-Deep Sub-Micron Space Chip Development

EdgeCortix Inc.'s SAKURA-I AI Accelerator Demonstrates Radiation Resilience, Advancing AI-Driven Space Exploration

xMEMS Releases Solid-State µCooling Chip for Thinner, Faster Mobile Tech

Cadence Bolsters IP Portfolio with Secure-IC Acquisition, Closing Expected in 2025

Sponsored

Product of the Week: Infineon Technologies’ PSOC™ 63 Bluetooth™ LE MCU

What to Know When Selecting a Hardware Platform for Your Next Project

Toradex's New SMARC SoM Family: Reliable, Cost-Effective, and Ready for Tomorrow’s Challenges

Alif Semiconductor Launches Ensemble MCUs with Ethos-U85

Flex Power Modules Upgrades BMR510 with Higher Current Capacity and Simplified VRM Design

Sponsored

Product of the Week: Infineon Technologies’ AIROC™ CYW55513 Wi-Fi and Bluetooth® Combo IC

Pioneering Post-Quantum Security

Sponsored

The Logitech Mevo Core 4K camera enables seamless wireless live streaming anywhere with the help of AIROC™ CYW55573 and Murata 2EA Module solution

AAEON's GAR-A750E Graphics Card: A New Era of High-Fidelity Image Rendering and Multi-Resolution Video Streams

Exostiv Labs Brings Unmatched Internal Capture and Debugging to AMD Versal Adaptive SoCs

Vecow ECX-4000 Series Delivers Advanced Neural Processing and Graphics Power

ASRock's Intel 800 Series Motherboards for Complex Workloads

NanoCOM-ADN: Compact Powerhouse for IoT and Edge Computing with 2.5GbE and PCIe 3.0 Support

STMicroelectronics to boost AI at the edge with new MCU

AAEON’s uCOM-IMX8P Debuts with 4K Display and AI Capabilities

IC’Alps and SEALSQ Set New Standards for Secure Chip Development

Chipping In: Europe’s Role in the Semiconductor Industry

IBASE IB996 CPU Card Combines Intel Core Power with Extensive I/O and Display Options

Sponsored

Mouser Product of the Week: Intel Core Ultra Processors

Renesas Announces Automotive Multi-Domain SoC Built with 3-nm Process Technology

Trending Articles

ISO 8800 Is Coming to Your Next Platform Program — Are You Ready?

Sundance SMT135-C Delivers Low-Power FPGA Performance for Vision and Edge Computing

Trenz Electronic Showcases 10 New FPGA Platforms at embedded world Germany

embedded world 2026 Podcast with Axelera AI

Embedded Executive: Dealing With the Massive Power Draw in Data Centers | Infineon

Storage

Embedded Executive: We Are In a Memory Crisis | Everspin

Networking & 5G

Qualcomm Announces 5G-Advanced Leap with Qualcomm X105 5G Modem-RF

Processing

Sundance SMT135-C Delivers Low-Power FPGA Performance for Vision and Edge Computing

Security

Axelera AI Integrates Kudelski Secure Enclave into Europa Edge AI Platform