eYs3D Microelectronics Raises $7 Million Series A from Industry Strategic Investors for Vision/AI Chips

Tiera Oliver

May 26, 2021

IAR Systems Boosts Development of Embedded Applications Based on NXP’s i.MX RT1160 Crossover MCUs

IAR Systems

May 20, 2021

SEMIFIVE Collaborates with Arm to Accelerate its Custom SoC Designs

Tiera Oliver

May 19, 2021

u-blox NINA-B4 Bluetooth 5.1 Module Enables Mesh Networking for IoT Applications

Tiera Oliver

May 18, 2021

Sondrel Reference IP Enables HPC SoCs While Reducing Cost and Design Time by 30 Percent

Brandon Lewis

May 18, 2021

Sondrel has added the SFA 300 reference design to its semi-custom SoC IP portfolio. Consisting of four-CPU clusters featuring 4 TOPS per channel of AI processing and 400 GOPS per channel of DSP performance, clusters can be daisy chained via the PCIe interface to create HPC solutions. The IP reuse solution enables the creation of differentiated AI, 8K video, blockchain, data analytics, and other high-performance data processing solutions by integrating customer-specific IP such that design time and cost can be reduced by up to 30 percent.

Dante Embedded Platform SDK for SHARC Audio DSPs Benefits AV-over-IP Developers

Brandon Lewis

May 14, 2021

Applied Materials Introduces New Materials to Advance DRAM Technology

Rich Nass

May 10, 2021

IAR Systems Enables Scalable Automotive Development Based on Infineon Traveo II Including MCAL

Tiera Oliver

May 5, 2021

Product of the Week: Texas Instruments' Sitara AM6442 Real-Time Networked Processor

Embedded Computing Design Staff

May 4, 2021

Chenbro Announces Chassis Reference Motherboard Program for Intel Ice Lake Processor Platform with Ma Labs

Chenbro

Ma Labs

May 4, 2021

Taipei, Taiwan — Chenbro (TWSE: 8210) announced its reference motherboard program, launching in collaboration with Ma Labs (USA), which will provide pre-tested 3 rd Generation Intel Xeon Scalable (codename ‘Ice Lake’) server barebone solutions for the North American market.

Logic Design Solutions Introduces the First NVMe HOST IP on POLARFIRE SoC FPGA

Tiera Oliver

May 4, 2021

The GENE-CML5 3.5" Subcompact Board From AAEON Offers Functionality to Support Industrial and AI Applications

Tiera Oliver

April 27, 2021

IoT Security and the Protection of IP at the Edge

Jake Schaffner

April 26, 2021

DEV KIT WEEKLY: Maxim Integrated Health Sensor Platform 3.0 Kit

Brandon Lewis

April 23, 2021

This isn’t the first Maxim Integrated development kit we’ve reviewed on Dev Kit Weekly, nor the first one that focuses on the healthcare sector. Back in 2019, we took a look at the company’s MAX86150EVSYS kit that targets mobile heart rate monitoring using ECG and PPG sensors. The Health Sensor Platform 3.0 takes that concept into a wearable form factor that integrates those same sensors, as well as a skin temperature sensor, that make it an ideal starting point for those of you developing personal fitness devices, patient health monitors, and so on.

aicas GmbH, SiFive Collaborate to Integrate RISC-V CPU architecture, JamaicaVM Java-Based Software Management

Perry Cohen

April 19, 2021

Renesas Strengthens RL78 Family of Low-Power MCUs with 16-Bit General-Purpose RL78/G23

Tiera Oliver

April 19, 2021

TQMLX2160A: the highspeed giant by TQ

TQ-Group

NXP Semiconductors

April 19, 2021

Embedded Cortex®-A72 module based on LX2160A with enhanced data and networking performance.

Industry High 98% Efficiency Demonstrated by AImotive and Nextchip

Tiera Oliver

April 19, 2021

Edge Management: The Next Big IoT Challenge

James White

April 19, 2021

Techniques to Improve UX for Success in Embedded Markets

Jason Clarke

April 16, 2021

STMicro Using OctaBus Flash Memory from Macronix

Perry Cohen

April 15, 2021

Embedded Systems: The Big Picture

Ian Ferguson

April 14, 2021

Accelerate AI Applications Using VITIS AI on Xilinx ZynqMP UltraScale+ FPGA

Vaibhav Kothari

April 13, 2021

Automotive-Grade MEMS Mics Raise the Standard for In-Cabin Audio

Rich Nass

April 12, 2021